US5453908A
Expired / Lapsed
US
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Barium strontium titanate (BST) thin films by holmium donor doping
Assignee: Texas Instruments Inc
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Filing: 1994-09-30
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Granted: 1995-09-26
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Expires: 2014-09-30
Abstract
Abstract A semiconductor device and process for making the same are disclosed which incorporate a relatively large percentage of holmium dopant (0.5 to 5%) into a BST dielectric film 24 with small grain size (e.g. 10 nm to 50 nm). Dielectric film 24 is preferably disposed between electrodes 18 and 26 (which preferably have a Pt layer contacting the BST) to form a capacitive structure with a relatively high dielectric constant and relatively low leakage current. Apparently, properties of the thin film deposition and small grain size, including temperatures well below bulk BST sintering temperatures, allow the film to support markedly higher defect concentrations without holmium precipitation than are observed for bulk BST. For holmium doping levels generally between 0.5 and 5% (compensated with titanium and/or manganese), better than 50% improvement in dielectric constant and two to six orders of magnitude reduction in leakage current (compared to undoped BST) have been observed for such films.
Inventors
- 👤 Robert Tsu
- 👤 Bernard M. Kulwicki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 01:33
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10D1/684; H10D1/692; H10D1/694
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
139 words
A method of forming a barium and/or strontium titanate dielectric film on a microelectronic device, said method comprising: (a) preparing a precursor by combining compounds of elements titanium, holmium, and at least one of barium and strontium, such that the molar ratio of said holmium to said titanium in said precursor is between 0.005 and 0.05; (b) depositing and densifying one or more layers of said precursor to form a precursor film on said device; and (c) annealing said precursor film at a temperature less than 700 C. in an oxygen-containing atmosphere, thereby forming said dielectric film comprising a plurality of holmium-doped barium and/or strontium titanate grains, said grains having a median size of between 10 nm and 50 nm, whereby holmium addition increases the dielectric constant of and decreases the dielectric leakage current observed for said dielectric film.
Claim 2
Independent Claim
139 words
A method of forming a barium and/or strontium titanate dielectric film on a microelectronic device, said method comprising: (a) preparing a precursor by combining compounds of elements titanium, holmium, and at least one of barium and strontium, such that the molar ratio of said holmium to said titanium in said precursor is between 0.005 and 0.05; (b) depositing and densifying one or more layers of said precursor to form a precursor film on said device; and (c) annealing said precursor film at a temperature less than 700 C. in an oxygen-containing atmosphere, thereby forming said dielectric film comprising a plurality of holmium-doped barium and/or strontium titanate grains, said grains having a median size of between 10 nm and 50 nm, whereby holmium addition increases the dielectric constant of and decreases the dielectric leakage current observed for said dielectric film.
Claim 3
Dependent Claim
42 words
The method of claim 1, wherein said preparing a precursor step further comprises combining said compounds with a compound of the element manganese, such that the molar ratio of said manganese to said holmium in said precursor is between 0.1 and 1.0.
Claim 4
Dependent Claim
28 words
The method of claim 1, wherein between 93% and 99.9% of said titanium is incorporated in said grains, with the remainder of said titanium residing at grain boundaries.
Claim 5
Dependent Claim
21 words
The method of claim 1, wherein between 40% and 70% of barium-strontium lattice sites in said grains are occupied by barium.
Claim 6
Dependent Claim
15 words
The method of claim 1, wherein said annealing step occurs at less than 650 C.
Claim 7
Dependent Claim
15 words
The method of claim 1, wherein said annealing step occurs at less than 600 C.
Claim 8
Dependent Claim
36 words
The method of claim 1, wherein said preparing a precursor step comprises combining titanium ammonium lactate, holmium nitrate and/or holmium acetate, and at least one of barium acetate and strontium acetate, in a common aqueous solution.
Claim 9
Dependent Claim
13 words
The method of claim 7, wherein said aqueous solution further comprises organic solvents.
Claim 10
Independent Claim
164 words
A method of forming a capacitive structure on a microelectronic device, said capacitive structure having a dielectric laminate disposed between a first electrode and a second electrode, said method comprising: (a) forming said first electrode on a substrate; (b) depositing two or more films over said first electrode, said films comprising titanium and at least one of barium and strontium, at least one of said films further comprising holmium in a molar ratio to said titanium of between 0.005 and 0.05; (c) annealing said films at a temperature below 700 C. in an oxygen-containing atmosphere, thereby forming said dielectric laminate comprising a plurality of grains with a perovskite crystal structure, said grains comprising titanium, oxygen, and at least one of barium and strontium and having a median grain size of between 10 nm and 50 nm, said grains in at least a sublayer of said dielectric laminate being doped grains and further comprising holmium; and (d) forming a second electrode over said dielectric laminate.
Claim 11
Independent Claim
164 words
A method of forming a capacitive structure on a microelectronic device, said capacitive structure having a dielectric laminate disposed between a first electrode and a second electrode, said method comprising: (a) forming said first electrode on a substrate; (b) depositing two or more films over said first electrode, said films comprising titanium and at least one of barium and strontium, at least one of said films further comprising holmium in a molar ratio to said titanium of between 0.005 and 0.05; (c) annealing said films at a temperature below 700 C. in an oxygen-containing atmosphere, thereby forming said dielectric laminate comprising a plurality of grains with a perovskite crystal structure, said grains comprising titanium, oxygen, and at least one of barium and strontium and having a median grain size of between 10 nm and 50 nm, said grains in at least a sublayer of said dielectric laminate being doped grains and further comprising holmium; and (d) forming a second electrode over said dielectric laminate.
Claim 12
Dependent Claim
33 words
The method of claim 9, wherein between 93% and 99.9% of said titanium is incorporated in said grains, with the remainder of said titanium comprising oxidized titanium and existing in said boundary regions.
Claim 13
Dependent Claim
41 words
The method of claim 9, wherein at least one of said films comprising holmium further comprises manganese, such that after said annealing step, said doped grains further comprise manganese in a molar ratio to said holmium of between 0.1 and 1.0.
Claim 14
Dependent Claim
125 words
A capacitive structure on a microelectronic device, said capacitive structure comprising: (a) first and second conductive electrodes, said electrodes having facing platinum surfaces; (b) a dielectric laminate dispersed between said facing platinum surfaces, said dielectric laminate comprising two or more grains having a perovskite crystal structure, each grain comprising titanium, oxygen, and at least one of barium and strontium, said grains having a median size of between 10 nm and 50 nm; and (c) at least a sublayer of said dielectric laminate having said grains which are doped grains, said doped grains further comprising holmium and having a molar ratio of holmium to titanium of between 0.005 and 0.05, whereby holmium addition improves the dielectric constant of and reduces leakage current through said dielectric laminate.
Claim 15
Dependent Claim
125 words
A capacitive structure on a microelectronic device, said capacitive structure comprising: (a) first and second conductive electrodes, said electrodes having facing platinum surfaces; (b) a dielectric laminate dispersed between said facing platinum surfaces, said dielectric laminate comprising two or more grains having a perovskite crystal structure, each grain comprising titanium, oxygen, and at least one of barium and strontium, said grains having a median size of between 10 nm and 50 nm; and (c) at least a sublayer of said dielectric laminate having said grains which are doped grains, said doped grains further comprising holmium and having a molar ratio of holmium to titanium of between 0.005 and 0.05, whereby holmium addition improves the dielectric constant of and reduces leakage current through said dielectric laminate.
Claim 16
Dependent Claim
24 words
The structure of claim 12, wherein said doped grains further comprise manganese in a molar ratio to said holmium of between 0.1 and 1.0.
Claim 17
Dependent Claim
44 words
The structure of claim 12, further comprising oxidized titanium in said boundary regions between said grains in at least a portion of said dielectric laminate, said oxidized titanium comprising between 0.1% and 7% of the total amount of titanium contained in said dielectric laminate.
Claim 18
Dependent Claim
35 words
The structure of claim 12, wherein said grains are arranged roughly in two or more sublayers between said first and second electrodes, said sublayers which are adjacent having different relative concentrations of barium to strontium.
References Cited (Backward Citations)
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