Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
160 words
A method for fabricating a self-aligned phase-shifted mask comprising the steps of: exposing a mask to a single patterning sequence to form a pattern of material opaque to exposing radiation of a selected wavelength on selected areas of a surface of a substrate, the substrate being transparent to the exposing radiation, and the opaque pattern having a first surface which is generally orthogonal to the surface of the substrate and a second surface which is generally parallel to the surface of the substrate; and forming a spacer of phase-shifting material on the first surface of the opaque pattern by depositing phase-shifting material on the generally orthogonal surfaces of the opaque pattern and the transparent substrate, the spacer having a thickness at the first surface of the opaque pattern such that the exposing radiation passing through the spacer is phase-shifted in the range of 0.67 pi to pi radians with respect to exposing radiation passing through other areas of the mask.
Claim 2
Independent Claim
160 words
A method for fabricating a self-aligned phase-shifted mask comprising the steps of: exposing a mask to a single patterning sequence to form a pattern of material opaque to exposing radiation of a selected wavelength on selected areas of a surface of a substrate, the substrate being transparent to the exposing radiation, and the opaque pattern having a first surface which is generally orthogonal to the surface of the substrate and a second surface which is generally parallel to the surface of the substrate; and forming a spacer of phase-shifting material on the first surface of the opaque pattern by depositing phase-shifting material on the generally orthogonal surfaces of the opaque pattern and the transparent substrate, the spacer having a thickness at the first surface of the opaque pattern such that the exposing radiation passing through the spacer is phase-shifted in the range of 0.67 pi to pi radians with respect to exposing radiation passing through other areas of the mask.
Claim 3
Dependent Claim
37 words
The method as recited in claim 1 wherein the forming step further comprises the step of etching the phase-shifting material to substantially remove it from the generally parallel surfaces of the opaque pattern and the transparent substrate.
Claim 4
Dependent Claim
31 words
The method as recited in claim 1 wherein the thickness of the spacer at the first surface of the opaque pattern is substantially equal to a thickness of the opaque pattern.
Claim 5
Dependent Claim
48 words
The method as recited in claim 3 wherein a cross-sectional shape of the spacer is a quarter-cylinder with its greatest thickness at the first surface of the opaque pattern so that the greatest phase-shift of the exposing radiation is created at the first surface of the opaque pattern.
Claim 6
Dependent Claim
19 words
The method as recited in claim 1 wherein the transparent substrate is quartz and the opaque material is chrome.
Claim 7
Dependent Claim
139 words
A self aligned phase shifting mask comprising: a substrate which is transparent to a selected wavelength of exposing radiation, said substrate having a surface; a pattern of material opaque to the selected wavelength of exposing radiation disposed on selected areas of the transparent substrate, the opaque pattern having a first surface which is generally orthogonal to said substrate surface and a second surface which is generally parallel to said substrate surface; and a self-aligned spacer of phase-shifting material formed on the first surface of the opaque pattern and the surface of the transparent substrate of a thickness to cause a phase-shift in the exposing radiation passing through the spacer of 0.67 pi to pi radians with respect to the exposing radiation which passes through other areas of the mask, and said spacer having a generally curvilinear cross sectional configuration.
Claim 8
Dependent Claim
139 words
A self aligned phase shifting mask comprising: a substrate which is transparent to a selected wavelength of exposing radiation, said substrate having a surface; a pattern of material opaque to the selected wavelength of exposing radiation disposed on selected areas of the transparent substrate, the opaque pattern having a first surface which is generally orthogonal to said substrate surface and a second surface which is generally parallel to said substrate surface; and a self-aligned spacer of phase-shifting material formed on the first surface of the opaque pattern and the surface of the transparent substrate of a thickness to cause a phase-shift in the exposing radiation passing through the spacer of 0.67 pi to pi radians with respect to the exposing radiation which passes through other areas of the mask, and said spacer having a generally curvilinear cross sectional configuration.
Claim 9
Dependent Claim
27 words
The mask as recited in claim 6 wherein the thickness of the spacer at said first surface is substantially similar to the thickness of the opaque pattern.
Claim 10
Dependent Claim
27 words
The mask as recited in claim 6 wherein the phase shift material is substantially removed from the parallel surfaces of said opaque pattern and said transparent substrate.
Claim 11
Dependent Claim
47 words
The mask as recited in claim 7 wherein a cross-sectional shape of the spacer is a quarter-cylinder with a greatest thickness at the first surface of the opaque pattern so the greatest phase-shift of the exposing radiation is created at the first surface of the opaque pattern.
Claim 12
Dependent Claim
19 words
The mask as recited in claim 6 wherein the transparent substrate is quartz and the opaque material is chrome.
Claim 13
Independent Claim
159 words
A method of converting an optical lithography mask into a self-aligned phase shifting mask, the mask having a patterned opaque material on selected areas of a surface of a substrate, the substrate being transparent to the exposing radiation, and the opaque pattern having a first surface which is generally orthogonal to the surface of the substrate and a second surface which is generally parallel to the surface of the substrate, said method comprising the step of: forming a spacer of phase-shifting material on the first surface of the opaque pattern by depositing phase-shifting material on the surfaces of the opaque pattern and the transparent substrate, the spacer having a thickness at the first surface of the opaque pattern such that exposing radiation passing through the spacer is phase-shifted in the range of 0.67 pi to pi radians with respect to exposing radiation passing through other areas of the mask, and the spacer having a generally curvilinear, cross sectional configuration.
Claim 14
Independent Claim
159 words
A method of converting an optical lithography mask into a self-aligned phase shifting mask, the mask having a patterned opaque material on selected areas of a surface of a substrate, the substrate being transparent to the exposing radiation, and the opaque pattern having a first surface which is generally orthogonal to the surface of the substrate and a second surface which is generally parallel to the surface of the substrate, said method comprising the step of: forming a spacer of phase-shifting material on the first surface of the opaque pattern by depositing phase-shifting material on the surfaces of the opaque pattern and the transparent substrate, the spacer having a thickness at the first surface of the opaque pattern such that exposing radiation passing through the spacer is phase-shifted in the range of 0.67 pi to pi radians with respect to exposing radiation passing through other areas of the mask, and the spacer having a generally curvilinear, cross sectional configuration.
Claim 15
Dependent Claim
37 words
The method as recited in claim 11 wherein the forming step further comprises the step of etching the phase-shifting material to substantially remove it from the generally parallel surfaces of the opaque pattern and the transparent substrate.
Claim 16
Dependent Claim
31 words
The method as recited in claim 11 wherein the thickness of the spacer at the first surface of the opaque pattern is substantially equal to a thickness of the opaque pattern.
Claim 17
Dependent Claim
48 words
The method as recited in claim 13 wherein a cross-sectional shape of the spacer is a quarter-cylinder with its greatest thickness at the first surface of the opaque pattern so that the greatest phase-shift of the exposing radiation is created at the first surface of the opaque pattern.
Claim 18
Independent Claim
86 words
A method of making a semi-conductor mask by means of a single patterning sequence, said method comprising the steps of: forming a pattern of material, which is non-transmissive of a given energy wavelength, on a substrate, which is transmissive of the given wavelength, by exposing the mask to only one patterning sequence, the patterned material and the substrate each having surfaces which are nonparallel to one another; and forming a spacer of phase shifting material against the non-parallel surfaces of the patterned material and the substrate.
Claim 19
Independent Claim
86 words
A method of making a semi-conductor mask by means of a single patterning sequence, said method comprising the steps of: forming a pattern of material, which is non-transmissive of a given energy wavelength, on a substrate, which is transmissive of the given wavelength, by exposing the mask to only one patterning sequence, the patterned material and the substrate each having surfaces which are nonparallel to one another; and forming a spacer of phase shifting material against the non-parallel surfaces of the patterned material and the substrate.
Claim 20
Dependent Claim
21 words
The method as in claim 15, wherein during said spacer forming step the phase shifting material is deposited and then etched.
Claim 21
Dependent Claim
21 words
The method as in claim 16, wherein the phase shifting material is etched to have a generally curvilinear, cross sectional configuration.
Claim 22
Dependent Claim
28 words
The method as in claim 16, wherein the phase shifting material is etched to be a thickness which is substantially equal to the thickness of the patterned material.