US5479694A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for mounting integrated circuits onto printed circuit boards and testing
Assignee: Micron Technology Inc
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Filing: 1993-04-13
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Granted: 1996-01-02
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Expires: 2013-04-13
Abstract
Abstract An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.
Inventors
- 👤 Donald D. Baldwin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 12:07
CPC Classifications
B; B23; B23K; B23K31/00; B23K31/12; B23K1/00; B23K1/0008; B23K1/0016; B23K3/00; B23K3/08; B23K3/087; B23Q; B23Q3/00; B23Q3/15; B23Q3/154; B23Q3/1546; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/32; H05K3/325; B23K2101/00; B23K2101/36; B23K2101/40; B23K2101/42; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/10; H05K2203/104; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K2203/16; H05K2203/162; H05K3/34; H05K3/341; H05K3/3421; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49133; Y10T29/49144; Y10T29/49155; Y10T29/53; Y10T29/53039; Y10T29/53061; Y10T29/53083; Y10T29/5313; Y10T29/53174; Y10T29/53183; Y10T29/53196
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
162 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps: providing a PCB having an upper surface; providing magnetic material within the IC device; inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB in such a manner that the conductive portions of the IC device are in alignment with the corresponding bonding sites; testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field; and after said testing, soldering the conductive bonding portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.
Claim 2
Independent Claim
162 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps: providing a PCB having an upper surface; providing magnetic material within the IC device; inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB in such a manner that the conductive portions of the IC device are in alignment with the corresponding bonding sites; testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field; and after said testing, soldering the conductive bonding portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.
Claim 3
Dependent Claim
59 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 1 wherein: the IC device comprises a semiconductor integrated circuit chip having a plurality of conductive bonding pads which form the conductive bonding portions; and the method further comprising providing a layer of magnetic material within the semiconductor integrated circuit chip.
Claim 4
Dependent Claim
78 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 1 wherein: the IC device comprises an IC package consisting of a semiconductor integrated circuit chip encapsulated in a casing and a lead frame electrically coupled to the semiconductor integrated circuit chip, the lead frame having a plurality of conductive leads which form the conductive bonding portions; and the process further comprising forming the lead frame of a magnetic material.
Claim 5
Dependent Claim
34 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 1 wherein the magnetic material is selected from a group consisting of iron, nickel, and cobalt.
Claim 6
Independent Claim
175 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps: providing a PCB having an upper surface; providing magnetic material within the IC device; moving the IC device to the PCB; aligning the conductive portions of the IC device with the corresponding bonding sites of the PCB; placing the conductive portions in contact with the corresponding bonding sites; inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB; testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field; and after said testing, soldering the conductive portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.
Claim 7
Independent Claim
175 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps: providing a PCB having an upper surface; providing magnetic material within the IC device; moving the IC device to the PCB; aligning the conductive portions of the IC device with the corresponding bonding sites of the PCB; placing the conductive portions in contact with the corresponding bonding sites; inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB; testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field; and after said testing, soldering the conductive portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.
Claim 8
Dependent Claim
58 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 wherein: the IC device comprises a semiconductor integrated circuit chip having a plurality of bonding pads which form the conductive bonding portions; and the method further comprising providing a layer of magnetic material within the semiconductor integrated circuit chip.
Claim 9
Dependent Claim
78 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 wherein: the IC device comprises an IC package consisting of a semiconductor integrated circuit chip encapsulated in a casing and a lead frame electrically coupled to the semiconductor integrated circuit chip, the lead frame having a plurality of conductive leads which form the conductive bonding portions; and the process further comprising forming the lead frame of a magnetic material.
Claim 10
Dependent Claim
94 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 further comprising: moving the IC device using a transfer mechanism having a handling instrument, the handling instrument having a surface; creating a magnetic field to attract the IC device to the surface of the handling instrument; maintaining the magnetic field to transfer the IC device to the PCB and to align the conductive portions with the bonding sites; and ceasing to create the magnetic field after the conductive portions are aligned with the bonding sites.
Claim 11
Dependent Claim
126 words
A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 further comprising: providing a layer of magnetic material in the PCB; moving the IC device using a transfer mechanism having a handling instrument, the handling instrument having a surface; creating a magnetic field to attract the IC device to the surface of the handling instrument; maintaining the magnetic field to transfer the IC device to the PCB and to align the conductive portions with the bonding sites; ceasing to create the magnetic field after the conductive portions are aligned with the bonding sites; and magnetically charging the PCB layer to attract the magnetic material in the IC device and to hold the IC device onto the PCB.
References Cited (Backward Citations)
US3937386A
Cited
US4620663A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-01 | 1999-07-03 | 2000-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-01 | 2003-07-03 | 2004-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-01 | 2007-07-03 | 2008-01-02 | $7700.00 | Window Closed / Lapsed |