Appliance for attaching heat sink to pin grid array and socket

Claim 2

An appliance for attaching a heat sink having a plurality of fins extending therefrom to an integrated circuit chip and a socket having a plurality of pins extending therefrom comprising: a leaf spring having two parallel longitudinally extending elements creating one longitudinal slot therebetween, said longitudinal extending for the entire length of said leaf spring; and two clip elements, each of said clip elements attached to opposite ends of said longitudinally extending elements, each of said clip elements provided with a top portion and a bottom portion, said longitudinally extending elements of said leaf spring attached to each of said clip elements to form an H-shaped securing appliance, the bottom portion of each of said clip elements provided with feet extending transversely therefrom; wherein when said appliance is applied to said heat sink, said integrated circuit and said socket, a plurality of said fins would extend through said slot and each of said feet of said clip elements would extend under said socket to secure said heat sink, said integrated circuit and said socket together.

Claim 3

The appliance in accordance with claim 1, wherein each of said feet are provided with a plurality of hollowed out portions, each of said hollowed out portion adapted to enclose a portion of at least one of the pins extending from the socket.

Claim 4

An electronic package comprising: a planar heat sink provided with a plurality of fins extending therefrom; a planar integrated pin grid array chip having an integrated circuit thereon, the perimeter of said chip equal to the perimeter of said heat sink; a planar socket having a perimeter equal to the perimeters of said heat sink and said chip; a device for securing said heat sink above said chip which in turn is provided above said socket, said device comprising a spring provided with two parallel spring surfaces thereby creating one longitudinal slot therebetween, said device further including two clip elements, each clip attached to opposite ends of said spring, each clip provided with a top section and a bottom section and a means intermediate said top section and bottom section for affixing said spring thereto, each of said clips further provided with feet extending transversely to said bottom section; wherein when said appliance is applied to said heat sink, said integrated circuit and said socket, a plurality of said fins would extend through said slot and each of said feet of said clip elements would extend under said socket to removably secure said heat sink, said integrated circuit and said socket together.

Claim 5

An electronic package comprising: a planar heat sink provided with a plurality of fins extending therefrom; a planar integrated pin grid array chip having an integrated circuit thereon, the perimeter of said chip equal to the perimeter of said heat sink; a planar socket having a perimeter equal to the perimeters of said heat sink and said chip; a device for securing said heat sink above said chip which in turn is provided above said socket, said device comprising a spring provided with two parallel spring surfaces thereby creating one longitudinal slot therebetween, said device further including two clip elements, each clip attached to opposite ends of said spring, each clip provided with a top section and a bottom section and a means intermediate said top section and bottom section for affixing said spring thereto, each of said clips further provided with feet extending transversely to said bottom section; wherein when said appliance is applied to said heat sink, said integrated circuit and said socket, a plurality of said fins would extend through said slot and each of said feet of said clip elements would extend under said socket to removably secure said heat sink, said integrated circuit and said socket together.