Package for holding IC chip

Claim 2

A package for holding an IC chip, said package comprising: IC chip supporting means; a lead frame having a pattern of leads extending outwardly from a central region thereof; and a ceramic relay substrate provided with a metallized wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame, said ceramic relay substrate and metallized wiring being disposed between the IC chip supporting means and the leads of the lead frame; wherein portions of the metallized wiring pattern near the IC chip as supported on the IC chip supporting means are exposed on the surface of the ceramic relay substrate to form inner leads electrically connected to the IC chip, and wherein portions of the wiring pattern in the periphery of the relay substrate adjacent to the leads of the lead frame are exposed on the surface of the ceramic relay substrate to form outer leads electrically connected to the leads of the lead frame.

Claim 3

The package for holding an IC chip according to claim 1, wherein portions of the metallized wiring pattern forming the inner leads and the outer leads are arranged in at least one of a single layer and a plurality of layers of the ceramic relay substrate.

Claim 4

The package for holding an IC chip according to claim 1, wherein the ceramic relay substrate is mounted on a central portion of the lead frame, and wherein a portion of the ceramic relay substrate mounted on the central portion of the lead frame serves as the IC chip supporting means.

Claim 5

The package for holding an IC chip according to claim 1, wherein the ceramic relay substrate is provided with a cavity, a bottom wall of the cavity serving as the IC chip supporting means.

Claim 6

A package for holding an IC chip said package comprising: IC chip supporting means; a lead frame having a pattern of leads extending outwardly from a central region thereof; and a ceramic relay substrate disposed between the IC chip supporting means and the leads of the lead frame; wherein the ceramic relay substrate is formed by at least one of (A) a printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on a ceramic green tape and subjecting the ceramic green tape provided with the printed wiring pattern to firing in order to sinter the ceramic green tape and form a metallized wiring pattern, and (B) a printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on each of a plurality of ceramic green tapes, superposing the plurality of ceramic green tapes provided with the printed wiring patterns to form a laminated green tape, and subjecting the laminated green tape provided with the plurality of wiring patterns to firing to sinter the laminated green tape and to form layered metallized wiring patterns; wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns near the IC chip supported on the IC chip supporting means are exposed on the surface of the ceramic relay substrate to form inner leads electrically connected to the IC chip, and wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns at the periphery of the ceramic relay substrate adjacent to the leads of the lead frame are exposed on the surface of the ceramic relay substrate to form outer leads electrically connected to the leads of the lead frame.

Claim 7

A package for holding an IC chip said package comprising: IC chip supporting means; a lead frame having a pattern of leads extending outwardly from a central region thereof; and a ceramic relay substrate disposed between the IC chip supporting means and the leads of the lead frame; wherein the ceramic relay substrate is formed by at least one of (A) a printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on a ceramic green tape and subjecting the ceramic green tape provided with the printed wiring pattern to firing in order to sinter the ceramic green tape and form a metallized wiring pattern, and (B) a printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on each of a plurality of ceramic green tapes, superposing the plurality of ceramic green tapes provided with the printed wiring patterns to form a laminated green tape, and subjecting the laminated green tape provided with the plurality of wiring patterns to firing to sinter the laminated green tape and to form layered metallized wiring patterns; wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns near the IC chip supported on the IC chip supporting means are exposed on the surface of the ceramic relay substrate to form inner leads electrically connected to the IC chip, and wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns at the periphery of the ceramic relay substrate adjacent to the leads of the lead frame are exposed on the surface of the ceramic relay substrate to form outer leads electrically connected to the leads of the lead frame.

Claim 8

The package for holding an IC chip according to claim 5, wherein portions of the metallized wiring pattern forming the inner leads and the outer leads are arranged in at least one of a single layer and a plurality of layers of the ceramic relay substrate.

Claim 9

The package for holding an IC chip according to claim 5, wherein the ceramic relay substrate is mounted on a central portion of the lead frame, and wherein a portion of the ceramic relay substrate mounted on the central portion of the lead frame serves as the IC chip supporting means.

Claim 10

The package for holding an IC chip according to claim 5, wherein the ceramic relay substrate is provided with a cavity, a bottom wall of the cavity serving as the IC chip supporting means.

Claim 11

A resin encapsulated package, said package comprising: IC chip supporting means; a lead frame having a pattern of leads extending outwardly from a central region thereof; and a ceramic relay substrate disposed between the IC chip supporting means and the leads of the lead frame; wherein the ceramic relay substrate is formed by at least one of (A) a printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on a ceramic green tape and subjecting the ceramic green tape provided with the printed wiring pattern to firing in order to sinter the ceramic green tape and form a metallized wiring pattern, and (B) printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on each of a plurality of the ceramic green tapes, superposing the plurality of ceramic green tapes provided with the printed wiring patterns to form laminated green tapes, and subjecting the laminated green tapes provided with the plurality of wiring patterns to firing in order to sinter the laminated green tapes and form layered metallized wiring patterns; wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns near the IC chip supported on the IC chip supporting means are exposed on the surface of the ceramic relay substrate to form inner leads electrically connected to the IC chip; wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns in the periphery of the ceramic relay substrate adjacent to the leads of the lead frame are exposed on the surface of the ceramic relay substrate to form outer leads electrically connected to the leads of the lead frame; and wherein part of the lead frame, the IC chip and the ceramic relay substrate are sealed in a resin molding.

Claim 12

A resin encapsulated package, said package comprising: IC chip supporting means; a lead frame having a pattern of leads extending outwardly from a central region thereof; and a ceramic relay substrate disposed between the IC chip supporting means and the leads of the lead frame; wherein the ceramic relay substrate is formed by at least one of (A) a printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on a ceramic green tape and subjecting the ceramic green tape provided with the printed wiring pattern to firing in order to sinter the ceramic green tape and form a metallized wiring pattern, and (B) printing of a metal paste in a wiring pattern extending outwardly from a central region thereof and corresponding to the pattern of leads of the lead frame on each of a plurality of the ceramic green tapes, superposing the plurality of ceramic green tapes provided with the printed wiring patterns to form laminated green tapes, and subjecting the laminated green tapes provided with the plurality of wiring patterns to firing in order to sinter the laminated green tapes and form layered metallized wiring patterns; wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns near the IC chip supported on the IC chip supporting means are exposed on the surface of the ceramic relay substrate to form inner leads electrically connected to the IC chip; wherein at least one of (A) portions of the metallized wiring pattern and (B) portions of the metallized wiring patterns in the periphery of the ceramic relay substrate adjacent to the leads of the lead frame are exposed on the surface of the ceramic relay substrate to form outer leads electrically connected to the leads of the lead frame; and wherein part of the lead frame, the IC chip and the ceramic relay substrate are sealed in a resin molding.

Claim 13

The resin encapsulated package according to claim 9, wherein portions of the metallized wiring pattern forming the inner leads and the outer leads are arranged in at least one of a single layer and a plurality of layers of the ceramic relay substrate.

Claim 14

The resin encapsulated package according to claim 9, wherein the ceramic relay substrate is mounted on a central portion of the lead frame, and wherein a portion of the ceramic relay substrate mounted on the central portion of the lead frame serves as the IC chip supporting means.

Claim 15

The resin encapsulated package according to claim 9, wherein the ceramic relay substrate is provided with a cavity in the central area of its surface, a bottom wall of the cavity serving as the IC chip supporting means.

Claim 16

The package for holding an IC chip according to claim 1, wherein the ceramic relay substrate is polygonally-shaped and outer ends of the metallized wiring terminate adjacent leads of the lead frame.

Claim 17

The package for holding an IC chip according to claim 4, wherein the bottom wall is a central portion of the lead frame.

Claim 18

The package for holding an IC chip according to claim 4, wherein the bottom wall is a central portion of the ceramic relay substrate.

Claim 19

The package for holding an IC chip according to claim 5, wherein the ceramic relay substrate is polygonally-shaped and outer ends of the metallized wiring terminate adjacent leads of the lead frame.

Claim 20

The package for holding an IC chip according to claim 8, wherein the bottom wall is a central portion of the lead frame.

Claim 21

The package for holding an IC chip according to claim 8, wherein the bottom wall is a central portion of the ceramic relay substrate.

Claim 22

The resin encapsulated package according to claim 9, wherein the ceramic relay substrate is polygonally-shaped and outer ends of the metallized wiring terminate adjacent the leads of the lead frame.

Claim 23

The resin encapsulated package according to claim 12, wherein the bottom wall is a central portion of the lead frame.

Claim 24

The resin encapsulated package according to claim 12, wherein the bottom wall is a central portion of the ceramic relay substrate.