US5401911A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Via and pad structure for thermoplastic substrates and method and apparatus for forming the same
Assignee: International Business Machines Corp
•
Filing: 1992-04-03
•
Granted: 1995-03-28
•
Expires: 2012-04-03
Abstract
Abstract An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer. Perfecting features of the substrate and method and apparatus for forming the substrate, embedding to a selected depth to form protrusions and recesses to assist in registration of a substrate layer with another substrate layer, metallization to form pads, improved connection between metallization patterns on the substrate and the conductive elements, the regulation of pressurization of substrate material by means of differently shaped dimples or a renewable surface and several alternative arrangements for positioning and embedding the conductive elements. Multiple types of conductive elements may be simultaneously embedded to different depths in a single substrate and from either or both sides thereof to form a variety of substrate structures.
Inventors
- 👤 Herbert Anderson
- 👤 Arthur Bross
- 👤 Julian G. Cempa
- 👤 Robert O. Lussow
- 👤 Donald E. Myers
- 👤 Thomas J. Walsh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 01:42
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4046; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/0141; H05K2201/09; H05K2201/09009; H05K2201/091; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2203/00; H05K2203/11; H05K2203/1105; H05K2203/1189; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01204; H10W72/01221; H10W72/01225; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49147; Y10T29/49151; Y10T29/49153
Claims Analysis
Total Claims: 100
Claim 1
Independent Claim
98 words
A substrate layer for an electronic module consisting essentially of a relatively non-conductive polymer material having a relatively conductive region therein formed by a process comprising the steps of embedding at least one conductive element in said relatively non-conductive polymer material of said substrate, said at least one conductive element having a maximum dimension which is approximately the same as or a fraction of a thickness of said polymer material, and causing reflow of at least a portion of said relatively non-conductive polymer material of said substrate around end portions of said conductive element during said embedding step.
Claim 2
Dependent Claim
98 words
A substrate layer for an electronic module consisting essentially of a relatively non-conductive polymer material having a relatively conductive region therein formed by a process comprising the steps of embedding at least one conductive element in said relatively non-conductive polymer material of said substrate, said at least one conductive element having a maximum dimension which is approximately the same as or a fraction of a thickness of said polymer material, and causing reflow of at least a portion of said relatively non-conductive polymer material of said substrate around end portions of said conductive element during said embedding step.
Claim 3
Dependent Claim
50 words
A substrate formed by the process recited in claim 1, wherein said process includes the further step of positioning said at least one conductive element adjacent a surface of said relatively non-conductive polymer material, and applying pressure to said relatively non-conductive polymer material at least partly through said conductive element.
Claim 4
Dependent Claim
29 words
A substrate formed by the process according to claim 2, wherein said positioning step includes placing said at least one conductive element in an aperture of a retainer plate.
Claim 5
Dependent Claim
40 words
A substrate formed by the process according to claim 2, wherein said positioning step includes placing said at least one conductive element in a predetermined location on a means for pressing said conductive element into said relatively non-conductive polymer material.
Claim 6
Dependent Claim
27 words
A substrate formed by the process as recited in claim 4, wherein said conductive element is retained in said predetermined location on said pressing means by suction.
Claim 7
Dependent Claim
49 words
A substrate formed by the process as recited in claim 4, wherein said predetermined location on said presser means includes a raised portion for holding said conductive element and said presser means embeds said conductive element a predetermined distance beyond the surface through which said conductive element is pressed.
Claim 8
Dependent Claim
33 words
A substrate formed by the process as recited in claim 6, wherein said raised portion includes a shaped portion and wherein said shaped portion limits said reflow of said relatively non-conductive polymer material.
Claim 9
Dependent Claim
25 words
A substrate formed by the process recited in claim 7, wherein said shaped portion of said raised portion of said presser means is generally frustro-conical.
Claim 10
Dependent Claim
27 words
A substrate formed by the process as recited in claim 6, wherein said conductive element is retained in said predetermined location on said pressing means by suction.
Claim 11
Dependent Claim
27 words
A substrate formed by the process as recited in claim 7, wherein said conductive element is retained in said predetermined location on said pressing means by suction.
Claim 12
Dependent Claim
27 words
A substrate formed by the process as recited in claim 8, wherein said conductive element is retained in said predetermined location on said pressing means by suction.
Claim 13
Dependent Claim
33 words
A substrate formed by the process as recited in claim 3, wherein said at least one conductive element is pressed into said relatively non-conductive polymer material from said aperture by a driver means.
Claim 14
Dependent Claim
31 words
A substrate formed by the process as recited in claim 12, including the further step of limiting said reflow in accordance with a portion of the surface of said driver means.
Claim 15
Dependent Claim
34 words
A substrate formed by the process as recited in claim 13, wherein a portion of a surface of said driver means substantially conforms to an surface portion of said at least one conductive means.
Claim 16
Dependent Claim
22 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet.
Claim 17
Dependent Claim
42 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet having at least one through hole formed therein at a location at which said conductive element is to be embedded.
Claim 18
Dependent Claim
54 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet having a thickness and having at least one hole formed therein to a depth which is less than said thickness at a location at which said conductive element is to be embedded.
Claim 19
Dependent Claim
25 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet of thermoplastic material.
Claim 20
Dependent Claim
45 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet of thermoplastic material having at least one through hole formed therein at a location at which said conductive element is to be embedded.
Claim 21
Dependent Claim
57 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet of thermoplastic material having a thickness and having at least one hole formed therein to a depth which is less than said thickness at a location at which said conductive element is to be embedded.
Claim 22
Dependent Claim
26 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet of liquid crystal polymer.
Claim 23
Dependent Claim
46 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet of liquid crystal polymer having at least one through hole formed therein at a location at which said conductive element is to be embedded.
Claim 24
Dependent Claim
58 words
A substrate formed by the process as recited in claim 1, wherein said relatively non-conductive polymer is formed as a solid sheet of liquid crystal polymer having a thickness and having at least one hole formed therein to a depth which is less than said thickness at a location at which said conductive element is to be embedded.
Claim 25
Dependent Claim
28 words
A substrate formed by the process as recited in claim 1, further including the step of forming a conductive layer on a surface portion of said conductive element.
Claim 26
Dependent Claim
23 words
A substrate formed by the process as recited in claim 1, wherein said conductive element is in the form of a conductive ball.
Claim 27
Dependent Claim
28 words
A substrate formed by the process as recited in claim 25, further including the step of forming a conductive layer on a surface portion of said conductive element.
Claim 28
Dependent Claim
20 words
A substrate formed by the process as recited in claim 26, wherein said conductive layer includes a reflowable conductive material.
Claim 29
Dependent Claim
24 words
A substrate formed by the process as recited in claim 1, wherein said conductive element is in the form of a generally cylindrical pin.
Claim 30
Dependent Claim
28 words
A substrate formed by the process as recited in claim 28, further including the step of forming a conductive layer on a surface portion of said conductive element.
Claim 31
Dependent Claim
20 words
A substrate formed by the process as recited in claim 29, wherein said conductive layer includes a reflowable conductive material.
Claim 32
Dependent Claim
54 words
A substrate formed by the process as recited in claim 24, wherein said relatively non-conductive polymer material is formed as a solid sheet having a thickness and including the further step of forming a hole through at least a portion of said thickness at a location where said conductive element is to be embedded.
Claim 33
Dependent Claim
31 words
A substrate formed by the process as recited in claim 1, including the step of forming a conductive layer on a portion of a surface of said relatively non-conductive polymer material.
Claim 34
Dependent Claim
72 words
A relatively non-conducting polymer substrate having at least one conducting element embedded therein and retained in said substrate by said relatively non-conducting polymer material of said substrate which is reflowed around end portions of said conducting element when said at least one conducting element is embedded in said substrate, said at least one conducting element having a maximum dimension approximately equal to or a fraction of a thickness of said polymer substrate.
Claim 35
Dependent Claim
72 words
A relatively non-conducting polymer substrate having at least one conducting element embedded therein and retained in said substrate by said relatively non-conducting polymer material of said substrate which is reflowed around end portions of said conducting element when said at least one conducting element is embedded in said substrate, said at least one conducting element having a maximum dimension approximately equal to or a fraction of a thickness of said polymer substrate.
Claim 36
Dependent Claim
21 words
A substrate as recited in claim 33, wherein said at least one conducting element is in the form of a pin.
Claim 37
Dependent Claim
21 words
A substrate as recited in claim 33, wherein said at least one conducting element is in the form of a ball.
Claim 38
Dependent Claim
21 words
A substrate as recited in claim 35, wherein said relatively non-conducting polymer material is in the form of a solid sheet.
Claim 39
Dependent Claim
21 words
A substrate as recited in claim 36, further including a conductive layer on at least a portion of said solid sheet.
Claim 40
Dependent Claim
25 words
A substrate as recited in claim 33, wherein said at least one conductive element includes a layer of conductive material on a surface portion thereof.
Claim 41
Dependent Claim
16 words
A substrate as recited in claim 38, wherein said conductive material includes a reflowable conductive material.
Claim 42
Dependent Claim
52 words
A substrate as recited in claim 38, wherein said relatively non-conductive material is in the form of a solid sheet and includes means for limiting damage to said layer of conductive material on said at least one conductive element when said at least one conductive element is embedded in said solid sheet.
Claim 43
Dependent Claim
53 words
A substrate as recited in claim 40, wherein a portion of said solid sheet has a predetermined thickness and said means for limiting damage to said layer of conductive material comprises a hole through at least a portion of said predetermined thickness at a location where said conductive element is to be embedded.
Claim 44
Dependent Claim
25 words
A substrate as recited in claim 37, wherein said at least one conductive element includes a layer of conductive material on a surface portion thereof.
Claim 45
Dependent Claim
43 words
A substrate as recited in claim 42, wherein said relatively non-conductive material includes means for limiting damage to said layer of conductive material on said at least one conductive element when said at least one conductive element is embedded in said solid sheet.
Claim 46
Dependent Claim
42 words
A substrate as recited in claim 43, wherein said means for limiting damage to said layer of conductive material comprises a hole through at least a portion of said predetermined thickness at a location where said conductive element is to be embedded.
Claim 47
Dependent Claim
23 words
A substrate as recited in claim 33, wherein said conductive means forms a protrusion from a surface of said relatively non-conductive polymer material.
Claim 48
Dependent Claim
23 words
A substrate as recited in claim 33, wherein said conductive element forms a recess in a surface of said relatively non-conductive polymer material.
Claim 49
Dependent Claim
23 words
A substrate as recited in claim 45, wherein said conductive element forms a recess in a surface of said relatively non-conductive polymer material.
Claim 50
Dependent Claim
28 words
A substrate as recited in claim 47, wherein said recess is located to receive a protrusion formed on another substrate when correctly registered therewith in a multi-layer assembly.
Claim 51
Dependent Claim
28 words
A substrate as recited in claim 47, wherein said protrusion is located to enter a recess formed on another substrate when correctly registered therewith in a multi-layer assembly.
Claim 52
Dependent Claim
14 words
A substrate as recited in claim 48, wherein said recess is generally frustro-conically shaped.
Claim 53
Dependent Claim
25 words
A substrate as recited in claim 37, wherein said reflowed material of said substrate retains a portion of said conductive layer against said conductive element.
Claim 54
Dependent Claim
46 words
A substrate as recited in claim 33, including a plurality of conductive elements embedded at a common location with reference to a surface of said relatively non-conductive polymer material and further including a conductive fill material between at least some of said plurality of conductive elements.
Claim 55
Dependent Claim
15 words
A substrate as recited in claim 47, further including conductive fill material in said recess.
Claim 56
Dependent Claim
119 words
Apparatus for forming a relatively non-conductive polymer substrate for an electronic module having conductive regions therein including means for supporting a volume of relatively non-conducting polymer material in the form of a layer, and means for positioning at least one conductive element having a maximum dimension approximately equal to or a fraction of a thickness of said layer adjacent a surface of a volume of relatively non-conductive polymer material, and introducing said at least one conductive element into said relatively non-conductive polymer material while causing reflowing of a portion of said relatively non-conductive polymer material by said means for supporting a volume of relatively non-conductive polymer of said layer around end portions of said at least one conductive element.
Claim 57
Dependent Claim
119 words
Apparatus for forming a relatively non-conductive polymer substrate for an electronic module having conductive regions therein including means for supporting a volume of relatively non-conducting polymer material in the form of a layer, and means for positioning at least one conductive element having a maximum dimension approximately equal to or a fraction of a thickness of said layer adjacent a surface of a volume of relatively non-conductive polymer material, and introducing said at least one conductive element into said relatively non-conductive polymer material while causing reflowing of a portion of said relatively non-conductive polymer material by said means for supporting a volume of relatively non-conductive polymer of said layer around end portions of said at least one conductive element.
Claim 58
Dependent Claim
28 words
Apparatus as recited in claim 54, wherein said means for supporting said volume of relatively non-conductive polymer material includes a surface having at least one dimple formed therein.
Claim 59
Dependent Claim
14 words
Apparatus as recited in claim 55, wherein said dimple is generally conical in shape.
Claim 60
Dependent Claim
22 words
Apparatus as recited in claim 54, wherein said means for supporting said volume of relatively non-conductive polymer material includes a renewable surface.
Claim 61
Dependent Claim
12 words
Apparatus as recited in claim 57, wherein said renewable surface is resilient.
Claim 62
Dependent Claim
12 words
Apparatus as recited in claim 57, wherein said renewable surface is porous.
Claim 63
Dependent Claim
12 words
Apparatus as recited in claim 57, wherein said renewable surface is abrasive.
Claim 64
Dependent Claim
65 words
Apparatus as recited in claim 54, wherein said means for positioning said at least one conductive element and introducing said at least one conductive element into said relatively non-conductive polymer material includes an apertured plate for positioning said at least one conductive element and a driver means for pressing said at least one conductive element from said apertured plate into said relatively non-conductive polymer material.
Claim 65
Dependent Claim
43 words
Apparatus as recited in claim 54, wherein said means for positioning said at least one conductive element and introducing said at least one conductive element into said relatively non-conductive polymer material includes a raised portion for positioning said at least one conductive element.
Claim 66
Dependent Claim
13 words
Apparatus as recited in claim 62, wherein said raised portion is frustro-conically shaped.
Claim 67
Dependent Claim
52 words
Apparatus as recited in claim 54, wherein said means for positioning said at least one conductive element and introducing said at least one conductive element into said relatively non-conductive polymer material includes a means for retaining said at least one conductive element in a predetermined position by means of a partial vacuum.
Claim 68
Independent Claim
116 words
A method of forming a relatively non-conductive polymer substrate of a relatively non-conductive polymer material, said substrate having conductive regions therein including the steps of supporting a volume of relatively non-conducting polymer material in the form of a layer, positioning at least one conductive element adjacent a surface of a volume of relatively non-conductive polymer material, said at least one conductive element having a maximum dimension which is approximately equal to or a fraction of a thickness of said layer, and introducing said at least one conductive element into said relatively non-conductive polymer material while causing reflowing of a portion of said relatively non-conductive polymer material of said layer at end portions of said conductive element.
Claim 69
Independent Claim
116 words
A method of forming a relatively non-conductive polymer substrate of a relatively non-conductive polymer material, said substrate having conductive regions therein including the steps of supporting a volume of relatively non-conducting polymer material in the form of a layer, positioning at least one conductive element adjacent a surface of a volume of relatively non-conductive polymer material, said at least one conductive element having a maximum dimension which is approximately equal to or a fraction of a thickness of said layer, and introducing said at least one conductive element into said relatively non-conductive polymer material while causing reflowing of a portion of said relatively non-conductive polymer material of said layer at end portions of said conductive element.
Claim 70
Dependent Claim
30 words
A method as recited in claim 65, including the further step of heating said substrate to a temperature below that at which said relatively non-conductive polymer material will spontaneously flow.
Claim 71
Dependent Claim
25 words
A method as recited in claim 65, wherein said introducing step is carried out to a predetermined depth relative to a surface of said layer.
Claim 72
Dependent Claim
33 words
A method as recited in claim 65, including the further step of depositing a metallized layer on at least a portion of a surface of said layer of said relatively non-conductive polymer material.
Claim 73
Dependent Claim
30 words
A method as recited in claim 68, wherein said introducing step is carried out to a predetermined depth relative to said surface of said layer of relatively non-conductive polymer material.
Claim 74
Dependent Claim
30 words
A method as recited in claim 68, wherein said reflowing of said relatively non-conductive polymer material deforms a portion of said metallized layer against said at least one conductive element.
Claim 75
Dependent Claim
29 words
A method as recited in claim 65, including the further step of forming an aperture through at least a portion of said layer of said relatively non-conductive polymer material.
Claim 76
Dependent Claim
29 words
A method as recited in claim 68, including the further step of forming an aperture through at least a portion of said layer of said relatively non-conductive polymer material.
Claim 77
Dependent Claim
23 words
A method as recited in claim 65, including the further step of forming a conductive coating or said at least one conductive element.
Claim 78
Dependent Claim
29 words
A method as recited in claim 73, including the further step of forming an aperture through at least a portion of said layer of said relatively non-conductive polymer material.
Claim 79
Dependent Claim
22 words
A method as recited in claim 68, including the further step of forming a conductive coating said at least one conductive element.
Claim 80
Dependent Claim
29 words
A method as recited in claim 75, including the further step of forming an aperture through at least a portion of said layer of said relatively non-conductive polymer material.
Claim 81
Dependent Claim
26 words
A method as recited in claim 65, including the further step of positioning a plurality of said conductive elements in a aperture of an apertured plate.
Claim 82
Dependent Claim
27 words
A method as recited in claim 67, wherein said introducing step is carried out to a depth below said surface to form a recess in said surface.
Claim 83
Dependent Claim
28 words
A method as recited in claim 67, wherein said introducing step is carried out to a depth relative to said surface to form a protrusion from said surface.
Claim 84
Dependent Claim
30 words
A method as recited in claim 67, wherein said introducing step is carried out to a depth below said surface to form a protrusion from another surface of said layer.
Claim 85
Dependent Claim
33 words
A method as recited in claim 65, including the further step of depositing a conductive coating on a surface portion of said conductive element which is exposed by said relatively non-conductive polymer material.
Claim 86
Dependent Claim
27 words
A method as recited in claim 65, wherein said supporting step includes supporting said volume of relatively non-conductive polymer material on a surface of a resilient material.
Claim 87
Dependent Claim
27 words
A method as recited in claim 65, wherein said supporting step includes supporting said volume of relatively non-conductive polymer material on a surface of a porous material.
Claim 88
Dependent Claim
27 words
A method as recited in claim 65, wherein said supporting step includes supporting said volume of relatively non-conductive polymer material on a surface of an abrasive material.
Claim 89
Dependent Claim
25 words
A method as recited in claim 65 wherein said introducing step includes guiding said conductive element within said volume of said relatively non-conducting polymer material.
Claim 90
Dependent Claim
31 words
A method as recited in claim 65, wherein said introducing step includes causing a wiping of a portion of a surface of said conductive element with said relatively non-conductive polymer material.
Claim 91
Dependent Claim
29 words
A method as recited in claim 68, wherein said introducing step includes causing a wiping of a portion of a surface of said conductive element with said metallized layer.
Claim 92
Dependent Claim
21 words
A method as recited in claim 65, including the further step of assembling said relatively non-conductive polymer substrate with another substrate.
Claim 93
Dependent Claim
24 words
A method as recited in claim 65, including the further step of assembling said relatively non-conductive polymer substrate with another relatively non-conductive polymer substrate.
Claim 94
Dependent Claim
41 words
A method as recited in claim 67, wherein said introducing step is carried out to a depth relative to said surface to form a recess on one side of said substrate and a protrusion from an opposite surface of said substrate.
Claim 95
Dependent Claim
51 words
A method as recited in claim 90, including the further step of assembling said relatively non-conductive polymer substrate with another relatively non-conductive polymer substrate and wherein said protrusion of one said substrate and said another substrate is received by a recess of the other of said substrate and said another substrate.
Claim 96
Dependent Claim
33 words
A method as recited in claim 90, including the further step of locating another substrate on said relatively non-conductive polymer substrate by means of at least one of said protrusion and said recess.
Claim 97
Independent Claim
82 words
A method comprising the steps of embedding a conductive element into a relatively non-conductive polymer material at a site thereon having a predetermined area extending around said conductive element, and substantially eliminating a dimensional change of said predetermined area of said site during and subsequent to said embedding step by application of heating to said polymer material, prior to said embedding step, to heat said polymer material to a temperature slightly below a temperature at which said polymer material will spontaneously flow.
Claim 98
Independent Claim
82 words
A method comprising the steps of embedding a conductive element into a relatively non-conductive polymer material at a site thereon having a predetermined area extending around said conductive element, and substantially eliminating a dimensional change of said predetermined area of said site during and subsequent to said embedding step by application of heating to said polymer material, prior to said embedding step, to heat said polymer material to a temperature slightly below a temperature at which said polymer material will spontaneously flow.
Claim 99
Dependent Claim
28 words
A method as recited in claim 93, wherein said step of eliminating dimensional change is accomplished by using a thermoplastic material within said predetermined area of said site.
Claim 100
Dependent Claim
30 words
A method as recited in claim 93, wherein said step of eliminating dimensional change is accomplished by using a liquid crystal polymer material within said predetermined area of said site.
References Cited (Backward Citations)
US3148310A
Cited
US3541222A
Cited
US3835531A
Cited
US3998824A
Cited
US4050756A
Cited
US4136275A
Cited
US4346516A
Cited
US4966857A
Cited
US4644101A
Cited
US4761871A
Cited
US4902857A
Cited
US4931598A
Cited
US5121299A
Cited
US5172303A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-27 | 1998-09-26 | 1999-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-27 | 2002-09-26 | 2003-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-27 | 2006-09-26 | 2007-03-28 | $7700.00 | Window Closed / Lapsed |