Contact structure of semiconductor device and method of manufacturing the same

Claim 2

A contact structure of a semiconductor device comprising: a semiconductor substrate; a lamination of at least first insulating film, first conductive film and second insulating film formed in that order on said semiconductor substrate; a through-hole formed to penetrate through at least said second insulating film; said first conductive film and a part of said first insulating film but not to entirely penetrate through said first insulating film so that a cross-section of said first conductive film is exposed to said through-hole at a portion of said through-hole which is distant from a bottom of said through-hole; and a second conductive film formed on an inner surface of said through-hole so that said second conductive film is insulated from said semiconductor substrate and electrically contacts with the cross-section of said first conductive film.

Claim 3

A contact structure according to claim 1, wherein each of said first and second insulating films contains silicon dioxide.

Claim 4

A contact structure according to claim 1, further comprising an etching stopping means formed in said lamination at a preselected position for preventing said through-hole, when said through-hole is formed by etching said lamination, from exceeding said preselected position.

Claim 5

A contact structure according to claim 3, wherein said etching stopping means is made of a material selected from polysilicon, metal silicon nitride and silicide.

Claim 6

A contact structure according to claim 1, wherein said first conductive film is made of a polysilicon.

Claim 7

A contact structure according to claim 5, wherein said first conductive film has a controlled film thickness.

Claim 8

A contact structure according to claim 1, wherein said second conductive film is made of a metallic material.

Claim 9

A contact structure of a semiconductor device comprising: a semiconductor substrate; a first insulating film formed on a surface of said semiconductor substrate; a lamination of at least a first conductive film formed on said first insulating film and a second insulating film formed on said first conductive film; a through-hole formed to penetrate through said lamination and a part of said first insulating film but not to penetrate through said first insulating film so that a cross-section of said first conductive film is exposed to said through-hole at a portion distant from a bottom of said through-hole; and a second conductive film formed on said lamination and having an extended portion extending into said through-hole so that said extended portion is insulated from said semiconductor substrate and electrically contact with the cross-section of the first conductive film thereby providing an electrical contact between said first conductive film and said second conductive film.

Claim 10

A contact structure of a semiconductor device comprising: a semiconductor substrate; a first insulating film formed on a surface of said semiconductor substrate; a lamination of at least a first conductive film formed on said first insulating film and a second insulating film formed on said first conductive film; a through-hole formed to penetrate through said lamination and a part of said first insulating film but not to penetrate through said first insulating film so that a cross-section of said first conductive film is exposed to said through-hole at a portion distant from a bottom of said through-hole; and a second conductive film formed on said lamination and having an extended portion extending into said through-hole so that said extended portion is insulated from said semiconductor substrate and electrically contact with the cross-section of the first conductive film thereby providing an electrical contact between said first conductive film and said second conductive film.

Claim 11

A contact structure according to claim 8, wherein said lamination further includes a third insulating film formed such that said second conductive film is disposed between said first insulating film and said third insulating film and an etching resist film formed in said lamination at a selected position and acting as an etching stopper for preventing said through-hole when said through-hole is formed by etching said lamination, from exceeding said selected position.

Claim 12

A contact structure according to claim 9, wherein said etching resist film is made of a material selected from polysilicon, metal, silicon nitride and silicide.

Claim 13

A contact structure according to claim 8, wherein said first conductive film is made of a polysilicon.

Claim 14

A contact structure according to claim 8, wherein said first conductive film has a controlled film thickness.