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US5458755A Expired / Lapsed US ⏱️ 0.0 years remaining

Anodization apparatus with supporting device for substrate to be treated

Assignee: Canon Inc
•
Filing: 1993-11-08
•
Granted: 1995-10-17
•
Expires: 2013-11-08
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Abstract

Abstract An anodization apparatus for anodizing the surface of a semiconductor substrate by supporting the semiconductor substrate between a pair of electrodes in an electrolytic solution and applying a voltage across the pair of electrodes. The anodization apparatus includes an elastic sealing member for supporting a peripheral portion of the semiconductor substrate such that a surface portion of a semiconductor substrate remains exposed, a support jig which includes a tapered hollow portion for supporting the sealing member, and a device for introducing a fluid of gas or liquid into the tapered hollow portion. When the fluid is introduced, the sealing member is pressed against and brought into hermetic contact with the tapered hollow portion and with the entire peripheral portion of the semiconductor substrate such that the electrolytic solution is separated into electrically isolated parts by coordination between the semiconductor substrate, the sealing member, and the support jig. Anodization of the semiconductor substrate may then be carried out, such as by producing a porous silicon layer on the surface of the semiconductor substrate.

Inventors

  • 👤 Yasutomo Fujiyama
  • 👤 Mitsuhiro Ishii
  • 👤 Senju Kanbe
  • 👤 Takao Yonehara
  • 👤 Toru Takisawa
  • 👤 Akira Okita
  • 👤 Kiyofumi Sakaguchi
  • 👤 Takanori Watanabe
  • 👤 Kazuo Kokumai

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 12:23
CPC Classifications
C; C25; C25D; C25D11/00; C25D11/02; C25D11/32; C25D11/005; C25D17/00; C25D17/004; C25D17/06; C25D5/00; C25D5/02; C25D5/022

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 148 words
An anodization apparatus for anodizing the surface of a semiconductor substrate by supporting the semiconductor substrate between a pair of electrodes in an electrolytic solution and applying a voltage across the pair of electrodes, said anodization apparatus comprising: an elastic sealing member for supporting a peripheral portion of the semiconductor substrate such that a surface portion of the semiconductor substrate remains exposed; a substrate support jig which includes a tapered hollow portion for supporting said sealing member; and means for introducing a fluid of gas or liquid into the tapered hollow portion so that said sealing member is pressed against and brought into hermetic contact with the tapered hollow portion and with the entire peripheral portion of the semiconductor substrate by the pressure of the fluid, whereby the electrolytic solution is separated into electrically isolated parts by the semiconductor substrate, said sealing member, and said substrate support jig.
Claim 2
Dependent Claim 148 words
An anodization apparatus for anodizing the surface of a semiconductor substrate by supporting the semiconductor substrate between a pair of electrodes in an electrolytic solution and applying a voltage across the pair of electrodes, said anodization apparatus comprising: an elastic sealing member for supporting a peripheral portion of the semiconductor substrate such that a surface portion of the semiconductor substrate remains exposed; a substrate support jig which includes a tapered hollow portion for supporting said sealing member; and means for introducing a fluid of gas or liquid into the tapered hollow portion so that said sealing member is pressed against and brought into hermetic contact with the tapered hollow portion and with the entire peripheral portion of the semiconductor substrate by the pressure of the fluid, whereby the electrolytic solution is separated into electrically isolated parts by the semiconductor substrate, said sealing member, and said substrate support jig.
Claim 3
Dependent Claim 16 words
The anodization apparatus according to claim 1, wherein said sealing member is an integrally formed member.
Claim 4
Dependent Claim 13 words
The anodization apparatus according to claim 1, wherein the electrolytic solution is circulated.
Claim 5
Dependent Claim 16 words
The anodization apparatus according to claim 3, wherein the electrolytic solution is circulated by a pump.
Claim 6
Dependent Claim 22 words
The anodization apparatus according to claim 3, wherein the electrolytic solution is arranged to overflow a tank which houses the electrolytic solution.
Claim 7
Dependent Claim 16 words
The anodization apparatus according to claim 3, wherein the electrolytic solution is circulated through a filter.
Claim 8
Dependent Claim 26 words
The anodization apparatus according to claim 1, wherein the electrolytic solution is arranged to flow in a direction parallel to the surface of the semiconductor substrate.
Claim 9
Dependent Claim 20 words
The anodization apparatus according to claim 1, further comprising a conductive bulkhead provided between an electrode and the semiconductor substrate.

References Cited (Backward Citations)

US2737488A Cited
US2801965A Cited
FR1183754A Cited
US3536603A Cited
US3720595A Cited
US3835017A Cited
CH578054A5 Cited
FR2315028A1 Cited
US4430179A Cited
US4605483A Cited
US4849084A Cited
US4898653A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-10-16 1999-04-17 1999-10-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-10-16 2003-04-17 2003-10-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-10-16 2007-04-17 2007-10-17 $7700.00 Window Closed / Lapsed

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