US5394301A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Arrangement for dissipating heat from power components assembled on a printed-circuit board
Assignee: Robert Bosch GmbH
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Filing: 1994-01-28
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Granted: 1995-02-28
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Expires: 2014-01-28
Abstract
Abstract An arrangement for dissipating heat from power components assembled on a printed-circuit board dissipates heat generated in the power components to the side of the printed-circuit board that is removed from the components. The printed-circuit board may have heat-transfer bore holes, and a heat-conducting material applied in the area of the power components, the heat-transfer bore holes, and the side of the printed-circuit board facing away from the power components. The side of the printed-circuit board that is removed from the power components may be coated with an insulating enamel and with a flexible heat-conducting enamel.
Inventors
- 👤 Reinhard Fassel
- 👤 Herbert Klinger
- 👤 Hartmut Zoebl
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:27
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K7/00; H05K7/20; H05K7/2039; H05K7/205; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K3/00; H05K3/0058; H05K3/0061; H05K3/0094; H05K3/22; H05K3/28; H05K3/40; H05K3/42
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
126 words
An arrangement for dissipating heat from power components assembled on a printed-circuit board, comprising: a) a printed-circuit board having a plurality of heat transfer bore holes distributed therethrough, the bore holes defining inner walls, and the printed-circuit board having a first side for assembling power components thereon and a second side facing away from the power components; b) a heat-conducting material applied on the first side of the printed circuit board in the area of the power components, on the inner walls of the bore holes, and on the second side of the printed-circuit board; c) an insulating enamel coating applied on the heat-conducting material on the second side of the printed-circuit board; and d) a flexible heat-conducting enamel layer applied to the insulating enamel coating.
Claim 2
Dependent Claim
126 words
An arrangement for dissipating heat from power components assembled on a printed-circuit board, comprising: a) a printed-circuit board having a plurality of heat transfer bore holes distributed therethrough, the bore holes defining inner walls, and the printed-circuit board having a first side for assembling power components thereon and a second side facing away from the power components; b) a heat-conducting material applied on the first side of the printed circuit board in the area of the power components, on the inner walls of the bore holes, and on the second side of the printed-circuit board; c) an insulating enamel coating applied on the heat-conducting material on the second side of the printed-circuit board; and d) a flexible heat-conducting enamel layer applied to the insulating enamel coating.
Claim 3
Dependent Claim
14 words
The arrangement as set forth in claim 1, wherein the heat-conducting material includes copper.
Claim 4
Dependent Claim
24 words
The arrangement as set forth in claim 1, wherein at least one additional flexible heat-conducting enamel layer is applied to the insulating enamel coating.
Claim 5
Dependent Claim
24 words
The arrangement as set forth in claim 2, wherein at least one additional flexible heat-conducting enamel layer is applied to the insulating enamel coating.
Claim 6
Dependent Claim
23 words
The arrangement as set forth in claim 1, wherein the insulating enamel coating completely covers and seals off the heat transfer bore holes.
Claim 7
Dependent Claim
23 words
The arrangement as set forth in claim 2, wherein the insulating enamel coating completely covers and seals off the heat transfer bore holes.
Claim 8
Dependent Claim
21 words
The arrangement as set forth in claim 1, further comprising a cooling plate, flatly affixed to the flexible heat-conducting enamel layer.
Claim 9
Dependent Claim
21 words
The arrangement as set forth in claim 2, further comprising a cooling plate, flatly affixed to the flexible heat-conducting enamel layer.
Claim 10
Dependent Claim
21 words
The arrangement as set forth in claim 3, further comprising a cooling plate, flatly affixed to the flexible heat-conducting enamel layer.
Claim 11
Dependent Claim
21 words
The arrangement as set forth in claim 4, further comprising a cooling plate, flatly affixed to the flexible heat-conducting enamel layer.
Claim 12
Dependent Claim
21 words
The arrangement as set forth in claim 5, further comprising a cooling plate, flatly affixed to the flexible heat-conducting enamel layer.
Claim 13
Dependent Claim
21 words
The arrangement as set forth in claim 6, further comprising a cooling plate, flatly affixed to the flexible heat-conducting enamel layer.
Claim 14
Independent Claim
140 words
A method for arranging an apparatus for dissipating heat from power components assembled on a printed-circuit board, comprising the steps of: a) forming a printed-circuit board having a plurality of heat transfer bore holes distributed therethrough, the bore holes defining inner walls, and the printed-circuit board having a first side and a second side; b) assembling power components on the first side of the printed-circuit board; c) applying a heat-conducting material on the first side of the printed-circuit board in the area of the power components, on the inner walls of the bore holes, and on the second side of the printed-circuit board facing away from the power components; d) applying an insulating enamel coating on the heat-conducting material on the second side of the printed-circuit board; and e) applying a flexible heat-conducting enamel layer to the insulating enamel coating.
Claim 15
Independent Claim
140 words
A method for arranging an apparatus for dissipating heat from power components assembled on a printed-circuit board, comprising the steps of: a) forming a printed-circuit board having a plurality of heat transfer bore holes distributed therethrough, the bore holes defining inner walls, and the printed-circuit board having a first side and a second side; b) assembling power components on the first side of the printed-circuit board; c) applying a heat-conducting material on the first side of the printed-circuit board in the area of the power components, on the inner walls of the bore holes, and on the second side of the printed-circuit board facing away from the power components; d) applying an insulating enamel coating on the heat-conducting material on the second side of the printed-circuit board; and e) applying a flexible heat-conducting enamel layer to the insulating enamel coating.
Claim 16
Dependent Claim
14 words
The method as set forth in claim 13, wherein the heat-conducting material includes copper.
Claim 17
Dependent Claim
27 words
The method as set forth in claim 13, further comprising the step of applying at least one additional flexible heat-conducting enamel layer to the insulating enamel coating.
Claim 18
Dependent Claim
27 words
The method as set forth in claim 14, further comprising the step of applying at least one additional flexible heat-conducting enamel layer to the insulating enamel coating.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-02-27 | 1998-08-29 | 1999-02-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-02-27 | 2002-08-29 | 2003-02-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-02-27 | 2006-08-29 | 2007-02-28 | $7700.00 | Window Closed / Lapsed |