Abstract A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.
A heat treatment apparatus for performing a heat treatment by raising and lowering a temperature of a plurality of substrates comprising: a plurality of substantially continuous ring-shaped trays; each of said ring-shaped trays including a ring-shaped support surface which supports a periphery of a substrate thereon, each of said ring-shaped trays further including a ring-shaped projection extending about said ring-shaped support surface and extending upwardly from said ring-shaped support surface, and further wherein a ring-shaped gap is provided between an inner periphery of the ring-shaped projection and an outer periphery of the substrate supported on the ring-shaped support surface; wherein said ring-shaped support surface has a larger thickness at a location adjacent said ring-shaped projection as compared with a thickness of said ring-shaped support surface at a location farther from said ring-shaped projection, such that the thickness of the ring-shaped trays is thinner at radially inner portions of said ring-shaped support surface.
Claim 2
Dependent Claim
152 words
A heat treatment apparatus for performing a heat treatment by raising and lowering a temperature of a plurality of substrates comprising: a plurality of substantially continuous ring-shaped trays; each of said ring-shaped trays including a ring-shaped support surface which supports a periphery of a substrate thereon, each of said ring-shaped trays further including a ring-shaped projection extending about said ring-shaped support surface and extending upwardly from said ring-shaped support surface, and further wherein a ring-shaped gap is provided between an inner periphery of the ring-shaped projection and an outer periphery of the substrate supported on the ring-shaped support surface; wherein said ring-shaped support surface has a larger thickness at a location adjacent said ring-shaped projection as compared with a thickness of said ring-shaped support surface at a location farther from said ring-shaped projection, such that the thickness of the ring-shaped trays is thinner at radially inner portions of said ring-shaped support surface.
Claim 3
Dependent Claim
14 words
The apparatus according to claim 1, wherein the ring-shaped trays are made of quartz.