US5479138A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layer wiring board
Assignee: Niterra Co Ltd
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Filing: 1994-12-27
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Granted: 1995-12-26
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Expires: 2014-12-27
Abstract
Abstract In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, ≦25.98×Rx -0 .3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)} 2 ×100.
Inventors
- 👤 Masao Kuroda
- 👤 Sotaro Tsukamoto
- 👤 Susumu Wakamatsu
- 👤 Ryuji Imai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:42
CPC Classifications
H; H01; H01P; H01P3/00; H01P3/02; H01P3/08; H01P3/088; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/025; H05K1/0253; H05K1/0216; H05K1/0218; H05K1/0224; H05K1/0296; H05K1/0298; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09681; H05K3/00; H05K3/0005
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
100 words
A multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, characterized in that said grounding conductor wiring is in the form of a grid and that an open area ratio Rx [%]of said grid and a line width ratio Ry=Wg/WS have a relationship expressed by Ry≦25.98×Rx.sup.-0.3871 -4.370 where Wg is the line width of said grounding conductor wiring, Sg is the width of an opening of said grid, Ws is the line width of said signal circuit wiring, and Rx={sg/(wg+sg)} 2 ×100.
Claim 2
Dependent Claim
100 words
A multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, characterized in that said grounding conductor wiring is in the form of a grid and that an open area ratio Rx [%]of said grid and a line width ratio Ry=Wg/WS have a relationship expressed by Ry≦25.98×Rx.sup.-0.3871 -4.370 where Wg is the line width of said grounding conductor wiring, Sg is the width of an opening of said grid, Ws is the line width of said signal circuit wiring, and Rx={sg/(wg+sg)} 2 ×100.
Claim 3
Dependent Claim
81 words
A multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, characterized in that said grounding conductor wiring is in the form of a grid and that the line width Ws of said signal circuit wiring is expressed by Ws≧Wg/ {4.370×[Sg/(Wg+Sg)].sup.-0.7742 -4.370} where Wg is the line width of said grounding conductor wiring and Sg is the width of an opening of said grid.
Claim 4
Dependent Claim
81 words
A multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, characterized in that said grounding conductor wiring is in the form of a grid and that the line width Ws of said signal circuit wiring is expressed by Ws≧Wg/ {4.370×[Sg/(Wg+Sg)].sup.-0.7742 -4.370} where Wg is the line width of said grounding conductor wiring and Sg is the width of an opening of said grid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-25 | 1999-06-26 | 1999-12-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-25 | 2003-06-26 | 2003-12-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-25 | 2007-06-26 | 2007-12-26 | $7700.00 | Window Closed / Lapsed |