US5372471A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Single semiconductor wafer transfer method and manufacturing system
Assignee: United Microelectronics Corp
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Filing: 1993-10-04
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Granted: 1994-12-13
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Expires: 2013-10-04
Abstract
Abstract A manufacturing system and method for processing semiconductor wafers through a plurality of processing stations that perform manufacturing operations on wafers includes a plurality of processing stations, each of which are capable of performing at least one processing operation of a wafer, each of the processing stations having a controlled environment for processing the wafers, and a branched track providing a surface leading to each of said processing stations. On the track there are provided a plurality of guided transport vehicles adapted to travel between the process stations. A plurality of wafer carriers, each adapted to support a single wafer and be carried by the transport vehicles, are part of the system. An interface is provided at each processing station to introduce the wafer from the box into the clean environment of the process station, and subsequently return the box and wafer to the transport vehicle.
Inventors
- 👤 Hong J. Wu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:44
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/06; H10P72/0618; H10P72/0612; H10P72/30; H10P72/32; H10P72/3214; H10P72/3216; H10P72/3222; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/137; Y10S414/14
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
300 words
A method of manufacturing semiconductor devices in a production line having (a) a plurality of semiconductor wafer processing stations, each enclosed in a canopy, (b) a track associated with the processing stations, (c) a guided transport vehicle adapted to operate on the track, (d) a sealable box to receive a single wafer, (e) a memory device on said box to accept a wafer process step sequence, (f) handling means at each processing station to transfer a box between a transport vehicle and the processing station, (g) means to transfer the wafer from the box to an interior of said canopy, and (h) computer means, including interface to guide the transport vehicle on the track, load and unload boxes at various processing stations, in response to instructions from memories on the boxes, (i) a vehicle station where wafers are introduced into and removed from the system, the method comprised of the following steps: loading a process sequence onto the box memory and a wafer in the sealable box; loading the said box onto the transport vehicle; moving the said transport vehicle to a processing station in response to the information contained in the process sequence stored in the box memory; unloading the box at the designated processing station; transferring the wafer from the box to the canopy; performing the designated process at the said processing station; altering the process sequence of wafer carrier to indicate the process step performed at the said processing station has been completed; loading the wafer into said box, and loading the box on a transport vehicle; moving the said transport vehicle to the next processing station in response to the said altered process sequence in the said wafer carrier; repeating the forgoing method steps until the process sequence steps in the said wafer carrier are completed.
Claim 2
Independent Claim
300 words
A method of manufacturing semiconductor devices in a production line having (a) a plurality of semiconductor wafer processing stations, each enclosed in a canopy, (b) a track associated with the processing stations, (c) a guided transport vehicle adapted to operate on the track, (d) a sealable box to receive a single wafer, (e) a memory device on said box to accept a wafer process step sequence, (f) handling means at each processing station to transfer a box between a transport vehicle and the processing station, (g) means to transfer the wafer from the box to an interior of said canopy, and (h) computer means, including interface to guide the transport vehicle on the track, load and unload boxes at various processing stations, in response to instructions from memories on the boxes, (i) a vehicle station where wafers are introduced into and removed from the system, the method comprised of the following steps: loading a process sequence onto the box memory and a wafer in the sealable box; loading the said box onto the transport vehicle; moving the said transport vehicle to a processing station in response to the information contained in the process sequence stored in the box memory; unloading the box at the designated processing station; transferring the wafer from the box to the canopy; performing the designated process at the said processing station; altering the process sequence of wafer carrier to indicate the process step performed at the said processing station has been completed; loading the wafer into said box, and loading the box on a transport vehicle; moving the said transport vehicle to the next processing station in response to the said altered process sequence in the said wafer carrier; repeating the forgoing method steps until the process sequence steps in the said wafer carrier are completed.
Claim 3
Dependent Claim
25 words
The method of manufacturing semiconductor devices of claim 1 wherein the box containing the single wafer is transported to each processing station and individually processed.
Claim 4
Dependent Claim
67 words
The method of manufacturing semiconductor devices of claim 2 wherein each of said process stations has a vehicle buffer zone with a transport vehicle unloading zone and load zone, and wherein said transport vehicle is moved into the unload zone at the designated process station, the box unloaded, and the transport vehicle directed to the next vacant load zone of the vehicle buffer of a process station.
Claim 5
Dependent Claim
37 words
The method of manufacturing semiconductor device of claim 3 wherein said boxes each have sealable opening, and a pedestal within the box, the wafer being supported on said pedestal when the box is transported between processing stations.
Claim 6
Dependent Claim
72 words
The method of manufacturing semiconductor devices of claim 4 wherein said sealable opening on said box is an opening and a door on the side of the box, a mating opening is provided on the canopy, the box is moved at the process station to align the opening with the mating opening of the canopy, the door opened, and the wafer removed from the box and taken into the canopy for processing.
Claim 7
Dependent Claim
24 words
The method of manufacturing semiconductor devices of claim 5, wherein the wafer is removed from the box by a handler located within the canopy.
Claim 8
Dependent Claim
40 words
The method of manufacturing semiconductor devices of claim 6 wherein the wafer, following processing, is returned to the same box through the openings in the canopy and box, the openings closed, and the box moved to the next processing station.
Claim 9
Dependent Claim
33 words
The method of manufacturing semiconductor devices of claim 4, wherein the sealable opening of the box is provided with a cover, and the box is taken into the canopy at a process station.
Claim 10
Dependent Claim
31 words
The method of manufacturing semiconductor devices of claim 8 wherein the cover of the box is removed when the box is within the canopy, and the wafer is removed for processing.
Claim 11
Dependent Claim
35 words
The method of manufacturing semiconductor devices of claim 9, wherein the wafer is removed from the box by a handler within the canopy, the wafer is processed, and the wafer returned to the same box.
Claim 12
Dependent Claim
38 words
The method of manufacturing semiconductor devices of claim 3 wherein the transport vehicle will transport the box to a vehicle station upon completion of all the process steps in the process sequence for removal from the manufacturing line.
Claim 13
Dependent Claim
61 words
The method of manufacturing semiconductor devices of claim 3 wherein the boxes at the vehicle buffer zone are transferred to and from a box buffer zone, the box moved into the canopy, and the wafer is removed from said box for processing, and the wafer returned to the box and the box returned to the transport vehicle upon completion of processing.
Claim 14
Dependent Claim
46 words
The method of manufacturing semiconductor devices of claim 12 wherein said box buffer zone has the capability of storing a plurality of boxes, and wherein the priority of the wafer in each box is checked, and the wafer with the highest priority is selected for processing.
Claim 15
Dependent Claim
34 words
The method of manufacturing semiconductor devices of claim 13 wherein the wafer selected on the basis of priority is loaded into the said processing station and the indicated process is performed on the wafer.
Claim 16
Dependent Claim
69 words
The method of manufacturing semiconductor devices of claim 2 wherein the track has a plurality of branches with a plurality of processing stations located on each branch, wherein each vehicle locates the required process station by reading indicia adjacent each branch that lists various process stations on each branch, and upon entering the branch locates a specific processing station by reading indicia adjacent each processing station within the branch.
Claim 17
Dependent Claim
36 words
The method of manufacturing semiconductor devices of claim 1 wherein said track has a width in excess of twice a width of a transport vehicle, and the vehicle operation on the track is two way traffic.
Claim 18
Dependent Claim
45 words
The method of manufacturing semiconductor devices of claim 1, wherein each vehicle is provided with a sensor to read the memory devices on the boxes, and an associated computer, the computer directing the vehicle to the next processing station as dictated by the memory device.
Claim 19
Dependent Claim
53 words
The method of manufacturing semiconductor devices of claim 1 wherein the track is provided with guide tape, and branch guide tape that lead off the main track into and out of the processing stations, the transport vehicle interface sensing the guide tape and using the information to move said vehicles along the track.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-12 | 1998-06-13 | 1998-12-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-12 | 2002-06-13 | 2002-12-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-12 | 2006-06-13 | 2006-12-13 | $7700.00 | Window Closed / Lapsed |