US5378859A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Film wiring board
Assignee: Casio Computer Co Ltd
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Filing: 1993-02-25
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Granted: 1995-01-03
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Expires: 2013-02-25
Abstract
Abstract This application discloses a film wiring board for directly mounting an electronic parts such as an IC chip, on which a protective film having an opening can be formed in one step by a screen printing. This film wiring board has wiring patterns including connection pads and lead wires. Connection electrodes of the IC chip are connected to the connection pads via soldering bumps. Since the width of each of the lead wires is comparatively small at 10 μm-30 μm, the once molten solder when the connection is done is kept on the corresponding connection pad by the surface tension and is prevented from flowing from the connection pad to the corresponding lead wire. Therefore, since the opening of the protective film need not have a function for stopping the flow of the solder, there may be no problem if the opening is comparatively enlarged. Consequently, the protective film having the opening can be formed in one step by the screen printing, and then a productivity of the film wiring board may be increased and its production cost can be reduced.
Inventors
- 👤 Tomoyuki Shirasaki
- 👤 Osamu Kuwabara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:24
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/0989; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10734; H05K2201/10954; H05K2201/10977; H05K3/22; H05K3/28; H05K3/284; H05K3/341; H05K3/3431; H10W72/071; H10W72/072; H10W72/073; H10W72/20; H10W72/241; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
156 words
A film wiring board on which an electronic component is to be mounted via solder, comprising: a film base having an upper surface; a plurality of wiring patterns on said upper surface of said film base, each of said wiring patterns including a connection pad and a lead wire which is extended from the connection pad, the lead wire having a width of 10 μm-30 μm; and a protective film formed on said upper surface of said film base to hold said wiring patterns between said film base and said protective film, and said protective film having a single opening for a plurality of said connection pads, for exposing at least said plurality of said connection pads and the surroundings of said respective connection pads, the surroundings of said respective connection pads including portions of said lead wires which extend from said respective connection pads in the vicinity of each of the corresponding respective connection pads.
Claim 2
Dependent Claim
156 words
A film wiring board on which an electronic component is to be mounted via solder, comprising: a film base having an upper surface; a plurality of wiring patterns on said upper surface of said film base, each of said wiring patterns including a connection pad and a lead wire which is extended from the connection pad, the lead wire having a width of 10 μm-30 μm; and a protective film formed on said upper surface of said film base to hold said wiring patterns between said film base and said protective film, and said protective film having a single opening for a plurality of said connection pads, for exposing at least said plurality of said connection pads and the surroundings of said respective connection pads, the surroundings of said respective connection pads including portions of said lead wires which extend from said respective connection pads in the vicinity of each of the corresponding respective connection pads.
Claim 3
Dependent Claim
31 words
The film wiring board according to claim 1, wherein said opening has a shape which corresponds to an outer shape of an electronic component to be connected to said connection pads.
Claim 4
Dependent Claim
17 words
The film wiring board according to claim 2, wherein said film base is made of polyimide resin.
Claim 5
Dependent Claim
16 words
The film wiring board according to claim 3, wherein said wiring patterns are made of copper.
Claim 6
Dependent Claim
19 words
The film wiring board according to claim 4, wherein said wiring patterns are deposited members on said film base.
Claim 7
Dependent Claim
17 words
The film wiring board according to claim 5, wherein said protective film is made of epoxy resin.
Claim 8
Dependent Claim
31 words
The film wiring board according to claim 6, further comprising an island shaped protective film formed at a central portion of said opening on said upper surface of said film base.
Claim 9
Dependent Claim
17 words
The film wiring board according to claim 1, wherein said film base is made of polyimide resin.
Claim 10
Dependent Claim
16 words
The film wiring board according to claim 8, wherein said wiring patterns are made of copper.
Claim 11
Dependent Claim
19 words
The film wiring board according to claim 9, wherein said wiring patterns are deposited members on said film base.
Claim 12
Dependent Claim
17 words
The film wiring board according to claim 10, wherein said protective film is made of epoxy resin.
Claim 13
Dependent Claim
31 words
The film wiring board according to claim 11, further comprising an island shaped protective film formed at a central portion of said opening on said upper surface of said film base.
Claim 14
Dependent Claim
22 words
The film wiring board according to claim 2, wherein each of said lead wires has a length of at least 200 μm.
Claim 15
Dependent Claim
17 words
The film wiring board according to claim 13, wherein said film base is made of polyimide resin.
Claim 16
Dependent Claim
22 words
The film wiring board according to claim 1, wherein each of said lead wires has a length of at least 200 μm.
Claim 17
Dependent Claim
17 words
The film wiring board according to claim 15, wherein said film base is made of polyimide resin.
Claim 18
Dependent Claim
171 words
An electronic device comprising: (a) a film wiring board including: a film base having an upper surface; a plurality of wiring patterns on said upper surface of said film base, each of said wiring patterns including a connection pad and a lead wire which is extended from the connection pad, the lead wire having a width of 10-30 μm, and a protective film formed on said upper surface of said film base to hold said wiring patterns between said film base and said protective film, and said protective film having single opening for a plurality of said connecting pads, for exposing at least said plurality of connection pads and the surroundings of said respective connection pads, the surroundings of said plurality of connection pads including portions of said lead wires which extend from said respective connection pads in the vicinity of each of the corresponding respective connection pads; and (b) an electronic component having respective connection electrodes coupled to the respective connection pads of the wiring board by respective solder connections.
Claim 19
Dependent Claim
171 words
An electronic device comprising: (a) a film wiring board including: a film base having an upper surface; a plurality of wiring patterns on said upper surface of said film base, each of said wiring patterns including a connection pad and a lead wire which is extended from the connection pad, the lead wire having a width of 10-30 μm, and a protective film formed on said upper surface of said film base to hold said wiring patterns between said film base and said protective film, and said protective film having single opening for a plurality of said connecting pads, for exposing at least said plurality of connection pads and the surroundings of said respective connection pads, the surroundings of said plurality of connection pads including portions of said lead wires which extend from said respective connection pads in the vicinity of each of the corresponding respective connection pads; and (b) an electronic component having respective connection electrodes coupled to the respective connection pads of the wiring board by respective solder connections.
Claim 20
Dependent Claim
174 words
A junction structure of an electronic component comprising: (a) a film wiring board including: a film base having an upper surface; a plurality of wiring patterns on said upper surface of said film base, each of said wiring patterns including a connection pad and a lead wire which is extended from the connection pad, the lead wire having a width of 10-30 μm, and a protective film formed on said upper surface of said film base to hold said wiring patterns between said film base and said protective film, and said protective film having a single opening for a plurality of said connecting pads, for exposing at least said plurality connection pads and the surroundings of said respective connection pads, the surroundings of said respective connection pads including portions of said lead wires which extend from said respective connection pads in the vicinity of each of the corresponding respective connection pads; and (b) an electronic component having respective connection electrodes coupled to said respective connection pads of said wiring board by respective solder connections.
Claim 21
Dependent Claim
174 words
A junction structure of an electronic component comprising: (a) a film wiring board including: a film base having an upper surface; a plurality of wiring patterns on said upper surface of said film base, each of said wiring patterns including a connection pad and a lead wire which is extended from the connection pad, the lead wire having a width of 10-30 μm, and a protective film formed on said upper surface of said film base to hold said wiring patterns between said film base and said protective film, and said protective film having a single opening for a plurality of said connecting pads, for exposing at least said plurality connection pads and the surroundings of said respective connection pads, the surroundings of said respective connection pads including portions of said lead wires which extend from said respective connection pads in the vicinity of each of the corresponding respective connection pads; and (b) an electronic component having respective connection electrodes coupled to said respective connection pads of said wiring board by respective solder connections.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-02 | 1998-07-04 | 1999-01-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-02 | 2002-07-04 | 2003-01-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-02 | 2006-07-04 | 2007-01-03 | $7700.00 | Window Closed / Lapsed |