US5382300A
Expired / Lapsed
US
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Solder paste mixture
Assignee: Agere Systems LLC
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Filing: 1994-03-22
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Granted: 1995-01-17
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Expires: 2014-03-22
Abstract
Abstract A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one elemental metal powder or at least one solder alloy powder or at least one elemental metal powder and at least one solder alloy powder. Said other component is a powder or combination of powders each of which has a liquidus temperature which is lower by at least 5 degrees Centigrade ( DEG C.) than the solidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder or a solidus temperature which is higher by at least 5 DEG C. than the liquidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder. The eutectic or near-eutectic Sn/Pb powder makes up from 5 to 95 weight percent of the total powder mixture. Alternatively, not all powders which comprise the second component need to obey this rule so long as at least 30% by wt. of the entire powder mixture has a solidus temperature which is at least 5 DEG C. higher than the highest liquidus temperature of the eutectic or near-eutectic Sn/Pb alloy powder. This solder paste results in an uncompromised consolidation and wetting process in which all of the solder joints or balls are formed on and wetted to an appropriate contact by the solder reflow process.
Inventors
- 👤 Greg E. Blonder
- 👤 Yinon Degani
- 👤 Thomas D. Dudderar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:45
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; B23K35/02; B23K35/0222; B23K35/0244; B23K35/025; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0272; H05K3/346
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
202 words
A solder paste comprising a vehicle and a mixture of at least two solder powders, one component of said mixture being a eutectic or near eutectic Sn/Pb alloy powder and another component of said mixture is selected from at least one elemental metal, at least one solder alloy and a mixture of at least one elemental metal and at least one alloy, wherein powders of said other component are selected from powders 1) each of which has a liquidus temperature which is lower by at least 5° C. than a solidus temperature of said eutectic or near-eutectic Sn/Pb powder, 2) each of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, and 3) at least one of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, said at least one of the powders with said higher solidus temperature making up at least 30 wt. % of the powders in the total powder mixture, and said eutectic or near eutectic Sn/Pb alloy comprising between 5 and 95 weight percent of the powder mixture.
Claim 2
Dependent Claim
202 words
A solder paste comprising a vehicle and a mixture of at least two solder powders, one component of said mixture being a eutectic or near eutectic Sn/Pb alloy powder and another component of said mixture is selected from at least one elemental metal, at least one solder alloy and a mixture of at least one elemental metal and at least one alloy, wherein powders of said other component are selected from powders 1) each of which has a liquidus temperature which is lower by at least 5° C. than a solidus temperature of said eutectic or near-eutectic Sn/Pb powder, 2) each of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, and 3) at least one of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, said at least one of the powders with said higher solidus temperature making up at least 30 wt. % of the powders in the total powder mixture, and said eutectic or near eutectic Sn/Pb alloy comprising between 5 and 95 weight percent of the powder mixture.
Claim 3
Dependent Claim
31 words
A solder paste of claim 1, in which said eutectic or near eutectic Sn/Pb alloy is selected from the group consisting of a 63/37 Sn/Pb alloy and a 60/40 Sn/Pb alloy.
Claim 4
Dependent Claim
45 words
A solder paste of claim 1, in which said one component is a eutectic or near eutectic Sn/Pb alloy present as a component of the powder mixture having a higher solidus temperature than the highest liquidus temperature of said other component Of the powder mixture.
Claim 5
Dependent Claim
25 words
A solder paste of claim 3, in which said other component is selected from the group consisting of 43/43/14 Sn/Pb/Bi, 42/58 Sn/Bi, and 52/48 Sn/In.
Claim 6
Dependent Claim
23 words
A solder paste of claim 3, in which said eutectic or near eutectic Sn/Pb alloy powder comprises 30-95 wt.% of the powder mixture.
Claim 7
Dependent Claim
70 words
A solder paste of claim 1, in which said one component is a eutectic or near eutectic Sn/Pb alloy powder present as a component of the powder mixture having a lower liquidus temperature than the lowest solidus temperature of at least one of the powders of said other component of the powder mixture, said eutectic or near eutectic Sn/Pb powder comprises from 5 to 70 wt.% of the powder mixture.
Claim 8
Dependent Claim
58 words
A solder paste of claim 6, in which said other component comprises at least one powder selected from the group consisting of elemental Sn, 96.5/3.5 Sn/Ag, 95/5 Sn/Sb, 86/9/5 Sn/Zn/In, and a Sn/Pb alloy whose composition satisfies the relationship x/(100-x) wherein x is the percentage of Sn based on the total weight of said Sn/Pb alloy and 1<×<18.
Claim 9
Dependent Claim
80 words
A solder paste of claim 6, in which said other component comprises a elemental Sn and a Sn/Pb alloy with the composition x/(100-x) wherein x is the percentage of Sn based on the total weight of the x/(100-x) Sn/Pb alloy and 1 <×<18, and the Sn powder and the x/(100-x) Sn/Pb alloy powder are proportioned such that after melting the two components of the mixture the molten liquid will form an alloy with a eutectic or near eutectic Sn/Pb composition.
Claim 10
Dependent Claim
33 words
A solder paste of claim 6, in which said other component comprises 61 wt.% of Sn and 39 wt.% of 5/95 Sn/Pb based on a total amount of Sn and 5/95 Sn/Pb powders.
Claim 11
Dependent Claim
32 words
A solder paste of claim 6, in which said other component comprises 59 wt.% Sn and 41 wt.% of 10/90 Sn/Pb based on a total amount of Sn and 10/90 Sn/Pb powders.
Claim 12
Dependent Claim
244 words
A process for forming a solder paste mixture, comprising the steps of providing a vehicle for solder paste, providing a plurality of particles of one component of the solder mixture, said one component being a eutectic or near-eutectic Sn/Pb alloy, providing a plurality of particles of another component of the solder mixture, said other component being selected from at least one elemental metal, at least one solder alloy and a mixture of at least one elemental metal and at least one solder alloy, wherein powders of said other component are selected from powders 1) each of which has a liquidus temperature which is lower by at least 5 ° C. than the solidus temperature of said eutectic or near-eutectic Sn/Pb powder, 2) each of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, and 3) at least one of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, said at least one of the powders with said higher solidus temperature making up at least 30 wt. % of the powders in the total powder mixture, and mixing said vehicle, said one component and said other component to form a paste mixture in which said eutectic or near-eutectic Sn/Pb alloy comprises from 5 to 95 weight percent of the metallic content of the paste mixture.
Claim 13
Dependent Claim
244 words
A process for forming a solder paste mixture, comprising the steps of providing a vehicle for solder paste, providing a plurality of particles of one component of the solder mixture, said one component being a eutectic or near-eutectic Sn/Pb alloy, providing a plurality of particles of another component of the solder mixture, said other component being selected from at least one elemental metal, at least one solder alloy and a mixture of at least one elemental metal and at least one solder alloy, wherein powders of said other component are selected from powders 1) each of which has a liquidus temperature which is lower by at least 5 ° C. than the solidus temperature of said eutectic or near-eutectic Sn/Pb powder, 2) each of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, and 3) at least one of which has a solidus temperature which is higher by at least 5° C. than a liquidus temperature of said eutectic or near-eutectic Sn/Pb powder, said at least one of the powders with said higher solidus temperature making up at least 30 wt. % of the powders in the total powder mixture, and mixing said vehicle, said one component and said other component to form a paste mixture in which said eutectic or near-eutectic Sn/Pb alloy comprises from 5 to 95 weight percent of the metallic content of the paste mixture.
Claim 14
Dependent Claim
29 words
A process of claim 11, in which said eutectic or near-eutectic Sn/Pb alloy is selected from the group consisting of a 63/37 Sn/Pb alloy and a 60/40 Sn/Pb alloy.
Claim 15
Dependent Claim
44 words
A process of claim 11, in which said one component is a eutectic or near eutectic Sn/Pb alloy present as a component of the powder mixture having a solidus temperature higher than the highest liquidus temperature of said other component of the powder mixture.
Claim 16
Dependent Claim
25 words
A process of claim 13, in which said other component is selected from the the group consisting of 43/43/14 Sn/Pb/Bi, 42/58 Sn/Bi, and 52/48 Sn/In.
Claim 17
Dependent Claim
23 words
A process of claim 13, in which said eutectic or near eutectic Sn/Pb alloy powder comprises from 30-95 wt.% of the powder mixture.
Claim 18
Dependent Claim
67 words
A process of claim 11, in which said one component is a eutectic or near eutectic Sn/Pb alloy present as a component of the powder mixture having a lower liquidus temperature than the lowest solidus temperature of at least one of the powders of said other component of the powder mixture, said eutectic or near-eutectic Sn/Pb alloy powder comprises from 5 to 70 wt.%. of the mixture.
Claim 19
Dependent Claim
63 words
A process of claim 16, in which said other component of the powder mixture comprises at least one powder selected from the group consisting of elemental Sn, 96.5/3.5 Sn/Ag, 95/5 Sn/Sb, 86/9/5 Sn/Zn/In and a Sn/Pb alloy whose composition satisfies the relationship x/(100-x) wherein x is the percentage of Sn based on the a total weight of said x/(100-x) Sn/Pb alloy and 1<×<18.
Claim 20
Dependent Claim
77 words
A process of claim 16, in which said other component comprises an elemental Sn and a Sn/Pb alloy with the composition x/(100-x) wherein x is the percentage of Sn based on the total weight of said Sn/Pb alloy and 1<×<18, and the Sn powder and the x/(100-x) Sn/Pb alloy powder are proportioned such that after melting the two components of the mixture, the molten liquid will form an alloy with a eutectic or near eutectic Sn/Pb composition.
Claim 21
Dependent Claim
31 words
A process of claim 16, in which said other component comprises 59 wt.% Sn and 39 wt.% of 5/95 Sn/Pb based on a total amount of Sn and 5/95 Sn/Pb powders.
Claim 22
Dependent Claim
30 words
A process of claim 16, in which said other component comprises 59 wt.% Sn and 41 wt.% 10/90 Sn/Pb based on a total amount of Sn and 10/90 Sn/Pb powders.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1998-01-16 | 1998-07-18 | 1999-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-16 | 2002-07-18 | 2003-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-16 | 2006-07-18 | 2007-01-17 | $7700.00 | Window Closed / Lapsed |