Hermetic coatings by heating hydrogen silsesquinoxane resin in an inert atmosphere

Claim 1

A method of forming a coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; and (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere.

Claim 2

A method of forming a coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; and (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere.

Claim 7

A method of forming a dual layer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; and (D) applying a passivating coating over the first coating, the passivating coating applied by means of (i) coating the electronic device having the first coating with a second solution comprising a solvent and a preceramic polymer, (ii) evaporating said solvent to thereby deposit a preceramic coating; and (iii) heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, whereby a dual layer coating is obtained on the electronic device.

Claim 8

A method of forming a dual layer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; and (D) applying a passivating coating over the first coating, the passivating coating applied by means of (i) coating the electronic device having the first coating with a second solution comprising a solvent and a preceramic polymer, (ii) evaporating said solvent to thereby deposit a preceramic coating; and (iii) heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, whereby a dual layer coating is obtained on the electronic device.

Claim 10

A method of forming a dual layer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; and (D) applying a silicon containing passivating coating over the first coating, said passivating coating selected from the group consisting of (i) silicon coatings, (ii) silicon carbon-containing coatings, (iii) silicon nitrogen-containing coatings, and (iv) silicon carbon nitrogen-containing coatings, wherein the silicon coating is applied by a means selected from the group consisting of (a) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere, (b) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere and (c) metal assisted chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an inert gas, and wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the first coating with a second solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, whereby a dual layer coating is obtained on the substrate.

Claim 11

A method of forming a dual layer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; and (D) applying a silicon containing passivating coating over the first coating, said passivating coating selected from the group consisting of (i) silicon coatings, (ii) silicon carbon-containing coatings, (iii) silicon nitrogen-containing coatings, and (iv) silicon carbon nitrogen-containing coatings, wherein the silicon coating is applied by a means selected from the group consisting of (a) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere, (b) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere and (c) metal assisted chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an inert gas, and wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the first coating with a second solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, whereby a dual layer coating is obtained on the substrate.

Claim 12

A method of forming a multilayer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; (D) applying a passivating coating over the first coating, the passivating coating applied by means of (i) coating the electronic device having the first coating with a second solution comprising a solvent and a preceramic polymer, (ii) evaporating said solvent to thereby deposit a preceramic coating; and (iii) heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere; and (E) applying a silicon containing barrier coating to said passivating coating, said barrier coating selected from the group consisting of (i) silicon coatings, (ii) silicon carbon-containing coatings, (iii) silicon nitrogen-containing coatings, and (iv) silicon carbon nitrogen-containing coatings, wherein the silicon coating is applied by a means selected from the group consisting of (a) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere, (b) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere and (c) metal assisted chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an inert gas, and wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the passivating coating with a third solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, whereby a multilayer coating is obtained on the electronic device.

Claim 13

A method of forming a multilayer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; (D) applying a passivating coating over the first coating, the passivating coating applied by means of (i) coating the electronic device having the first coating with a second solution comprising a solvent and a preceramic polymer, (ii) evaporating said solvent to thereby deposit a preceramic coating; and (iii) heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere; and (E) applying a silicon containing barrier coating to said passivating coating, said barrier coating selected from the group consisting of (i) silicon coatings, (ii) silicon carbon-containing coatings, (iii) silicon nitrogen-containing coatings, and (iv) silicon carbon nitrogen-containing coatings, wherein the silicon coating is applied by a means selected from the group consisting of (a) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere, (b) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere and (c) metal assisted chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an inert gas, and wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the passivating coating with a third solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, whereby a multilayer coating is obtained on the electronic device.

Claim 15

A method of forming a multilayer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; (D) applying a silicon containing passivating coating to the first coating, said passivating coating selected from the group consisting of (i) silicon carbon-containing coatings, (ii) silicon nitrogen-containing coatings, and (iii) silicon carbon nitrogen-containing coatings, wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or all alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the first coating with a second solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, to produce the silicon containing passivating coating; and (E) applying a silicon containing barrier coating to the passivating coating, the barrier coating selected from the group consisting of (i) silicon coatings, (ii) silicon carbon-containing coatings, (iii) silicon nitrogen-containing coatings, and (iv) silicon carbon nitrogen-containing coatings, wherein the silicon coating is applied by a means selected from the group consisting of (a) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere, (b) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere and (c) metal assisted chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an inert gas, and wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the passivating coating with a second solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, whereby a multilayer coating is obtained on the electronic device.

Claim 16

A method of forming a multilayer coating on an electronic device consisting essentially of: (A) coating the electronic device with a solution consisting essentially of a solvent and hydrogen silsesquioxane resin; (B) evaporating the solvent to deposit a preceramic coating on the electronic device; (C) heating the preceramic coating to a temperature of between about 500° up to about 800° C. under an inert gas atmosphere to form the first coating; (D) applying a silicon containing passivating coating to the first coating, said passivating coating selected from the group consisting of (i) silicon carbon-containing coatings, (ii) silicon nitrogen-containing coatings, and (iii) silicon carbon nitrogen-containing coatings, wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or all alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the first coating with a second solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, to produce the silicon containing passivating coating; and (E) applying a silicon containing barrier coating to the passivating coating, the barrier coating selected from the group consisting of (i) silicon coatings, (ii) silicon carbon-containing coatings, (iii) silicon nitrogen-containing coatings, and (iv) silicon carbon nitrogen-containing coatings, wherein the silicon coating is applied by a means selected from the group consisting of (a) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere, (b) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an inert gas atmosphere and (c) metal assisted chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an inert gas, and wherein the silicon carbon-containing coating is applied by a means selected from the group consisting of (1) chemical vapor deposition in an inert gas atmosphere of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane, (2) plasma enhanced chemical vapor deposition in an inert gas atmosphere of an alkylsilane, halosilane, halodisilane, halopolysilane or mixtures thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and (3) plasma enhanced chemical vapor deposition of a silacyclobutane or disilacyclobutane in an inert gas atmosphere; and wherein the silicon nitrogen-containing coating is deposited by a means selected from the group consisting of (A) chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane or mixtures thereof in an ammonia atmosphere, (B) plasma enhanced chemical vapor deposition of a silane, halosilane, halodisilane, halopolysilane, or mixtures thereof in an ammonia atmosphere and (C) coating the passivating coating with a second solution comprising a solvent and a preceramic polymer, evaporating said solvent to thereby deposit a preceramic coating and heating the preceramic coating to a temperature between 200°-900° C. under an ammonia or inert gas atmosphere, and wherein the silicon carbon nitrogen-containing coating is deposited by a means selected from the group consisting of (i) chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (ii) plasma enhanced chemical vapor deposition of hexamethyldisilazane in an ammonia or inert gas atmosphere, (iii) chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, and (iv) plasma enhanced chemical vapor deposition of a silane, alkylsilane, halosilane, halodisilane, halopolysilane or a mixture thereof in the presence of an alkane of one to six carbon atoms or an alkylsilane and further in the presence of ammonia, whereby a multilayer coating is obtained on the electronic device.