US5455393A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayered printed wiring board and method of manufacturing the same
Assignee: NEC Toppan Circuit Solutions Toyama Inc
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Filing: 1993-11-30
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Granted: 1995-10-03
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Expires: 2013-11-30
Abstract
Abstract A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.
Inventors
- 👤 Tutomu Ohshima
- 👤 Hidebumi Ohnuki
- 👤 Ryo Maniwa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 14:09
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/0221; H05K1/11; H05K1/111; H05K1/112; H05K3/00; H05K3/46; H05K3/4644; H05K3/465; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2201/09654; H05K2201/09745; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
156 words
A multilayered printed wiring board comprising: a plurality of inner layer circuits arranged parallel to each other in a flat manner in at least one inner layer; ground layers formed on and under said inner layer circuits to sandwich said inner layer circuits; first insulating layers respectively formed between said ground layers and said inner layer circuits to insulate said inner layer circuits from each other and said inner layer circuits from said ground layers; a second insulating layer formed at least on an uppermost one of said ground layers and serving as a surface layer, said second insulating layer having a via hole at a predetermined region thereon; a surface layer circuit selectively formed on said second insulating layer; and a parts mounting pad, formed in said via holes of said second insulating layer, having a recessed portion for fitting a lead portion of a mounting part therein, and connected to said surface layer circuit.
Claim 2
Dependent Claim
156 words
A multilayered printed wiring board comprising: a plurality of inner layer circuits arranged parallel to each other in a flat manner in at least one inner layer; ground layers formed on and under said inner layer circuits to sandwich said inner layer circuits; first insulating layers respectively formed between said ground layers and said inner layer circuits to insulate said inner layer circuits from each other and said inner layer circuits from said ground layers; a second insulating layer formed at least on an uppermost one of said ground layers and serving as a surface layer, said second insulating layer having a via hole at a predetermined region thereon; a surface layer circuit selectively formed on said second insulating layer; and a parts mounting pad, formed in said via holes of said second insulating layer, having a recessed portion for fitting a lead portion of a mounting part therein, and connected to said surface layer circuit.
Claim 3
Dependent Claim
46 words
A board according to claim 1, further comprising a solder filled, in an amount required for soldering, in the recessed portion of said parts mounting pad by a hot air leveler, said solder soldering the lead portion of the mounting part to said parts mounting pad.
Claim 4
Dependent Claim
50 words
A board according to claim 1, further comprising side walls comprising conductive metal connecting said ground layers with each other through said first and second insulating layers, said side walls being disposed between adjacent ones of said inner layer circuits, thereby electrically shielding said inner layer circuits from each other.
Claim 5
Dependent Claim
150 words
A multilayered printed wiring board comprising: a plurality of inner layer circuits arranged parallel to each other in a flat manner in at least one inner layer; ground layers formed on and under said inner layer circuits to sandwich said inner layer circuits; first insulating layers respectively formed between said ground layers and said inner layer circuits to insulate said inner layer circuits from each other and said inner layer circuits from said ground layers; a second insulating layer formed at least on an uppermost one of said ground layers and serving as a surface layer; a surface layer circuit selectively formed on said second insulating layer; and side walls comprising conductive metal connecting said ground layers with each other through said first and second insulating layers, said side walls being disposed between adjacent ones of said inner layer circuits, thereby electrically shielding said inner layer circuits from each other.
Claim 6
Dependent Claim
150 words
A multilayered printed wiring board comprising: a plurality of inner layer circuits arranged parallel to each other in a flat manner in at least one inner layer; ground layers formed on and under said inner layer circuits to sandwich said inner layer circuits; first insulating layers respectively formed between said ground layers and said inner layer circuits to insulate said inner layer circuits from each other and said inner layer circuits from said ground layers; a second insulating layer formed at least on an uppermost one of said ground layers and serving as a surface layer; a surface layer circuit selectively formed on said second insulating layer; and side walls comprising conductive metal connecting said ground layers with each other through said first and second insulating layers, said side walls being disposed between adjacent ones of said inner layer circuits, thereby electrically shielding said inner layer circuits from each other.
Claim 7
Dependent Claim
22 words
A board according to claim 1 wherein said inner layer circuits are 80 μm wide and have a pitch of 400 μm.
Claim 8
Dependent Claim
22 words
A board according to claim 4 wherein said inner layer circuits are 80 μm wide and have a pitch of 400 μm.
Claim 9
Dependent Claim
25 words
A board according to claim 3 wherein said side walls and said first insulating layers form a multilayered structure of conductive metal and insulating material.
Claim 10
Dependent Claim
25 words
A board according to claim 4 wherein said side walls and said first insulating layers form a multilayered structure of conductive metal and insulating material.
Claim 11
Dependent Claim
16 words
A board according to claim 1 wherein said recessed portion has conductive bottom and side surfaces.
References Cited (Backward Citations)
US4706167A
Cited
JPS60180197A
Cited
JPS62259500A
Cited
US5136471A
Cited
US4893216A
Cited
US5061824A
Cited
US5320894A
Cited
JPH04148590A
Cited
US5313021A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-02 | 1999-04-03 | 1999-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-02 | 2003-04-03 | 2003-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-02 | 2007-04-03 | 2007-10-03 | $7700.00 | Window Closed / Lapsed |