US5428245A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame including an inductor or other such magnetic component
Assignee: National Semiconductor Corp
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Filing: 1994-05-06
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Granted: 1995-06-27
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Expires: 2014-05-06
Abstract
Abstract A lead frame for use in an integrated circuit package is disclosed herein. The lead frame includes a magnetic component winding wherein the winding is formed as an integral part of the lead frame. Additional windings may be formed as an integral part of the lead frame and then folded into position over the first winding to form a multiple layered magnetic component winding. In one embodiment, the lead frame based winding is coated with a magnetic material to form a lead frame based inductor. There is also disclosed a method of producing a lead frame including a magnetic component winding wherein the winding is formed as an integral part of the lead frame.
Inventors
- 👤 Peng-Cheng Lin
- 👤 Seth R. Sanders
- 👤 Hem P. Takiar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; G; G01; G01R; G01R1/00; G01R1/20; H10W70/421; Y; Y10; Y10S; Y10S257/00; Y10S257/924
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
69 words
A lead frame for use in an integrated circuit package comprising; (a) a unitary main body adapted to support an integrated circuit within said integrated circuit package, (b) an array of electrically conductive leads positioned in close proximity to said main body for electrically connecting said integrated circuit to other elements, and (c) a magnetic component winding integrally forming part of the unitary main body of said lead frame.
Claim 2
Dependent Claim
69 words
A lead frame for use in an integrated circuit package comprising; (a) a unitary main body adapted to support an integrated circuit within said integrated circuit package, (b) an array of electrically conductive leads positioned in close proximity to said main body for electrically connecting said integrated circuit to other elements, and (c) a magnetic component winding integrally forming part of the unitary main body of said lead frame.
Claim 3
Dependent Claim
40 words
A lead frame as set forth in claim 1 further comprising additional windings integrally formed with and as part of the main body of said lead frame wherein said windings are stacked in parallel planes forming a multiple layered winding.
Claim 4
Dependent Claim
18 words
A lead frame as set forth in claim 1 wherein said magnetic component winding is an inductor winding.
Claim 5
Dependent Claim
26 words
A lead frame as set forth in claim 3 further comprising a magnetic coating material substantially covering said inductor winding so as to form an inductor.
Claim 6
Dependent Claim
22 words
A lead frame as set forth in claim 4 wherein said magnetic coating material is an epoxy having magnetic particles dispersed therein.
Claim 7
Dependent Claim
18 words
A lead frame as set forth in claim 1 wherein said magnetic component winding has a coil shape.
Claim 8
Dependent Claim
18 words
A lead frame as set forth in claim 1 wherein said magnetic component winding has a zig-zag shape.
Claim 9
Dependent Claim
30 words
A lead frame as set forth in claim 1 wherein said lead frame unitary main body including said magnetic component winding is formed from a sheet of electrically conductive material.
Claim 10
Dependent Claim
67 words
An integrated circuit package comprising; (a) an integrated circuit component, (b) a lead frame including a unitary main body for supporting said integrated circuit component within said integrated circuit package and an array of electrically conductive leads for electrically connecting said integrated circuit component to other elements, and (c) a magnetic component having a winding integrally forming part of the unitary main body of said lead frame.
Claim 11
Dependent Claim
67 words
An integrated circuit package comprising; (a) an integrated circuit component, (b) a lead frame including a unitary main body for supporting said integrated circuit component within said integrated circuit package and an array of electrically conductive leads for electrically connecting said integrated circuit component to other elements, and (c) a magnetic component having a winding integrally forming part of the unitary main body of said lead frame.
Claim 12
Dependent Claim
41 words
An integrated circuit package as set forth in claim 9 further comprising additional windings integrally formed with and as part of the main body of said lead frame wherein said windings are stacked in parallel planes forming a multiple layered winding.
Claim 13
Dependent Claim
19 words
An integrated circuit package as set forth in claim 9 wherein said magnetic component winding is an inductor winding.
Claim 14
Dependent Claim
25 words
An integrated circuit package as set forth in claim 11 further comprising a magnetic coating material substantially covering said inductor winding forming said magnetic component.
Claim 15
Dependent Claim
23 words
An integrated circuit package as set forth in claim 12 wherein said magnetic coating material is an epoxy having magnetic particles dispersed therein.
Claim 16
Dependent Claim
19 words
An integrated circuit package as set forth in claim 9 wherein said magnetic component winding has a coil shape.
Claim 17
Dependent Claim
19 words
An integrated circuit package as set forth in claim 9 wherein said magnetic component winding has a zig-zag shape.
References Cited (Backward Citations)
US4064472A
Cited
JPS60225449A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-06-26 | 1998-12-26 | 1999-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-06-26 | 2002-12-26 | 2003-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-06-26 | 2006-12-26 | 2007-06-27 | $7700.00 | Window Closed / Lapsed |