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US5431964A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of pretreating the deposition chamber and/or the substrate for the selective deposition of tungsten

Assignee: Chartoleaux KG LLC
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Filing: 1993-08-26
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Granted: 1995-07-11
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Expires: 2013-08-26
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Abstract

Abstract The invention relates to the method of pretreating a deposition chamber intended to be used for the selective vapor deposition of tungsten, characterized in that a plasma of fluorine-containing gas, optionally combined with an inert diluting gas, is induced in the said deposition chamber. Advantageously, the same fluorine treatment is applied to the substrate intended to receive the selective tungsten deposition.

Inventors

  • 👤 Maurice Rivoire

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 05:07
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/40; H10P14/42; H10P14/43; H10P14/432; C; C23; C23C; C23C16/00; C23C16/02; C23C16/0227; C23C16/0245; C23C16/04; C23C16/44; C23C16/4401; C23C16/4405; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/057

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 68 words
A method of pretreating for enhancing the selective deposition of tungsten, consisting essentially of the steps: (a) pretreating a deposition chamber with a plasma of a fluorine-containing gas such that traces of residual fluorine remain in said deposition chamber; and (b) depositing tungsten by chemical vapor deposition on a substrate in said deposition chamber with said traces of residual fluorine at a temperature of 250° C. or more.
Claim 2
Independent Claim 68 words
A method of pretreating for enhancing the selective deposition of tungsten, consisting essentially of the steps: (a) pretreating a deposition chamber with a plasma of a fluorine-containing gas such that traces of residual fluorine remain in said deposition chamber; and (b) depositing tungsten by chemical vapor deposition on a substrate in said deposition chamber with said traces of residual fluorine at a temperature of 250° C. or more.
Claim 3
Dependent Claim 17 words
The method of claim 1, wherein said pretreating is carried out at a temperature of 250°-500° C.
Claim 4
Dependent Claim 26 words
The method of claim 2, wherein said pretreating is carried out a temperature of 300°-400° C., and at a pressure of 150 millitorr to 1 torr.
Claim 5
Dependent Claim 26 words
The method of claim 2, wherein said pretreating is performed for 5-120 seconds, with a flow rate of said fluorine-containing gas of 10-200 cm 3 /min.
Claim 6
Dependent Claim 13 words
The method of claim 1, wherein said substrate comprises silicon oxide and tungsten.
Claim 7
Dependent Claim 26 words
The method of claim 1, wherein said fluorine-containing gas is selected from the group consisting of NF 3 , SF 6 , CF 4 and HF.
Claim 8
Dependent Claim 19 words
The method of claim 1, wherein said pretreating is carried out after introducing said substrate into said deposition chamber.
Claim 9
Dependent Claim 20 words
The method of claim 1, wherein said pretreating is carried out before introducing of said substrate into said deposition chamber.

References Cited (Backward Citations)

US5108543A Cited
US4980197A Cited
US4613400A Cited
US4816294A Cited
US4969415A Cited
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EP0430303A2 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-07-10 1999-01-09 1999-07-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-07-10 2003-01-09 2003-07-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-07-10 2007-01-09 2007-07-11 $7700.00 Window Closed / Lapsed

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