Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing

Claim 1

An apparatus useful in semiconductor processing of substrates, said apparatus comprising: a) a substrate support platform having a substrate-facing surface, said substrate-facing surface comprising: 1) at least one fluid supply means, whereby a heat transfer fluid can be supplied to said substrate-facing surface; 2) a continuous, platform fluid flow barrier which extends upward from said substrate-facing surface at a location such that contact between said continuous platform fluid flow barrier and a substrate placed on said support platform occurs near the edge of said substrate; 3) at least one lift finger opening through said substrate-facing surface, through which a substrate lift finger can be operated; said lift finger opening being located on said substrate-facing surface interior from said continuous, platform fluid flow barrier; and b) at least one lift finger which can be extended upward from said substrate-facing surface of said support platform and which is positioned to operate through said lift finger opening, wherein said lift finger comprises: 1) a lift finger pin member; and 2) a lift finger sealing cover which extends from said lift finger pin member to a contact surface on said support platform during semiconductor processing, whereby a lift finger fluid flow barrier is formed by said contact surface between said lift finger sealing cover and said support platform surface so that a heat transfer fluid supplied to said substrate-facing surface does not flow through said lift finger opening.

Claim 2

An apparatus useful in semiconductor processing of substrates, said apparatus comprising: a) a substrate support platform having a substrate-facing surface, said substrate-facing surface comprising: 1) at least one fluid supply means, whereby a heat transfer fluid can be supplied to said substrate-facing surface; 2) a continuous, platform fluid flow barrier which extends upward from said substrate-facing surface at a location such that contact between said continuous platform fluid flow barrier and a substrate placed on said support platform occurs near the edge of said substrate; 3) at least one lift finger opening through said substrate-facing surface, through which a substrate lift finger can be operated; said lift finger opening being located on said substrate-facing surface interior from said continuous, platform fluid flow barrier; and b) at least one lift finger which can be extended upward from said substrate-facing surface of said support platform and which is positioned to operate through said lift finger opening, wherein said lift finger comprises: 1) a lift finger pin member; and 2) a lift finger sealing cover which extends from said lift finger pin member to a contact surface on said support platform during semiconductor processing, whereby a lift finger fluid flow barrier is formed by said contact surface between said lift finger sealing cover and said support platform surface so that a heat transfer fluid supplied to said substrate-facing surface does not flow through said lift finger opening.

Claim 11

A method useful in obtaining even and repeatable heat transfer over essentially an entire substrate used in a semiconductor process, said method comprising the steps of: a) providing a support platform, upon which a substrate to be processed is positioned; b) attaching said substrate to said support platform; c) causing a build up of heat transfer fluid between said substrate and said support platform; d) controlling the leakage of heat transfer fluid from between said substrate and said support platform using a continuous, platform fluid flow barrier located near the edge of said substrate, wherein said platform fluid flow barrier is in contact with both said support platform and said substrate to be processed; e) locating at least one lift finger, which can be used to raise substrate above said support platform, interior to said continuous, platform fluid flow barrier; and f) providing a means for preventing fluid flow through at least one opening on the surface in said support platform through which said at least one lift finger is operated, wherein said means for preventing flow of said heat transfer fluid through said lift finger opening comprises a lift finger sealing cover which contacts a surface upon said support platform in a manner which creates a barrier to the flow of fluid through said at least one lift finger opening.

Claim 12

A method useful in obtaining even and repeatable heat transfer over essentially an entire substrate used in a semiconductor process, said method comprising the steps of: a) providing a support platform, upon which a substrate to be processed is positioned; b) attaching said substrate to said support platform; c) causing a build up of heat transfer fluid between said substrate and said support platform; d) controlling the leakage of heat transfer fluid from between said substrate and said support platform using a continuous, platform fluid flow barrier located near the edge of said substrate, wherein said platform fluid flow barrier is in contact with both said support platform and said substrate to be processed; e) locating at least one lift finger, which can be used to raise substrate above said support platform, interior to said continuous, platform fluid flow barrier; and f) providing a means for preventing fluid flow through at least one opening on the surface in said support platform through which said at least one lift finger is operated, wherein said means for preventing flow of said heat transfer fluid through said lift finger opening comprises a lift finger sealing cover which contacts a surface upon said support platform in a manner which creates a barrier to the flow of fluid through said at least one lift finger opening.