US5403467A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for through-hole plating of two-layer circuit boards and multilayers
Assignee: Heraeus Deutschland GmbH and Co KG
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Filing: 1993-01-19
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Granted: 1995-04-04
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Expires: 2013-01-19
Abstract
Abstract A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.
Inventors
- 👤 Friedrich Jonas
- 👤 Gerhard-Dieter Wolf
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 23:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H05K3/424; C; C25; C25D; C25D5/00; C25D5/54; C25D5/56; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0329; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/0796; H05K3/425; H05K3/427
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
95 words
A process for the production of through-hole plated circuit boards and multilayers, wherein a conductive layer of a polythiophene is produced on the walls of the through-holes provided in the board by treatment with an emulsion of 3,4-ethylenedioxythiophene, said process comprising the following steps: a) formation of through-holes in copper-laminated circuit boards (base materials); b) oxidative treatment of the through-holes with an alkaline potassium permanganate solution; c) rinsing with water; d) treatment with an emulsion consisting essentially of 3,4-ethylenedioxythiophene and water; e) treatment with an acid; f) rinsing with water; and g) electrodeposition of copper.
Claim 2
Dependent Claim
95 words
A process for the production of through-hole plated circuit boards and multilayers, wherein a conductive layer of a polythiophene is produced on the walls of the through-holes provided in the board by treatment with an emulsion of 3,4-ethylenedioxythiophene, said process comprising the following steps: a) formation of through-holes in copper-laminated circuit boards (base materials); b) oxidative treatment of the through-holes with an alkaline potassium permanganate solution; c) rinsing with water; d) treatment with an emulsion consisting essentially of 3,4-ethylenedioxythiophene and water; e) treatment with an acid; f) rinsing with water; and g) electrodeposition of copper.
Claim 3
Dependent Claim
18 words
A process as claimed in claim 1, wherein steps d and e are combined into a single step.
Claim 4
Dependent Claim
24 words
A process as claimed in claim 1, wherein the emulsion in step (d) consists of water and 0.1 to 10% by weight of 3,4-ethylenedioxythiophene.
Claim 5
Dependent Claim
24 words
A process as claimed in claim 1, wherein the emulsion in step (d) consists of water and 0.2 to 5% by weight of 3,4-ethylenedioxythiophene.
Claim 6
Dependent Claim
24 words
A process as claimed in claim 1, wherein the emulsion in step (d) consists of water and 0.5 to 2.5% by weight of 3,4-ethylenedioxythiophene.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-03 | 1998-10-03 | 1999-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-03 | 2002-10-03 | 2003-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-03 | 2006-10-03 | 2007-04-04 | $7700.00 | Window Closed / Lapsed |