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US5399897A Expired / Lapsed US ⏱️ 0.0 years remaining

Microstructure and method of making such structure

Assignee: Raytheon Co
•
Filing: 1993-11-29
•
Granted: 1995-03-21
•
Expires: 2013-11-29
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Abstract

Abstract An integrated circuit having a semiconductor layer having formed therein a electronic circuit. An electrical device, electrically connected to the electronic circuit, has a corrugated platform supported over, displaced from, and integrally formed with, the substrate. In a preferred embodiment the electrical device is a bolometer and the electronic circuit is a read out circuit for the device. The platform includes a surface member and a leg, a proximate end of the leg being disposed on the substrate and the distal end being elevated from the substrate and terminating at the surface member. Preferably the leg and the surface member are corrugated. The supporting surface has a corrugation parallel with the leg. The surface member is supported, as a corrugated air-bridge, over the surface of the substrate by corrugated legs. The temperature sensitive resistive material is formed over the corrugated surface member. Electrical conductors are formed over the legs, one end being in contact with the electrical contacts and the other ends being connected to the portions of the temperature sensitive resistive material adjacent the distal ends of the legs.

Inventors

  • 👤 Brian T. Cunningham
  • 👤 Patricia V. Richard

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 03:00
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; G; G01; G01J; G01J5/00; G01J5/10; G01J5/20

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 59 words
A integrated circuit, comprising: a) a semiconductor layer; b) a electronic circuit formed in the semiconductor layer; c) an electrical device electrically connected to the electronic circuit, such electrical device having a corrugated platform with a surface member suspended over the semiconductor layer; and d) wherein such surface member has a supported edge portion and an unsupported edge portion.
Claim 2
Dependent Claim 59 words
A integrated circuit, comprising: a) a semiconductor layer; b) a electronic circuit formed in the semiconductor layer; c) an electrical device electrically connected to the electronic circuit, such electrical device having a corrugated platform with a surface member suspended over the semiconductor layer; and d) wherein such surface member has a supported edge portion and an unsupported edge portion.
Claim 3
Dependent Claim 55 words
The integrated circuit recited in claim 1 wherein the platform has a leg, a proximate end of the leg being disposed on the semiconductor layer and a distal end being elevated from the semiconductor layer and terminating at the supported edge portion of the surface member to support the surface member over the semiconductor layer.
Claim 4
Dependent Claim 12 words
The integrated circuit recited in claim 2 wherein the leg is corrugated.
Claim 5
Dependent Claim 13 words
The integrated circuit recited in claim 2 wherein the surface member is corrugated.
Claim 6
Dependent Claim 45 words
The integrated circuit recited in claim 2 wherein the surface member has a corrugation formed therein, and wherein such leg has a portion which rises from the semiconductor layer to an elevated region along a predetermined direction, such corrugation being parallel with the predetermined direction.
Claim 7
Dependent Claim 16 words
The integrated circuit recited in claim 3 wherein the leg and the surface member are corrugated.
Claim 8
Dependent Claim 14 words
The integrated circuit recited in claim 1 wherein the electronic device is a bolometer.
Claim 9
Dependent Claim 39 words
A structure, comprising: a) a substrate having a semiconductor layer; b) a corrugated platform having a surface member suspended over the substrate and the semiconductor layer, the surface member having a supported edge portion and an unsupported edge portion.
Claim 10
Dependent Claim 39 words
A structure, comprising: a) a substrate having a semiconductor layer; b) a corrugated platform having a surface member suspended over the substrate and the semiconductor layer, the surface member having a supported edge portion and an unsupported edge portion.
Claim 11
Dependent Claim 51 words
The structure recited in claim 8 wherein the platform has a leg, a proximate end of the leg being disposed on the substrate and a distal end being elevated from the substrate and terminating at the supported edge portion of the surface member to support the platform over the semiconductor layer.
Claim 12
Dependent Claim 11 words
The structure recited in claim 9 wherein the leg is corrugated.
Claim 13
Dependent Claim 12 words
The structure recited in claim 9 wherein the surface member is corrugated.
Claim 14
Dependent Claim 45 words
The structure circuit recited in claim 9 wherein the surface member has a corrugation formed therein, and wherein such leg has a portion which rises from the semiconductor layer to an elevated region along a predetermined direction, such corrugation being parallel with the predetermined direction.
Claim 15
Dependent Claim 15 words
The structure recited in claim 10 wherein the leg and the surface member are corrugated.

References Cited (Backward Citations)

US3621154A Cited
US5177579A Cited
US5193911A Cited
US5129983A Cited
US5058856A Cited
US5298748A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-03-20 1998-09-19 1999-03-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-03-20 2002-09-19 2003-03-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-03-20 2006-09-19 2007-03-21 $7700.00 Window Closed / Lapsed

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