Method and apparatus for thermal coefficient of expansion matched substrate attachment

Claim 3

An apparatus as claimed in claim 1, further including a lid sealed to said package base by a seal.

Claim 4

An apparatus as claimed in claim 1, wherein: said substrate comprises one hundred and twelve degree rotated lithium tantalate and said preferred axis corresponds to a Y axis of said lithium tantalate; said package base comprises strontium calcium titanate ceramic material chosen to have a thermal expansion coefficient in a range of nine to thirteen parts per million per degree Celsius; and said first axis coincides with a line making said angle Φ in a range from about ninety five degrees to about one hundred and twenty degrees or about one hundred and seventy degrees to about two hundred degrees with said Y axis.

Claim 5

An apparatus as claimed in claim 1, wherein said adhesive comprises a member of a group consisting of polyetheretherketone, polysulfone, polyethersulfone, polyetherimide, polybutlyeneterepthalate and polycarbonate.

Claim 6

An apparatus as claimed in claim 1, wherein said substrate comprises quartz.

Claim 7

An apparatus as claimed in claim 1, wherein said substrate comprises lithium niobate.

Claim 10

An apparatus as claimed in claim 7, wherein said microelectronic device includes a surface acoustic wave device.

Claim 11

An apparatus as claimed in claim 7, wherein said substrate includes a member of a group consisting of silicon dioxide, lithium niobate and lithium tantalate.

Claim 12

An apparatus as claimed in claim 7, wherein said adhesive includes adhesive disposed as a series of dots arranged in a narrow line along said first axis, said substrate having a substantially similar thermal coefficient of expansion along said first axis as said isotropic thermal expansion coefficient.

Claim 13

An apparatus as claimed in claim 7, wherein said adhesive comprises a single narrow line of adhesive material disposed along said first axis, said substrate having a substantially similar thermal coefficient of expansion along said first axis as said isotropic thermal expansion coefficient.

Claim 14

An apparatus as claimed in claim 7, wherein: said package base comprises alumina-bearing ceramic; said substrate includes ST-cut quartz and said preferred axis corresponds to an X axis of said ST-cut quartz; and said first axis of said substrate coincides with a line making said angle Φ of four to twelve degrees with said X axis.

Claim 15

An apparatus as claimed in claim 7, wherein: said package base comprises strontium calcium titanate ceramic having a thermal expansion coefficient in a range of nine to thirteen parts per million per degree Celsius; said substrate includes Y-cut, Z-propagating lithium niobate and said preferred axis corresponds to a Z axis of said lithium niobate; and said first axis of said substrate coincides with a line making said angle Φ of thirty five to eighty degrees with said Z axis.

Claim 16

An apparatus as claimed in claim 7, wherein: said package base comprises polyimide/quartz material chosen to have a thermal expansion coefficient in a range of eight to eleven parts per million per degree Celsius; said substrate includes thirty-six degree rotated lithium tantalate and said preferred axis corresponds to an X axis of said lithium tantalate; and said first axis of said substrate coincides with a line making said angle Φ of about ninety degrees with said X axis.

Claim 17

A radio frequency apparatus including at least one microelectronic device comprising: a substrate having anisotropic thermal expansion coefficients and a preferred axis, said substrate including said at least one microelectronic device; a package base having an isotropic thermal expansion coefficient and a preferred direction, said package base for mounting said microelectronic device with said preferred axis substantially aligned to said preferred direction, said package base including external interconnections coupled to internal interconnections, said internal interconnections coupled to said microelectronic device; an adhesive for affixing said substrate to said package base, said adhesive disposed substantially along a narrow line parallel to a first axis of said substrate, said first axis disposed at an angle Φ with respect to said preferred axis, wherein said first axis is chosen to provide a best match of an expansion coefficient corresponding to said first axis to said isotropic thermal expansion coefficient; and a lid hermetically sealed to said package base, said lid and said package base hermetically enclosing said microelectronic device.

Claim 18

A radio frequency apparatus including at least one microelectronic device comprising: a substrate having anisotropic thermal expansion coefficients and a preferred axis, said substrate including said at least one microelectronic device; a package base having an isotropic thermal expansion coefficient and a preferred direction, said package base for mounting said microelectronic device with said preferred axis substantially aligned to said preferred direction, said package base including external interconnections coupled to internal interconnections, said internal interconnections coupled to said microelectronic device; an adhesive for affixing said substrate to said package base, said adhesive disposed substantially along a narrow line parallel to a first axis of said substrate, said first axis disposed at an angle Φ with respect to said preferred axis, wherein said first axis is chosen to provide a best match of an expansion coefficient corresponding to said first axis to said isotropic thermal expansion coefficient; and a lid hermetically sealed to said package base, said lid and said package base hermetically enclosing said microelectronic device.

Claim 19

A radio frequency apparatus as claimed in claim 15, wherein said microelectronic device comprises a surface acoustic wave device.

Claim 20

A radio frequency apparatus as claimed in claim 15, wherein said adhesive further comprises a single thin, narrow line of adhesive material disposed along said first axis, said substrate having a substantially similar coefficient of expansion along said first axis as said isotropic thermal expansion coefficient.

Claim 21

A radio frequency apparatus as claimed in claim 15, wherein: said adhesive includes adhesive disposed as a series of dots arranged in a narrow line along said first axis; and said substrate has a substantially similar thermal coefficient of expansion along said first axis as said isotropic thermal expansion coefficient.

Claim 22

A radio frequency apparatus as claimed in claim 15, wherein: said substrate comprises one hundred and twelve degree rotated lithium tantalate and said preferred axis corresponds to a Y axis of said lithium tantalate; said package base comprises strontium calcium titanate ceramic material chosen to have a thermal expansion coefficient in a range of nine to thirteen parts per million per degree Celsius; and said first axis of said substrate coincides with a line making said angle Φ in a range from about ninety five degrees to about one hundred and twenty degrees or about one hundred and seventy degrees to about two hundred degrees with said Y axis of said lithium tantalate.

Claim 23

A radio frequency apparatus as claimed in claim 15, wherein said substrate comprises a member of a group consisting of lithium niobate, lithium tantalate and silicon dioxide.