Surface position detecting device

Claim 2

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively, said irradiating optical system including a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the surface and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the surface, wherein an image of the first limiting portion is formed on the first portion of the surface while an image of the second limiting portion is formed on the second portion of the surface; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane.

Claim 3

A device according to claim 1, wherein the first and second light beams, on the surface, have substantially the same size.

Claim 4

A device according to claim 2, wherein said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane.

Claim 5

A device according to claim 3, wherein said irradiating optical system has an optical axis inclined with respect to the surface being examined, and is telecentric on its light emitting side.

Claim 6

A device according to claim 4, wherein said primary optical system of said light receiving optical system is telecentric both on a light entrance side and on a light emission side.

Claim 7

A device according to claim 3, wherein said irradiating optical system produces each of the first and second light beams with a light beam containing different color lights.

Claim 8

A device according to claim 3, wherein said position detecting means comprises a sensor having a light receiving surface disposed coincident with said predetermined image plane, for photoelectrically converting the images of the first and second portions.

Claim 9

A device according to claim 3, wherein said position detecting means comprises a first sensor for photoelectrically converting the image of the first portion and a second sensor, separate from said first sensor, for photoelectrically converting the image of the second portion, and wherein said first and second sensors have light receiving surfaces disposed coincident with said predetermined image plane.

Claim 10

A device according to claim 3, wherein said irradiating optical system comprises a light source, a stop member including said first and second limiting portions, which respectively comprise first and second openings of different sizes, for defining the first and second light beams, respectively, said first and second openings being located along a plane inclined with respect to the optical axis of said irradiating optical system, illumination means for illuminating said stop member with light from said light source, and an imaging optical system being telecentric on its side facing the surface to be examined, for projecting upon the surface images of said first and second openings illuminated by said illumination means.

Claim 11

A device according to claim 3, wherein the first and second portions are at positions which are different from each other with respect to a meridional direction of said light receiving optical system.

Claim 12

A device according to claim 1, wherein said position detecting means comprises a sensor having a light receiving surface disposed coincident with said predetermined image plane, for photoelectrically converting the images of the first and second portions.

Claim 13

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane, wherein the first and second light beams, on the surface, have substantially the same size, said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane, and each of said first and second auxiliary optical systems comprises first and second reflecting mirrors each being disposed adjacent said intermediate image plane.

Claim 14

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane, wherein the first and second light beams, on the surface, have substantially the same size, said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane, and each of said first and second auxiliary optical systems comprises first and second reflecting mirrors each being disposed adjacent said intermediate image plane.

Claim 15

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane, wherein the first and second light beams, on the surface, have substantially the same size, said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane, said irradiating optical system comprises a light source, a stop member having first and second openings of different sizes, for defining the first and second light beams, respectively, said first and second openings being located along a plane inclined with respect to the optical axis of said irradiating optical system, illumination means for illuminating said stop member with light from said light source, and an imaging optical system being telecentric on its side facing the surface to be examined, for projecting upon the surface images of said first and second openings illuminated by said illumination means, and said stop member comprises a cube-like structure including a pair of rectangular prisms cemented to each other with their slant surfaces opposed to each other, and wherein a light, blocking film having said first and second openings formed therein is provided on one of the slant surfaces of said rectangular prisms.

Claim 16

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane, wherein the first and second light beams, on the surface, have substantially the same size, said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane, said irradiating optical system comprises a light source, a stop member having first and second openings of different sizes, for defining the first and second light beams, respectively, said first and second openings being located along a plane inclined with respect to the optical axis of said irradiating optical system, illumination means for illuminating said stop member with light from said light source, and an imaging optical system being telecentric on its side facing the surface to be examined, for projecting upon the surface images of said first and second openings illuminated by said illumination means, and said stop member comprises a cube-like structure including a pair of rectangular prisms cemented to each other with their slant surfaces opposed to each other, and wherein a light, blocking film having said first and second openings formed therein is provided on one of the slant surfaces of said rectangular prisms.

Claim 17

A device according to claim 13, wherein said irradiating optical system further comprises a parallel plate movably disposed between said stop member and said imaging optical system, for adjusting inclination thereof with respect to the optical axis of said irradiating optical system.

Claim 18

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane, wherein the first and second light beams, on the surface, have substantially the same size; said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane, and said irradiating optical system comprises a light source, a stop member having first and second openings of the same size, for defining the first and second light beams, respectively, illumination means for illuminating said stop member with light from said light source, a first imaging optical system for forming, at a first magnification, an image of said first opening illuminated by said illumination means at a position adjacent to a plane which is inclined with respect to the optical axis of said irradiating optical system, a second imaging optical system for forming, at a second magnification different from said first magnification, an image of said second opening illuminated by said illumination means at a position adjacent to said plane, and a third imaging optical system for projecting upon the surface being examined, the images of said first and second openings formed adjacent said plane, wherein said third imaging optical system is telecentric on its side facing the surface being examined.

Claim 19

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system for irradiating first and second portions of the surface with first and second light beams, respectively; a light receiving optical system having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between said predetermined image plane and the surface being examined, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams reflected respectively from the first and second portions of the surface, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the surface, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; and position detecting means for detecting positions of the images of the first and second portions upon said predetermined image plane, wherein the first and second light beams, on the surface, have substantially the same size; said light receiving optical system has an intermediate image plane which is correlated with the surface being examined, to satisfy a Scheimpflug's condition, with respect to said primary optical system, wherein said primary optical system serves to image each of the first and second portions upon the intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said predetermined image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said predetermined image plane, and said irradiating optical system comprises a light source, a stop member having first and second openings of the same size, for defining the first and second light beams, respectively, illumination means for illuminating said stop member with light from said light source, a first imaging optical system for forming, at a first magnification, an image of said first opening illuminated by said illumination means at a position adjacent to a plane which is inclined with respect to the optical axis of said irradiating optical system, a second imaging optical system for forming, at a second magnification different from said first magnification, an image of said second opening illuminated by said illumination means at a position adjacent to said plane, and a third imaging optical system for projecting upon the surface being examined, the images of said first and second openings formed adjacent said plane, wherein said third imaging optical system is telecentric on its side facing the surface being examined.

Claim 20

An exposure apparatus, comprising: a stage on which a wafer is to be placed; directing means for directing an exposure beam to a first image plane, for exposure of the wafer to print a circuit pattern on the wafer; an irradiating optical system for irradiating first and second portions of the wafer with first and second light beams, respectively, said irradiating optical system including a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the wafer and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the wafer, wherein an image of the first limiting portion is formed on the first portion of the wafer while an image of the second limiting portion is formed on the second portion of the wafer; a light receiving optical system having an optical axis inclined with respect to the wafer, for projecting upon a second image plane images of the first and second portions of the wafer, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between the wafer and said second image plane, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams respectively reflected from the first and second portions of the wafer, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the wafer, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; detecting means for detecting positions of the images of the first and second light portions upon said second image plane; and adjusting means for adjusting a positional relation of the wafer with said first image plane so that the wafer is brought into substantial coincidence with said first image plane.

Claim 21

An exposure apparatus, comprising: a stage on which a wafer is to be placed; directing means for directing an exposure beam to a first image plane, for exposure of the wafer to print a circuit pattern on the wafer; an irradiating optical system for irradiating first and second portions of the wafer with first and second light beams, respectively, said irradiating optical system including a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the wafer and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the wafer, wherein an image of the first limiting portion is formed on the first portion of the wafer while an image of the second limiting portion is formed on the second portion of the wafer; a light receiving optical system having an optical axis inclined with respect to the wafer, for projecting upon a second image plane images of the first and second portions of the wafer, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between the wafer and said second image plane, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams respectively reflected from the first and second portions of the wafer, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the wafer, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; detecting means for detecting positions of the images of the first and second light portions upon said second image plane; and adjusting means for adjusting a positional relation of the wafer with said first image plane so that the wafer is brought into substantial coincidence with said first image plane.

Claim 22

An apparatus according to claim 16, wherein said irradiating optical system is arranged such that the first and second light beams on the wafer being examined have substantially the same size.

Claim 23

An apparatus according to claim 17, wherein the exposure beam comprises an electron beam.

Claim 24

An apparatus according to claim 18, wherein said directing means focuses the electron beam upon said first image plane, to draw a circuit pattern with the electron beam.

Claim 25

An apparatus according to claim 17, wherein the exposure beam comprises deep ultraviolet light.

Claim 26

An apparatus according to claim 17, wherein the exposure beam comprises X-rays.

Claim 27

An apparatus according to claim 17, wherein said directing means comprises a reduction projection lens system for projecting an image of a predetermined circuit pattern upon said first image plane with the exposure beam.

Claim 28

An apparatus according to claim 17, wherein said light receiving optical system has an intermediate image plane which is correlated with the wafer being exposed, so as to satisfy a Scheimpflug's condition with respect to said primary optical system, wherein said primary optical system serves to image the first and second light portions upon said intermediate image plane, wherein said first auxiliary optical system serves to re-image the image of the first portion on said intermediate image plane, upon said second image plane, and wherein said second auxiliary optical system serves to re-image the image of the second portion on said intermediate image plane, upon said second image plane.

Claim 29

An apparatus according to claim 17, wherein said irradiating optical system is telecentric on its light emission side, and wherein said light receiving optical system is telecentric both on a light entrance side and on a light emission side.

Claim 30

An apparatus according to claim 17, wherein the first and second portions are at those positions which are different from each other with respect to a meridional direction of said light receiving optical system.

Claim 31

A projection exposure apparatus, comprising: a stage on which a wafer is to be placed; a projection optical system having a first image plane, for projecting upon said first image plane an image of a circuit pattern; an irradiating optical system having an optical axis inclined with respect to the wafer, for irradiating first and second portions of a zone of the wafer with first and second light beams, respectively, of substantially the same size, said irradiating optical system including a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the zone of the wafer and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the zone of the wafer, wherein an image of the first limiting portion is formed on the first portion of the zone of the wafer while an image of the second limiting portion is formed on the second portion of the zone of the wafer; a light receiving optical system having an optical axis inclined with respect to the wafer, for projecting upon a second image plane images of the first and second portions of the wafer, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between the wafer and said second image plane, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams respectively reflected from the first and second portions of the wafer, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the wafer, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; detecting means for detecting positions of the images of the first and second portions upon said second image plane; and adjusting means for adjusting a positional relation of the wafer with said first image plane so that the wafer in the zone is brought into substantial coincidence with said first image plane.

Claim 32

A projection exposure apparatus, comprising: a stage on which a wafer is to be placed; a projection optical system having a first image plane, for projecting upon said first image plane an image of a circuit pattern; an irradiating optical system having an optical axis inclined with respect to the wafer, for irradiating first and second portions of a zone of the wafer with first and second light beams, respectively, of substantially the same size, said irradiating optical system including a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the zone of the wafer and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the zone of the wafer, wherein an image of the first limiting portion is formed on the first portion of the zone of the wafer while an image of the second limiting portion is formed on the second portion of the zone of the wafer; a light receiving optical system having an optical axis inclined with respect to the wafer, for projecting upon a second image plane images of the first and second portions of the wafer, respectively, wherein said light receiving optical system comprises a common primary optical and an auxiliary optical arrangement disposed between the wafer and said second image plane, wherein said auxiliary optical arrangement comprises first and second auxiliary optical systems for receiving the first and second light beams respectively reflected from the first and second portions of the wafer, independently of each other while said primary optical system receives both the first and second light beams from the first and second portions of the wafer, and wherein a combined magnification of said primary optical system and said first auxiliary optical system, for the projection of the image of the first portion, is substantially equal to that of said primary optical system and said second auxiliary optical system, for the projection of the image of the second portion; detecting means for detecting positions of the images of the first and second portions upon said second image plane; and adjusting means for adjusting a positional relation of the wafer with said first image plane so that the wafer in the zone is brought into substantial coincidence with said first image plane.

Claim 33

An apparatus according to claim 26, wherein the circuit pattern image is formed with an electron beam.

Claim 34

An apparatus according to claim 26, wherein the circuit pattern image is formed with deep ultraviolet light.

Claim 35

An apparatus according to claim 26, wherein the circuit pattern image is formed with X-rays.

Claim 36

An apparatus according to claim 26, wherein said irradiating optical system is telecentric on its light emission side, and wherein said light receiving optical system is telecentric both on a light entrance side and on a light emission side.

Claim 37

An apparatus according to claim 26, wherein the first and second portions are at positions which are different from each other with respect to a meridional direction of said light receiving optical system.

Claim 40

A device according to claim 32, wherein said illumination optical system has an optical axis inclined relative to the wafer, and optical axes of said illumination optical system and said imaging optical substantially intersect each other on the wafer.

Claim 41

A device according to claim 33, wherein said common optical system is disposed between the wafer and said correction optical systems, said plurality of correction optical systems are disposed in parallel to each other, and said common optical system projects images of the portions of the wafer upon a predetermined intermediate image plane by using reflected beams from the portions of the wafer, while said correction optical systems re-image the images of corresponding portions of the wafer, which are projected upon the predetermined intermediate image plane.

Claim 42

A device according to claim 34, wherein said illumination optical system illuminates the portions of the wafer with different radiation beams in substantially the same direction, and said common optical system of said imaging optical system comprises a dual-telecentric optical system that is telecentric both on the wafer side and the segmented correction optical system side.

Claim 43

A device according to claim 35, wherein the radiation beams illuminating the wafer have substantially the same size.

Claim 44

A device according to claim 36, wherein each of the radiation beams has different wavelengths.

Claim 45

A device according to claim 36, further comprising a radiation source for generating radiation energy, wherein said illumination optical system comprises (i) stop means having optical apertures irradiated with the radiation energy from said radiation source and (ii) a telecentric optical system, which is telecentric on the wafer side, for projecting images of said optical apertures upon corresponding portions of the wafer by using the radiation beams from said optical apertures.

Claim 46

An exposure apparatus for projecting an exposure beam upon a wafer through an exposure optical system to expose the wafer with the exposure beam, said apparatus comprising: an illumination optical system for illuminating first and second portions of the wafer, said illumination optical system including a first limiting portion for limiting light to be projected to the first portion of the wafer and a second limiting portion for limiting light to be projected to the second portion of the wafer, wherein an image of the first limiting portion is formed on the first portion of the wafer while an image of the second limiting portion is formed on the second portion of the wafer; an imaging optical system for imaging each portion of the wafer as each respective portion is illuminated by said illumination optical system, said imaging optical system comprising (i) a common optical system, having an optical axis inclined relative to the wafer, for receiving reflected beams from the portions of the wafer, and (ii) a plurality of correction optical systems for independently receiving reflection beams from the portions of the wafer, said imaging optical system having approximately even imaging magnifications with respect to the imaging of the portions of the wafer upon a predetermined plane through said common optical system and said correction optical systems; position detecting means for detecting positions of images of the portions of the wafer upon the predetermined plane; and means for adjusting the position of the wafer in the direction of a projection axis of the exposure optical system on the basis of the detection by said position detecting means.

Claim 47

An exposure apparatus for projecting an exposure beam upon a wafer through an exposure optical system to expose the wafer with the exposure beam, said apparatus comprising: an illumination optical system for illuminating first and second portions of the wafer, said illumination optical system including a first limiting portion for limiting light to be projected to the first portion of the wafer and a second limiting portion for limiting light to be projected to the second portion of the wafer, wherein an image of the first limiting portion is formed on the first portion of the wafer while an image of the second limiting portion is formed on the second portion of the wafer; an imaging optical system for imaging each portion of the wafer as each respective portion is illuminated by said illumination optical system, said imaging optical system comprising (i) a common optical system, having an optical axis inclined relative to the wafer, for receiving reflected beams from the portions of the wafer, and (ii) a plurality of correction optical systems for independently receiving reflection beams from the portions of the wafer, said imaging optical system having approximately even imaging magnifications with respect to the imaging of the portions of the wafer upon a predetermined plane through said common optical system and said correction optical systems; position detecting means for detecting positions of images of the portions of the wafer upon the predetermined plane; and means for adjusting the position of the wafer in the direction of a projection axis of the exposure optical system on the basis of the detection by said position detecting means.

Claim 48

An apparatus according to claim 39, wherein said illumination optical system has an optical axis inclined relative to the wafer, and optical axes of said illumination optical system and said imaging optical system substantially intersect each other on the wafer.

Claim 49

An apparatus according to claim 40, wherein said common optical system is disposed between the wafer and said correction optical systems, said plurality of correction optical systems are disposed in parallel to each other, and said common optical system projects images of the portions of the wafer upon a predetermined intermediate image plane by using reflection beams from the portions of the wafer, while said correction optical systems re-image the images of corresponding portions of the wafer, which are projected upon the predetermined intermediate image plane.

Claim 50

An apparatus according to claim 41, wherein said illumination optical system illuminates the portions of the wafer with different radiation beams in substantially the same direction, and said common optical system of said imaging optical system comprises a dual-telecentric optical system that is telecentric both on the wafer side and the correction optical system side.

Claim 51

An apparatus according to claim 42, wherein the radiation beams illuminating the wafer have substantially the same size.

Claim 52

An apparatus according to claim 43, wherein each of the radiation beams has different wavelengths.

Claim 53

An apparatus according to claim 43, further comprising a radiation source for generating radiation energy, wherein said illumination optical system comprises (i) stop means having optical apertures irradiated with the radiation energy from said radiation source and (ii) a telecentric optical system, which is telecentric on the wafer side, for projecting images of said optical apertures upon corresponding portions of the wafer by using the radiation beams from said optical apertures.

Claim 54

An exposure apparatus for focusing an exposure beam upon a wafer through an exposure optical system to expose the wafer with the exposure beam, said apparatus comprising: an illumination optical system for illuminating first and second portions of the wafer, said illumination optical system including a first limiting portion for limiting light to be projected to the first portion of the wafer and a second limiting portion for limiting light to be projected to the second portion of the wafer, wherein an image of the first limiting portion is formed on the first portion of the wafer while an image of the second limiting portion is formed on the second portion of the wafer; an imaging optical system for imaging each portion of the wafer as each respective portion is illuminated by said illumination optical system, said imaging optical system comprising (i) a common optical system, having an optical axis, inclined relative to the wafer, for receiving reflection beams from the portions of the wafer, and (ii) a plurality of correction optical systems for independently receiving reflection beams from the portions of the wafer, said imaging optical system having approximately even imaging magnifications with respect to the imaging of the portions of the wafer upon a predetermined plane through said common optical system and said correction optical systems; position detecting means for detecting positions of images of the portions of the wafer upon said predetermined plane; and means for adjusting the spacing between the wafer and a focal plane upon which the exposure beam is focused, on the basis of the detection by said position detecting means.

Claim 55

An exposure apparatus for focusing an exposure beam upon a wafer through an exposure optical system to expose the wafer with the exposure beam, said apparatus comprising: an illumination optical system for illuminating first and second portions of the wafer, said illumination optical system including a first limiting portion for limiting light to be projected to the first portion of the wafer and a second limiting portion for limiting light to be projected to the second portion of the wafer, wherein an image of the first limiting portion is formed on the first portion of the wafer while an image of the second limiting portion is formed on the second portion of the wafer; an imaging optical system for imaging each portion of the wafer as each respective portion is illuminated by said illumination optical system, said imaging optical system comprising (i) a common optical system, having an optical axis, inclined relative to the wafer, for receiving reflection beams from the portions of the wafer, and (ii) a plurality of correction optical systems for independently receiving reflection beams from the portions of the wafer, said imaging optical system having approximately even imaging magnifications with respect to the imaging of the portions of the wafer upon a predetermined plane through said common optical system and said correction optical systems; position detecting means for detecting positions of images of the portions of the wafer upon said predetermined plane; and means for adjusting the spacing between the wafer and a focal plane upon which the exposure beam is focused, on the basis of the detection by said position detecting means.

Claim 56

An apparatus according to claim 46, wherein said illumination optical system has an optical axis inclined relative to the wafer, and optical axes of said illumination optical system and said imaging optical system substantially intersect each other on the wafer.

Claim 57

An apparatus according to claim 47, wherein said common optical system is disposed between the wafer and said correction optical systems, said plurality of correction optical systems are disposed in parallel to each other, and said common optical system projects images of the portions of the wafer upon a predetermined intermediate image plane by using reflection beams from the portions of the wafer, while said correction optical systems re-image the images of corresponding portions of the wafer, which are projected upon the predetermined intermediate image plane.

Claim 58

An apparatus according to claim 48, wherein said illumination optical system illuminates the portions of the wafer with different radiation beams in substantially the same direction, and said common optical system of said imaging optical system comprises a dual-telecentric optical system that is telecentric both on the wafer side and the segmented correction optical system side.

Claim 59

An apparatus according to claim 49, wherein the radiation beams illuminating the wafer have substantially the same size.

Claim 60

An apparatus according to claim 50, wherein each of the radiation beams has different wavelengths.

Claim 61

An apparatus according to claim 50, further comprising a radiation source for generating radiation energy, wherein said illumination optical system comprises (i) stop means having optical apertures irradiated with the radiation energy from said radiation source and (ii) a telecentric optical system, which is telecentric on the wafer side, for projecting images of said optical apertures upon corresponding portions of the wafer by using the radiation beams from said optical apertures.

Claim 62

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system, having an optical axis inclined with respect to the surface, for irradiating first and second portions of the surface with first and second light beams, respectively, wherein said irradiating optical system comprises a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the surface and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the surface, an image of the first limiting portion being formed on the first portion of the surface and an image of the second limiting portion being formed on the second portion of the surface and wherein the first and second light beams have substantially the same size upon the surface; a light receiving optical system, having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein the first and second beams, respectively reflected from the first and second portions of the surface, have substantially the same size on the predetermined image plane; and position detecting means for detecting positions of the first and second beams upon the predetermined image plane.

Claim 63

A surface position detecting device for detecting surface height at different portions of a surface being examined, said device comprising: an irradiating optical system, having an optical axis inclined with respect to the surface, for irradiating first and second portions of the surface with first and second light beams, respectively, wherein said irradiating optical system comprises a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the surface and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the surface, an image of the first limiting portion being formed on the first portion of the surface and an image of the second limiting portion being formed on the second portion of the surface and wherein the first and second light beams have substantially the same size upon the surface; a light receiving optical system, having an optical axis inclined with respect to the surface, for projecting upon a predetermined image plane images of the first and second irradiated portions of the surface, respectively, wherein the first and second beams, respectively reflected from the first and second portions of the surface, have substantially the same size on the predetermined image plane; and position detecting means for detecting positions of the first and second beams upon the predetermined image plane.

Claim 64

A device according to claim 53, wherein the first and second portions of the surface are disposed in a direction extending along a plane including the optical axes of said irradiating optical system and said light receiving optical system.

Claim 65

An exposure apparatus for projecting an exposure beam upon a wafer, said apparatus comprising: an irradiating optical system, having an optical axis inclined with respect to the wafer, for irradiating first and second portions of the wafer with first and second light beams, respectively, wherein said irradiating optical system comprises a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the wafer and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the wafer, an image of the first limiting portion being formed on the first portion of the wafer and an image of the second limiting portion being formed on the second portion of the wafer and wherein the first and second light beams have substantially the same size upon the wafer; a light receiving optical system, having an optical axis inclined with respect to the wafer, for projecting upon a predetermined image plane images of the first and second irradiated portions of the wafer, respectively, wherein the first and second beams, respectively reflected from the first and second portions of the wafer, have substantially the same size on the predetermined image plane; and position detecting means for detecting positions of the first and second beams upon the predetermined image plane; and means for adjusting the position of the wafer in the direction of a projection axis of the exposure optical system on the basis of the detection by said position detecting means.

Claim 66

An exposure apparatus for projecting an exposure beam upon a wafer, said apparatus comprising: an irradiating optical system, having an optical axis inclined with respect to the wafer, for irradiating first and second portions of the wafer with first and second light beams, respectively, wherein said irradiating optical system comprises a first limiting portion for limiting the first light beam so that the first light beam is projected to the first portion of the wafer and a second limiting portion for limiting the second light beam so that the second light beam is projected to the second portion of the wafer, an image of the first limiting portion being formed on the first portion of the wafer and an image of the second limiting portion being formed on the second portion of the wafer and wherein the first and second light beams have substantially the same size upon the wafer; a light receiving optical system, having an optical axis inclined with respect to the wafer, for projecting upon a predetermined image plane images of the first and second irradiated portions of the wafer, respectively, wherein the first and second beams, respectively reflected from the first and second portions of the wafer, have substantially the same size on the predetermined image plane; and position detecting means for detecting positions of the first and second beams upon the predetermined image plane; and means for adjusting the position of the wafer in the direction of a projection axis of the exposure optical system on the basis of the detection by said position detecting means.

Claim 67

An apparatus according to claim 55, wherein the first and second portions of the wafer are disposed in a direction extending along a plane including the optical axes of said irradiating optical system and said light receiving optical system.