US5366814A
Expired / Lapsed
US
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Copper foil for printed circuits and process for producing the same
Assignee: JX Nippon Mining and Metals Corp
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Filing: 1993-11-16
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Granted: 1994-11-22
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Expires: 2013-11-16
Abstract
Abstract A copper foil for printed circuits has a roughened layer formed on the side of the foil to be bonded to a base, the roughened layer consisting of a number of protuberant copper electrodeposits containing chromium tungsten or both. It may also have a copper plating layer covering the roughened layer and a treatment layer covering the copper plating layer and formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals. When necessary, the copper foil may contain an anticorrosive layer including various chromate treated layers further formed on the treatment layer. The copper foil is produced by electrolyzing a raw foil as a cathode in an acidic copper electrolytic bath at a current density close to the critical density, thereby forming the roughened layer, the electrolytic bath containing 0.001-5 g/l of chromium ion tungsten ion or both. The roughened layer is electrolytically overcoated with the treatment layer following the formation of a copper plating layer, which, when necessary, is anti-corrosively treated.
Inventors
- 👤 Keisuke Yamanishi
- 👤 Hideo Oshima
- 👤 Kazuhiko Sakaguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 00:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12472; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291; Y10T428/12993
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
62 words
A copper foil for printed circuits comprising a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both, in an amount effective to form rounded protuberances in said roughened layer and inhibit the growth of dendrites therein.
Claim 2
Dependent Claim
62 words
A copper foil for printed circuits comprising a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both, in an amount effective to form rounded protuberances in said roughened layer and inhibit the growth of dendrites therein.
Claim 3
Dependent Claim
110 words
A copper foil for printed circuits comprising a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both, in an amount effective to form rounded protuberances in said roughened layer and inhibit the growth of dendrites therein, a copper plating layer covering said roughened layer, and a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals.
Claim 4
Dependent Claim
110 words
A copper foil for printed circuits comprising a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both, in an amount effective to form rounded protuberances in said roughened layer and inhibit the growth of dendrites therein, a copper plating layer covering said roughened layer, and a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals.
Claim 5
Dependent Claim
118 words
A copper foil for printed circuits comprising a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both, in an amount effective to form rounded protuberances in said roughened layer and inhibit the growth of dendrites therein, a copper plating layer covering said roughened layer, a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals, and an anticorrosive layer further coating said treatment layer.
Claim 6
Dependent Claim
118 words
A copper foil for printed circuits comprising a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both, in an amount effective to form rounded protuberances in said roughened layer and inhibit the growth of dendrites therein, a copper plating layer covering said roughened layer, a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals, and an anticorrosive layer further coating said treatment layer.
Claim 7
Dependent Claim
77 words
A process for producing a copper foil for printed circuits which comprises electrolyzing a copper foil as a cathode in an acidic copper electrolytic bath at a current density around the critical, thereby forming a roughened layer consisting of a number of protuberant copper electrodeposits formed on the side of the copper foil to be bonded to a base, said electrolytic bath containing from 0.001 to 5 grams per liter of chromium ions, tungsten ions or both.
Claim 8
Dependent Claim
77 words
A process for producing a copper foil for printed circuits which comprises electrolyzing a copper foil as a cathode in an acidic copper electrolytic bath at a current density around the critical, thereby forming a roughened layer consisting of a number of protuberant copper electrodeposits formed on the side of the copper foil to be bonded to a base, said electrolytic bath containing from 0.001 to 5 grams per liter of chromium ions, tungsten ions or both.
Claim 9
Dependent Claim
52 words
A process according to claim 4 wherein the roughened layer is coated with a copper plating layer and then electrolytically overcoated with a treatment layer formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals.
Claim 10
Dependent Claim
13 words
A process according to claim 5, wherein the treatment layer in anti-corrosively treated.
Claim 11
Dependent Claim
23 words
A process according to claim 4, said bath containing from 0.001 to 5 gram per liter of chromium ion, tungsten ion or both.
Claim 12
Dependent Claim
22 words
A process according to claim 7, said bath containing 0.01 to 1 gram per liter of chromium ion, tungsten ion or both.
Claim 13
Dependent Claim
70 words
A copper foil for printed circuits comprising a copper foil and a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.001 to about 5 grams per liter of chromium ion, tungsten ion or both.
Claim 14
Dependent Claim
70 words
A copper foil for printed circuits comprising a copper foil and a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium, tungsten or both wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.001 to about 5 grams per liter of chromium ion, tungsten ion or both.
Claim 15
Dependent Claim
34 words
A copper foil according to claim 9, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.01 to about 1 gram per liter of chromium ion, tungsten ion or both.
Claim 16
Dependent Claim
122 words
A copper foil for printed circuits comprising: (i) a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium or tungsten, or both, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.001 to about 5 grams per liter of chromium ion, tungsten ion or both, (ii) a copper plating layer covering said roughened layer, and (iii) a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals.
Claim 17
Dependent Claim
122 words
A copper foil for printed circuits comprising: (i) a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium or tungsten, or both, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.001 to about 5 grams per liter of chromium ion, tungsten ion or both, (ii) a copper plating layer covering said roughened layer, and (iii) a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals.
Claim 18
Dependent Claim
34 words
A copper foil according to claim 11, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.01 to about 1 gram per liter of chromium ion, tungsten ion or both.
Claim 19
Dependent Claim
131 words
A copper foil for printed circuits comprising: (i) a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium or tungsten, or both, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.001 to about 5 grams per liter of chromium ion, tungsten ion or both, (ii) a copper plating layer covering said roughened layer, (iii) a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals, and (iv) an anticorrosive layer further coating said treatment layer.
Claim 20
Dependent Claim
131 words
A copper foil for printed circuits comprising: (i) a copper foil having a roughened layer formed on the side of the foil to be bonded to a base, said roughened layer consisting of a number of protuberant copper electrodeposits containing chromium or tungsten, or both, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.001 to about 5 grams per liter of chromium ion, tungsten ion or both, (ii) a copper plating layer covering said roughened layer, (iii) a treatment layer covering said copper plating layer, said treatment layer being formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals, and (iv) an anticorrosive layer further coating said treatment layer.
Claim 21
Dependent Claim
34 words
A copper foil according to claim 13, wherein said electrodeposits are obtained by electrodeposition from a bath containing from about 0.01 to about 1 gram per liter of chromium ion, tungsten ion or both.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-21 | 1998-05-23 | 1998-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-21 | 2002-05-23 | 2002-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-21 | 2006-05-23 | 2006-11-22 | $7700.00 | Window Closed / Lapsed |