US5444388A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for testing semiconductor devices using a conductive sheet
Assignee: Mitsubishi Electric Corp
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Filing: 1994-04-05
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Granted: 1995-08-22
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Expires: 2014-04-05
Abstract
Abstract A semiconductor apparatus for functionally inspecting semiconductor devices is designed to prevent contact failure, deformation, and the like caused by solder transferred from external leads of semiconductor devices and deposited on contact terminals of the inspection apparatus. A sheet having metal-film patterns corresponding to an array of external leads of a semiconductor device is interposed between the external leads and the contact terminals to electrically connect the external leads to the contact terminals. The semiconductor device is inspected and the sheet is changed at a suitable time when it is contaminated with solder.
Inventors
- 👤 Yasushi Ideta
- 👤 Tsunenori Umezu
- 👤 Akihiro Washitani
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 06:23
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
133 words
An apparatus for testing semiconductor devices comprising: a socket frame on which a semiconductor devices is individually supported during testing and including an array of contact terminals corresponding to an array of external leads of a semiconductor device and connected to a test measurement circuit a movable pressing device for pressing the external leads of a semiconductor device supported on said socket frame toward the contact terminals during testing; and a changeable sheet having a plurality of conductor patterns for electrically connecting the external leads of the semiconductor device and the contact terminals of said socket frame, said sheet being interposed between the contact terminals and the external leads during inspection of a semiconductor devices during testing for preventing solder on the external leads from attaching to and depositing on the contact terminals.
Claim 2
Independent Claim
133 words
An apparatus for testing semiconductor devices comprising: a socket frame on which a semiconductor devices is individually supported during testing and including an array of contact terminals corresponding to an array of external leads of a semiconductor device and connected to a test measurement circuit a movable pressing device for pressing the external leads of a semiconductor device supported on said socket frame toward the contact terminals during testing; and a changeable sheet having a plurality of conductor patterns for electrically connecting the external leads of the semiconductor device and the contact terminals of said socket frame, said sheet being interposed between the contact terminals and the external leads during inspection of a semiconductor devices during testing for preventing solder on the external leads from attaching to and depositing on the contact terminals.
Claim 3
Dependent Claim
98 words
The apparatus for testing semiconductor devices according to claim 1 wherein the conductor patterns of said sheet are first metal film patterns arranged with a pitch equal to a pitch of the array of external leads of the semiconductor device, second metal film patterns arranged with a pitch equal to a pitch of the array of contact terminals, and metal film extension patterns connecting said first and second metal film patterns, whereby said sheet can connect external leads of the semiconductor device and the array of contact terminals on said socket frame that differ in position and pitch.
Claim 4
Dependent Claim
35 words
The apparatus for testing semiconductor devices according to claim 1 wherein said sheet is a lengthwise sheet including and a sprocket mechanism for automatically changing a used portion of the sheet in a feed operation.
Claim 5
Dependent Claim
25 words
The apparatus for testing semiconductor devices according to claim 3 wherein wires are embedded in said lengthwise sheet to improve mechanical strength of the sheet.
Claim 6
Independent Claim
287 words
An apparatus for testing semiconductor devices comprising: a socket frame for fixedly holding a semiconductor device and including an array of contact terminals corresponding to external leads of the semiconductor device and connected to a test measurement circuit a changeable lengthwise sheet having a plurality of conductor patterns for electrically connecting the external leads of the semiconductor device and the contact terminals of said socket frame, said sheet being interposed between the contact terminals and the external leads during inspection of a semiconductor device during testing for preventing solder on the external leads from attaching to and depositing on the contact terminals; positioning recognition marks on said sheet for positioning the semiconductor device; a sprocket mechanism for automatically changing said lengthwise sheet in a feed operation; a manipulator for moving the semiconductor device to a position above said sheet on said socket frame, said manipulator having a head for holding the semiconductor device for positioning the semiconductor device on said sheet, for pressing the external leads of the semiconductor device toward the contact terminals during testing, and for removing the semiconductor device from said sheet while holding the semiconductor device to the head after testing; at least one positioning sensor attached to the head of said manipulator to form an image of each of said positioning recognition marks on said sheet; and a control unit for driving said sprocket mechanism to feed and change said sheet in response to signals from said positioning sensor and the test measurement circuit after a fixed number of tests counted from a signal generated by the test measurement circuit and for driving said manipulator to position the semiconductor device on said sheet in response to a signal from said positioning sensor.
Claim 7
Independent Claim
287 words
An apparatus for testing semiconductor devices comprising: a socket frame for fixedly holding a semiconductor device and including an array of contact terminals corresponding to external leads of the semiconductor device and connected to a test measurement circuit a changeable lengthwise sheet having a plurality of conductor patterns for electrically connecting the external leads of the semiconductor device and the contact terminals of said socket frame, said sheet being interposed between the contact terminals and the external leads during inspection of a semiconductor device during testing for preventing solder on the external leads from attaching to and depositing on the contact terminals; positioning recognition marks on said sheet for positioning the semiconductor device; a sprocket mechanism for automatically changing said lengthwise sheet in a feed operation; a manipulator for moving the semiconductor device to a position above said sheet on said socket frame, said manipulator having a head for holding the semiconductor device for positioning the semiconductor device on said sheet, for pressing the external leads of the semiconductor device toward the contact terminals during testing, and for removing the semiconductor device from said sheet while holding the semiconductor device to the head after testing; at least one positioning sensor attached to the head of said manipulator to form an image of each of said positioning recognition marks on said sheet; and a control unit for driving said sprocket mechanism to feed and change said sheet in response to signals from said positioning sensor and the test measurement circuit after a fixed number of tests counted from a signal generated by the test measurement circuit and for driving said manipulator to position the semiconductor device on said sheet in response to a signal from said positioning sensor.
Claim 8
Independent Claim
326 words
An apparatus for testing semiconductor devices comprising: a socket frame for fixedly holding a semiconductor device and including an array of contact terminals corresponding to external leads of the semiconductor device and connected to a test measurement circuit; a changeable lengthwise sheet having a plurality of conductor patterns for electrically connecting the external leads of the semiconductor device and the contact terminals of said socket frame, said sheet being interposed between the contact terminals and the external leads during inspection of a semiconductor device during testing for preventing solder on the external leads from attaching to and depositing on the contact terminals; positioning recognition marks on said sheet for positioning the semiconductor device; sheet change designation marks in portions of the conductor patterns of said sheet contacting the external leads of the semiconductor device, each sheet change designation mark having a surface profile including small recesses and projections that disappear gradually as solder from the external leads is attached to and deposited thereon; a sprocket mechanism for automatically changing said lengthwise sheet in a feed operation; a manipulator for moving the semiconductor device to a position above said sheet on said socket frame, said manipulator having a head for holding the semiconductor device, for positioning the semiconductor device on said sheet, for pressing the external leads of the semiconductor device toward the contact terminals during testing, and for removing the semiconductor device from said sheet while holding the semiconductor device to the head after testing; at least one positioning sensor attached to the head of said manipulator to form an image of each of said positioning recognition marks on said sheet; and a control unit for driving said sprocket mechanism to feed and change said sheet in response to a signal from said positioning sensor when said sheet change designation marks become unrecognizable and for driving said manipulator to position the semiconductor device on said sheet in response to the position of said positioning recognition marks.
Claim 9
Independent Claim
326 words
An apparatus for testing semiconductor devices comprising: a socket frame for fixedly holding a semiconductor device and including an array of contact terminals corresponding to external leads of the semiconductor device and connected to a test measurement circuit; a changeable lengthwise sheet having a plurality of conductor patterns for electrically connecting the external leads of the semiconductor device and the contact terminals of said socket frame, said sheet being interposed between the contact terminals and the external leads during inspection of a semiconductor device during testing for preventing solder on the external leads from attaching to and depositing on the contact terminals; positioning recognition marks on said sheet for positioning the semiconductor device; sheet change designation marks in portions of the conductor patterns of said sheet contacting the external leads of the semiconductor device, each sheet change designation mark having a surface profile including small recesses and projections that disappear gradually as solder from the external leads is attached to and deposited thereon; a sprocket mechanism for automatically changing said lengthwise sheet in a feed operation; a manipulator for moving the semiconductor device to a position above said sheet on said socket frame, said manipulator having a head for holding the semiconductor device, for positioning the semiconductor device on said sheet, for pressing the external leads of the semiconductor device toward the contact terminals during testing, and for removing the semiconductor device from said sheet while holding the semiconductor device to the head after testing; at least one positioning sensor attached to the head of said manipulator to form an image of each of said positioning recognition marks on said sheet; and a control unit for driving said sprocket mechanism to feed and change said sheet in response to a signal from said positioning sensor when said sheet change designation marks become unrecognizable and for driving said manipulator to position the semiconductor device on said sheet in response to the position of said positioning recognition marks.
Claim 10
Dependent Claim
25 words
The apparatus for testing semiconductor devices according to claim 1 wherein the socket frame includes guides for supporting a body of a packaged semiconductor device.
Claim 11
Dependent Claim
29 words
The apparatus for testing semiconductor devices according to claim 7 wherein the sheet includes a hole for passage of guides for contacting the body of the packaged semiconductor device.
Claim 12
Dependent Claim
26 words
The apparatus for testing semiconductor devices according to claim 1 wherein the pressing device and the contact terminals are disposed on opposite sides of the sheet.
Claim 13
Dependent Claim
26 words
The apparatus for testing semiconductor devices according to claim 1 wherein the external leads and the contact terminals are disposed on opposite sides of the sheet.
Claim 14
Dependent Claim
29 words
The apparatus for testing semiconductor devices according to claim 1 wherein the pressing device has an electrically insulating pressing portion for contacting the external leads of the semiconductor device.
Claim 15
Dependent Claim
19 words
The apparatus for testing semiconductor devices according to claim 1 wherein the external leads are unconnected to the sheet.
Claim 16
Dependent Claim
40 words
The apparatus for testing semiconductor devices according to claim 1 wherein the socket frame includes a positioning projection for positioning the sheet with respect to the contact terminals, and the sheet includes a positioning hole for receiving the positioning projection.
Claim 17
Dependent Claim
27 words
The apparatus for testing semiconductor devices according to claim 1 wherein the sheet includes conductor patterns corresponding to the external leads of only a single semiconductor device.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-08-21 | 1999-02-20 | 1999-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-08-21 | 2003-02-20 | 2003-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-08-21 | 2007-02-20 | 2007-08-22 | $7700.00 | Window Closed / Lapsed |