Hot press for use in production of multilayered substrate

Claim 2

A hot press for producing a multilayered substrate, comprising: upper and lower bolsters which are arranged to vertically oppose each other and to be movable relative to and toward each other to press multilayered substrate blanks therebetween; a main ram for imparting relative movement between said upper and lower bolsters to produce a pressing force; upper and lower heat plates which are provided on said upper and lower bolsters through heat insulating plates respectively; heating and cooling means for heating said upper and lower heat plates during bonding of said multilayered substrate blanks and for cooling said plates after the bonding; sealing means including a cylindrical member and defining a hermetically sealed space of variable volume in cooperation with said upper and lower bolsters; evacuating means for evacuating said hermetically sealed space to reduce the pressure therein during a heating and pressing operation, performed by said heating and cooling means and by said main ram, for softening a bonding agent for said multilayered substrate blanks; gas supplying means for supplying gas into said hermetically sealed space to elevate the pressure in said space, thereby imparting a bonding pressure to said multilayered substrate blanks during the bonding; pressure sensing means for sensing the pressure inside said hermetically sealed space; and control means for effecting pressure compensation by controlling pressure of a hydraulic pressure source to be supplied to said main ram in accordance with outputs from said pressure sensing means so as to cancel an increment in the bonding pressure on said blanks, when the pressure in said hermetically sealed space is reduced by said evacuating means, and to cancel a decrement in the bonding pressure on said blanks when the pressure in said space is elevated by said gas supplying means.

Claim 3

A hot press according to claim 1, wherein said control means includes a computer means which computes said increment in the bonding pressure as a product (P 1 ×πD 2 /4) of the pressure P 1 inside said hermetically sealed space and an area πD 2 /4 determined by the inside diameter D of said cylindrical member defining said hermetically sealed space, and also computes said decrement in the bonding pressure as a product of the pressure P 2 inside said hermetically sealed space and a value (πD 2 /4-L 1 ×L 2 ) obtained by subtracting the area (L 1 ×L 2 ) of the multilayered substrate from the area πD 2 /4 determined by said cylindrical member inside diameter D. pressure over said multilayered substrate blanks attributable to a warp of each bolster during the bonding.

Claim 4

A hot press according to claim 1, further comprising an one intermediate heat plate disposed between said upper and lower heat plates and lifting means for lifting and lowering said intermediate heat plate.

Claim 5

A hot press for producing a multilayered substrate, comprising: upper and lower bolsters arranged to vertically oppose each other and to be movable relative to and toward each other to press multilayered substrate blanks therebetween; a main ram for imparting relative movement between said upper and lower bolsters to produce a pressing force; upper and lower heat plates provided on said upper and lower bolsters through heat insulating plates, respectively; heating and cooling means for heating said upper and lower heat plates during bonding of said multilayered substrate blanks and for cooling said plates after bonding; sealing means including a cylinder and defining a hermetically sealed space in cooperation with said upper and lower bolsters; evacuating means for evacuating said hermetically sealed space to reduce the pressure therein during a heating and pressing operation, performed by said heating and cooling means and by said main ram, for softening a bonding agent for said multilayered substrate blanks; gas supplying means for supplying gas into said hermetically sealed space to elevate the pressure in said space, thereby imparting a bonding pressure to said multilayered substrate blanks during the bonding; pressure sensing means for sensing the pressure inside said hermetically sealed space; control means for effecting pressure compensation by controlling pressure of a hydraulic pressure source to be supplied to said main ram in accordance with outputs from said pressure sensing means so as to cancel an increment in the bonding pressure on said multilayered substrate blanks when the pressure in said hermetically sealed space is reduced by said evacuating means, and to cancel a decrement in the bonding pressure on said multilayered substrate blanks when the pressure in said hermetically sealed space is elevated by said gas supplying means; and an auxiliary ram provided on at least one of said upper and lower bolsters and capable of effecting compensation for non-uniform distribution of the bonding pressure to said multilayered substrate blanks attributable to warpage of at least one of said bolsters during the bonding.

Claim 6

A hot press for producing a multilayered substrate, comprising: upper and lower bolsters arranged to vertically oppose each other and to be movable relative to and toward each other to press multilayered substrate blanks therebetween; a main ram for imparting relative movement between said upper and lower bolsters to produce a pressing force; upper and lower heat plates provided on said upper and lower bolsters through heat insulating plates, respectively; heating and cooling means for heating said upper and lower heat plates during bonding of said multilayered substrate blanks and for cooling said plates after bonding; sealing means including a cylinder and defining a hermetically sealed space in cooperation with said upper and lower bolsters; evacuating means for evacuating said hermetically sealed space to reduce the pressure therein during a heating and pressing operation, performed by said heating and cooling means and by said main ram, for softening a bonding agent for said multilayered substrate blanks; gas supplying means for supplying gas into said hermetically sealed space to elevate the pressure in said space, thereby imparting a bonding pressure to said multilayered substrate blanks during the bonding; pressure sensing means for sensing the pressure inside said hermetically sealed space; control means for effecting pressure compensation by controlling pressure of a hydraulic pressure source to be supplied to said main ram in accordance with outputs from said pressure sensing means so as to cancel an increment in the bonding pressure on said multilayered substrate blanks when the pressure in said hermetically sealed space is reduced by said evacuating means, and to cancel a decrement in the bonding pressure on said multilayered substrate blanks when the pressure in said hermetically sealed space is elevated by said gas supplying means; and an auxiliary ram provided on at least one of said upper and lower bolsters and capable of effecting compensation for non-uniform distribution of the bonding pressure to said multilayered substrate blanks attributable to warpage of at least one of said bolsters during the bonding.

Claim 7

A hot press according to claim 3, further including an intermediate heat plate disposed between said upper and lower heat plates and lifting means for lifting and lowering said intermediate heat plate.