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US5367190A Expired / Lapsed US ⏱️ 0.0 years remaining

Polysilicon semiconductor element having resistivity and work function controlled to required values

Assignee: Victor Company of Japan Ltd
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Filing: 1992-09-24
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Granted: 1994-11-22
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Expires: 2012-09-24
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Abstract

Abstract A semiconductor device has a semiconductor element comprising polycrystal silicon and into which high-concentration donors and high-concentration acceptors have been introduced in substantially the same amounts, and enables control of a work function of a semiconductor element by adjustment of the concentrations of the donor and acceptor. This semiconductor device is manufactured by the formation of a heat oxide film on a semiconductor substrate, the use of a low-pressure CVD method to form a polysilicon thin film to a required thickness, the implantation in the same high-concentrations of the donor and acceptor into the polysilicon thin film, and heat processing in a required atmosphere, for a required time and at a required temperature to diffuse and activate the injected donor and acceptor.

Inventors

  • 👤 Masaki Funaki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 20:29
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/60; H10D64/66; H10D64/661; H10D62/00; H10D62/80; H10D62/83; H10D62/834; H10D64/62

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 52 words
A semiconductor device, comprising semiconductor element of polysilicon to which donors having high concentration and acceptors having high concentration have both been introduced in substantially the same amounts to such an extent that the concentrations of said donors and said acceptors exceeds a concentration of silicon in a portion of the polysilicon.
Claim 2
Dependent Claim 52 words
A semiconductor device, comprising semiconductor element of polysilicon to which donors having high concentration and acceptors having high concentration have both been introduced in substantially the same amounts to such an extent that the concentrations of said donors and said acceptors exceeds a concentration of silicon in a portion of the polysilicon.
Claim 3
Dependent Claim 35 words
The semiconductor device according to claim 1, wherein: said semiconductor element comprises a resistance element, and wherein a resistivity of said resistance element is controlled by changing a concentration of said donors and said acceptors.
Claim 4
Dependent Claim 36 words
The semiconductor device according to claim 1, wherein: said semiconductor element comprises a wiring material, and wherein a work function of said wiring material is controlled by changing a concentration of said donors and said acceptors.
Claim 5
Dependent Claim 25 words
The semiconductor device according to claim 1, wherein: said donors are formed by high-concentration phosphorous (P) and said acceptors are formed by high-concentration boron (B).

References Cited (Backward Citations)

US4755863A Cited
JPS6148977A Cited
JPS60121770A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-11-21 1998-05-23 1998-11-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-11-21 2002-05-23 2002-11-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-11-21 2006-05-23 2006-11-22 $7700.00 Window Closed / Lapsed

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