US5411076A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate cooling device and substrate heat-treating apparatus
Assignee: Dainippon Screen Manufacturing Co Ltd
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Filing: 1994-02-07
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Granted: 1995-05-02
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Expires: 2014-02-07
Abstract
Abstract A treating chamber includes a cooling plate assembly for supporting and cooling a substrate and an auxiliary cooling plate disposed on or adjacent a ceiling of the treating chamber. The auxiliary cooling plate reduces an atmospheric temperature in a space above the substrate supported on the cooling plate assembly to a target temperature to which the substrate is to be cooled by the cooling plate assembly. Consequently, the substrate having undergone a high temperature treatment is cooled quickly to the target temperature, and improved uniformity of temperature distribution is secured over a substrate surface after the cooling step.
Inventors
- 👤 Minobu Matsunaga
- 👤 Yasuhiro Mizohata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:24
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0432
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
59 words
A substrate cooling device comprising: a treating chamber for receiving a substrate; cooling plate means for supporting said substrate in said treating chamber; and main cooling means for cooling said substrate supported on said cooling plate means; wherein said treating chamber comprises auxiliary cooling means disposed above said substrate supported on said cooling plate means for cooling said substrate.
Claim 2
Dependent Claim
59 words
A substrate cooling device comprising: a treating chamber for receiving a substrate; cooling plate means for supporting said substrate in said treating chamber; and main cooling means for cooling said substrate supported on said cooling plate means; wherein said treating chamber comprises auxiliary cooling means disposed above said substrate supported on said cooling plate means for cooling said substrate.
Claim 3
Dependent Claim
50 words
A substrate cooling device as defined in claim 1, wherein said auxiliary cooling means is operable to reduce an atmospheric temperature in a space above said substrate supported on said cooling plate means to a target temperature to which said substrate is to be cooled by said cooling plate means.
Claim 4
Dependent Claim
18 words
A substrate cooling device as defined in claim 1, wherein said main cooling means comprises a Peltier element.
Claim 5
Dependent Claim
24 words
A substrate cooling device as defined in claim 1, wherein said cooling plate means is constructed to support said substrate in tight contact therewith.
Claim 6
Dependent Claim
26 words
A substrate cooling device as defined in claim 1, wherein said cooling plate means is constructed to support said substrate with a slight gap maintained therebetween.
Claim 7
Dependent Claim
35 words
A substrate cooling device as defined in claim 1, wherein said auxiliary cooling means comprises a water-cooled auxiliary cooling plate having a lower surface thereof opposed to said substrate supported on said cooling plate means.
Claim 8
Dependent Claim
55 words
A substrate cooling device comprising: a treating chamber for receiving a substrate; cooling plate means for supporting said substrate in said treating chamber; and main cooling means for cooling said substrate supported on said cooling plate means; wherein said treating chamber comprises auxiliary cooling means disposed above said cooling plate means for cooling said substrate.
Claim 9
Dependent Claim
55 words
A substrate cooling device comprising: a treating chamber for receiving a substrate; cooling plate means for supporting said substrate in said treating chamber; and main cooling means for cooling said substrate supported on said cooling plate means; wherein said treating chamber comprises auxiliary cooling means disposed above said cooling plate means for cooling said substrate.
Claim 10
Dependent Claim
31 words
A substrate cooling device as defined in claim 7, wherein said cooling means are cooled to a temperature corresponding to a target temperature to which said substrate is to be cooled.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-05-01 | 1998-10-31 | 1999-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-05-01 | 2002-10-31 | 2003-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-05-01 | 2006-10-31 | 2007-05-02 | $7700.00 | Window Closed / Lapsed |