US5379336A
Expired / Lapsed
US
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Hybridized semiconductor pixel detector arrays for use in digital radiography
Assignee: Raytheon Co
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Filing: 1993-09-20
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Granted: 1995-01-03
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Expires: 2013-09-20
Abstract
Abstract A solid state x-ray detector which is a two-dimensional array of individual pixel elements is described. The hybrid semiconductor construction produces detector elements with high spatial resolution (<30 microns), high sensitivity to the entire x-ray spectrum, and frame rates greater than 1000 Hz. In a biomedical application these arrays provide high quality real time digital radiographic images that are directly coupled to an image processing system for image enhancement and computer aided diagnosis. In an alternative embodiment of the invention, the hybrid construction incorporated into an automated manufacturing process facilitates the real time, nondestructive, x-ray examination of manufactured objects during the production process. Structural defects in inorganic objects under test are identified in real time during the manufacturing process are corrected when feedback signals are generated from the electronic image data generated during the nondestructive test process.
Inventors
- 👤 Gordon Kramer
- 👤 Douglas W. Wolfe
- 👤 Stuart Worley
- 👤 Timothy C. Collins
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 00:18
CPC Classifications
G; G01; G01T; G01T1/00; G01T1/29; G01T1/2914; G01T1/2921; G01T1/2928; H; H04; H04N; H04N25/00; H04N25/70; H04N25/79
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
66 words
An non-destructive test system, comprising: at least one source for x-rays; a hybrid semiconductor pixel array positioned to receive and convert x-ray photons from said source into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and a processor operable to receive and convert said electrical signals into an electronic image.
Claim 2
Dependent Claim
66 words
An non-destructive test system, comprising: at least one source for x-rays; a hybrid semiconductor pixel array positioned to receive and convert x-ray photons from said source into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and a processor operable to receive and convert said electrical signals into an electronic image.
Claim 3
Dependent Claim
18 words
The non-destructive test system in claim 1 wherein said source for x-rays further comprises a high energy tube.
Claim 4
Dependent Claim
16 words
The non-destructive test system in claim 1 wherein said source for x-rays further comprises Cobalt 60.
Claim 5
Dependent Claim
16 words
The non-destructive test system in claim 1 wherein said source for x-rays further comprises a synchrotron.
Claim 6
Dependent Claim
11 words
The system of claim 1 wherein said detector array comprises silicon.
Claim 7
Dependent Claim
11 words
The system of claim 1 wherein said detector array comprises germanium.
Claim 8
Dependent Claim
12 words
The system of claim 1 wherein said detector array comprises cadmium telluride.
Claim 9
Dependent Claim
12 words
The system of claim 1 wherein said detector array comprises indium antimonide.
Claim 10
Independent Claim
105 words
A method of providing a non-destructive test system, said method comprising the steps of: providing at least one source for x-rays; providing a subject under test exposed to said x-rays, said subject operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and providing a processor operable to receive and convert said electrical signals into an electronic image.
Claim 11
Independent Claim
105 words
A method of providing a non-destructive test system, said method comprising the steps of: providing at least one source for x-rays; providing a subject under test exposed to said x-rays, said subject operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and providing a processor operable to receive and convert said electrical signals into an electronic image.
Claim 12
Independent Claim
97 words
A method of non-destructive testing, said method comprising the steps of: generating x-rays from at least one source; exposing a subject under test to said x-rays, said subject operable to selectively absorb said x-rays; positioning a hybrid semiconductor pixel array proximate said subject under test, said hybrid semiconductor pixel array operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip processing said electrical signals into an electronic image.
Claim 13
Independent Claim
97 words
A method of non-destructive testing, said method comprising the steps of: generating x-rays from at least one source; exposing a subject under test to said x-rays, said subject operable to selectively absorb said x-rays; positioning a hybrid semiconductor pixel array proximate said subject under test, said hybrid semiconductor pixel array operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip processing said electrical signals into an electronic image.
Claim 14
Dependent Claim
128 words
An automated non-destructive test system, used in a manufacturing process, comprising: at least one source for x-rays; an object under test exposed to said x-rays, said object operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said object under test operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; a processor operable to receive and convert said electrical signals into an electronic image; and a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing process.
Claim 15
Dependent Claim
128 words
An automated non-destructive test system, used in a manufacturing process, comprising: at least one source for x-rays; an object under test exposed to said x-rays, said object operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said object under test operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; a processor operable to receive and convert said electrical signals into an electronic image; and a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing process.
Claim 16
Dependent Claim
18 words
The non-destructive test system in claim 11 wherein said source for x-rays further comprises a high energy tube.
Claim 17
Dependent Claim
16 words
The non-destructive test system in claim 11 wherein said source for x-rays further comprises Cobalt 60.
Claim 18
Dependent Claim
16 words
The non-destructive test system in claim 11 wherein said source for x-rays further comprises a synchrotron.
Claim 19
Independent Claim
136 words
A method of providing an automated non-destructive test system to a manufacturing process, comprising: providing at least one source for x-rays; providing an object under test exposed to said x-rays, said object operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said object under test operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; providing a processor operable to receive and convert said electrical signals into an electronic image; and providing a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing process.
Claim 20
Independent Claim
136 words
A method of providing an automated non-destructive test system to a manufacturing process, comprising: providing at least one source for x-rays; providing an object under test exposed to said x-rays, said object operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said object under test operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; providing a processor operable to receive and convert said electrical signals into an electronic image; and providing a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing process.
Claim 21
Dependent Claim
137 words
An automated method of non-destructive testing incorporated into a manufacturing process, said method comprising the steps of: generating x-rays; exposing a manufactured object under test to said x-rays, said object operable to selectively absorb said x-rays; positioning a hybrid semiconductor pixel array proximate said object under test, said hybrid semiconductor pixel array operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; processing said electrical signals into an electronic image; comparing said electronic image to a stored known image of said manufactured object; and revising the manufacturing process in response to the comparison between said manufactured object under test and said stored known image of said manufactured object.
Claim 22
Dependent Claim
137 words
An automated method of non-destructive testing incorporated into a manufacturing process, said method comprising the steps of: generating x-rays; exposing a manufactured object under test to said x-rays, said object operable to selectively absorb said x-rays; positioning a hybrid semiconductor pixel array proximate said object under test, said hybrid semiconductor pixel array operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; processing said electrical signals into an electronic image; comparing said electronic image to a stored known image of said manufactured object; and revising the manufacturing process in response to the comparison between said manufactured object under test and said stored known image of said manufactured object.
Claim 23
Dependent Claim
102 words
A non-destructive test system for biomedical applications, comprising: at least one source for x-rays; an organic subject under test exposed to said x-rays, said subject operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and conceal unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and a processor operable to receive and convert said electrical signals into an electronic image of said organic subject under test.
Claim 24
Dependent Claim
102 words
A non-destructive test system for biomedical applications, comprising: at least one source for x-rays; an organic subject under test exposed to said x-rays, said subject operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and conceal unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and a processor operable to receive and convert said electrical signals into an electronic image of said organic subject under test.
Claim 25
Independent Claim
110 words
A method of providing a non-destructive test system for biomedical applications, comprising: providing at least one source for x-rays; providing an organic subject under test exposed to said x-rays, said subject operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and providing a processor operable to receive and convert said electrical signals into an electronic image of said organic subject under test.
Claim 26
Independent Claim
110 words
A method of providing a non-destructive test system for biomedical applications, comprising: providing at least one source for x-rays; providing an organic subject under test exposed to said x-rays, said subject operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; and providing a processor operable to receive and convert said electrical signals into an electronic image of said organic subject under test.
Claim 27
Dependent Claim
144 words
A manufacturing system incorporating a non-destructive test system, comprising: a manufacturing line for producing an object, said object operable to selectively absorb x-rays; a non-destructive test system disposed along said manufacturing line for evaluating said object, said test system comprising: at least one source of x-rays positioned to expose said object to x-rays; a hybrid semiconductor pixel array positioned proximate said object operable to receive and convert unabsorbed x-ray photons passing through said object into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; a processor operable to receive and convert said electrical signals into an electronic image; and a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing system.
Claim 28
Dependent Claim
144 words
A manufacturing system incorporating a non-destructive test system, comprising: a manufacturing line for producing an object, said object operable to selectively absorb x-rays; a non-destructive test system disposed along said manufacturing line for evaluating said object, said test system comprising: at least one source of x-rays positioned to expose said object to x-rays; a hybrid semiconductor pixel array positioned proximate said object operable to receive and convert unabsorbed x-ray photons passing through said object into electrical signals, wherein said pixel array is comprised of a plurality of detector pixels on a semiconductor substrate individually interconnected to a readout chip; a processor operable to receive and convert said electrical signals into an electronic image; and a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-02 | 1998-07-04 | 1999-01-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-02 | 2002-07-04 | 2003-01-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-02 | 2006-07-04 | 2007-01-03 | $7700.00 | Window Closed / Lapsed |