US5383759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low particle wafer automatic flat aligner
Assignee: Individual
•
Filing: 1993-08-20
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Granted: 1995-01-24
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Expires: 2013-08-20
Abstract
Abstract Disclosed is an apparatus and method for aligning the flat edges of semiconductor wafers in a wafer cassette. The apparatus includes a roller and alignment blade mounted in a frame on which the wafer cassette is mounted. A motor mechanism rotates the roller and alignment blade to align the wafer flat edges.
Inventors
- 👤 Gaille Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:42
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/136
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
115 words
An apparatus for aligning flat edges of semiconductor wafers mounted in a cassette, comprising: a base, including a housing, upon which the cassette is mounted; a longitudinally extending roller located under said cassette in rolling contact with wafers in said cassette; and a pivotally mounted alignment blade having its longitudinal axis extending parallel to said roller, said alignment blade being positioned adjacent said roller and when pivoted upward, engages said wafers at a point adjacent the flat edge of each wafer; stopping wafer rotation; whereby, when the alignment blade is pivoted downward and when said roller is rotated a predetermined number of revolutions, the flat edges of said wafers are aligned at a desired location.
Claim 2
Independent Claim
115 words
An apparatus for aligning flat edges of semiconductor wafers mounted in a cassette, comprising: a base, including a housing, upon which the cassette is mounted; a longitudinally extending roller located under said cassette in rolling contact with wafers in said cassette; and a pivotally mounted alignment blade having its longitudinal axis extending parallel to said roller, said alignment blade being positioned adjacent said roller and when pivoted upward, engages said wafers at a point adjacent the flat edge of each wafer; stopping wafer rotation; whereby, when the alignment blade is pivoted downward and when said roller is rotated a predetermined number of revolutions, the flat edges of said wafers are aligned at a desired location.
Claim 3
Dependent Claim
24 words
The apparatus according to claim 1, including a switch actuated by the placing of the cassette on said base for initiating an alignment process.
Claim 4
Dependent Claim
27 words
The apparatus according to claim 1, including a first motor for providing the pivoting action of the alignment blade and a second motor for rotating the roller.
Claim 5
Dependent Claim
40 words
The apparatus according to claim 1, wherein said housing is at one end of said base, and said roller and alignment blade extend from said housing to an end of said base opposite the end where the housing is located.
Claim 6
Dependent Claim
30 words
The apparatus according to claim 1, wherein the pivotal action of the alignment blade is produced by a cam and a follower arm, the cam being rotated by a motor.
Claim 7
Dependent Claim
25 words
The apparatus according to claim 1, wherein the ratio of the diameter of the roller to the diameter of the wafer is 1 to 16.
Claim 8
Dependent Claim
24 words
The apparatus according to claim 1, wherein said roller is coated with a tacky polymer to prevent slipping of the wafers on the roller.
Claim 9
Independent Claim
122 words
An apparatus for aligning flat edges of semiconductor wafers mounted in a cassette, comprising: a base, including a housing, upon which the cassette is mounted; a roller, driven by a first motor, extending the length of the base under said cassette in rolling contact with wafers in said cassette; and a pivotally mounted alignment blade, driven by a second motor, having its longitudinal axis extending parallel to said roller, said alignment blade, when pivoted upward, engaging said wafers at a point adjacent the flat edge of each wafer, stopping wafer rotation; whereby, when the alignment blade is pivoted downward and when said roller is rotated a predetermined number of revolutions, the flat edges of said wafers are aligned at a desired location.
Claim 10
Independent Claim
122 words
An apparatus for aligning flat edges of semiconductor wafers mounted in a cassette, comprising: a base, including a housing, upon which the cassette is mounted; a roller, driven by a first motor, extending the length of the base under said cassette in rolling contact with wafers in said cassette; and a pivotally mounted alignment blade, driven by a second motor, having its longitudinal axis extending parallel to said roller, said alignment blade, when pivoted upward, engaging said wafers at a point adjacent the flat edge of each wafer, stopping wafer rotation; whereby, when the alignment blade is pivoted downward and when said roller is rotated a predetermined number of revolutions, the flat edges of said wafers are aligned at a desired location.
Claim 11
Dependent Claim
24 words
The apparatus according to claim 8 including a switch actuated by the placing of the cassette on said base for initiating an alignment process.
Claim 12
Dependent Claim
40 words
The apparatus according to claim 8, wherein said housing is at one end of said base, and said roller and alignment blade extend from said housing to an end of said base opposite the end where the housing is located.
Claim 13
Dependent Claim
31 words
The apparatus according to claim 8, wherein the pivotal action of the alignment blade is produced by a cam and a follower arm, the cam being rotated by said second motor.
Claim 14
Dependent Claim
25 words
The apparatus according to claim 8, wherein the ratio of the diameter of the roller to the diameter of the wafer is 1 to 16.
Claim 15
Dependent Claim
24 words
The apparatus according to claim 8, wherein said roller is coated with a tacky polymer to prevent slipping of the wafers on the roller.
Claim 16
Dependent Claim
29 words
The apparatus according to claim 8, wherein the position of the wafer flat edges is determined by rotating the roller a predetermined number of revolutions for a desired position.
Claim 17
Independent Claim
113 words
A method for aligning flat edges on semiconductor wafers in an apparatus having a roller and an alignment blade, including the steps of: rotating said wafers with a roller in a first direction to ensure that all flat edges are clear of the alignment blade, pivoting said alignment blade in an upward position; rotating the wafers in a second direction until the rotation of each wafer is stopped by said alignment blade engaging an edge of the flat edge, and said flat edges are aligned; rotating said alignment blade in a downward direction; and rotating said wafers in a direction to position the aligned flat edges of the wafers at a desired position.
Claim 18
Independent Claim
113 words
A method for aligning flat edges on semiconductor wafers in an apparatus having a roller and an alignment blade, including the steps of: rotating said wafers with a roller in a first direction to ensure that all flat edges are clear of the alignment blade, pivoting said alignment blade in an upward position; rotating the wafers in a second direction until the rotation of each wafer is stopped by said alignment blade engaging an edge of the flat edge, and said flat edges are aligned; rotating said alignment blade in a downward direction; and rotating said wafers in a direction to position the aligned flat edges of the wafers at a desired position.
Claim 19
Dependent Claim
38 words
The method according to claim 15, wherein the direction of rotation of said wafers to position the aligned flat edges of the wafers at said desired position depends upon the position of the flat edge, up or down.
Claim 20
Dependent Claim
31 words
The method according to claim 15, including the step of providing an idle period after aligning the wafer flat edges, to provide for changing the position of the aligned flat edges.
References Cited (Backward Citations)
US4662811A
Cited
US5028200A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-23 | 1998-07-25 | 1999-01-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-23 | 2002-07-25 | 2003-01-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-23 | 2006-07-25 | 2007-01-24 | $7700.00 | Window Closed / Lapsed |