US5362656A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making an electronic assembly having a flexible circuit wrapped around a substrate
Assignee: Intel Corp
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Filing: 1994-04-15
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Granted: 1994-11-08
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Expires: 2014-04-15
Abstract
Abstract An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
Inventors
- 👤 John F. McMahon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:19
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/451; H10W70/453; H10W72/071; H10W72/077; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49128
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
85 words
A method of constructing an electronic assembly, comprising the steps of: a) providing a substrate that has a top surface and a bottom surface; b) mounting an electrical device to said top surface of said substrate; c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a metal pad; d) wrapping said flexible circuit around said substrate such that said metal pad is adjacent to said bottom surface of said substrate; and, e) bonding said flexible circuit to said substrate.
Claim 2
Independent Claim
85 words
A method of constructing an electronic assembly, comprising the steps of: a) providing a substrate that has a top surface and a bottom surface; b) mounting an electrical device to said top surface of said substrate; c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a metal pad; d) wrapping said flexible circuit around said substrate such that said metal pad is adjacent to said bottom surface of said substrate; and, e) bonding said flexible circuit to said substrate.
Claim 3
Dependent Claim
25 words
The method as recited in claim 1, wherein said flexible circuit is wrapped around said substrate before said leads are attached to said electrical device.
Claim 4
Dependent Claim
20 words
The method as recited in claim 1, further comprising the step of encapsulating said electrical device with a dielectric material.
Claim 5
Dependent Claim
35 words
The method as recited in claim 1, further comprising the step of bonding a portion of said flexible circuit to said top surface of said substrate before said flexible circuit is wrapped around said substrate.
Claim 6
Independent Claim
130 words
A method of constructing an electronic assembly, comprising the steps of: a) providing a substrate that has a top surface and a bottom surface; b) mounting an electrical device to said top surface of said substrate; c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a hole that provides access to a conductive line that extends from said lead; d) wrapping said flexible circuit around said substrate such that said hole is adjacent to said bottom surface of said substrate; e) bonding said flexible circuit to said substrate; f) placing a solder preform into said hole of said flexible circuit; g) heating said solder preform until said solder attains a liquid form; and, h) cooling said solder until said solder attains a solid form.
Claim 7
Independent Claim
130 words
A method of constructing an electronic assembly, comprising the steps of: a) providing a substrate that has a top surface and a bottom surface; b) mounting an electrical device to said top surface of said substrate; c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a hole that provides access to a conductive line that extends from said lead; d) wrapping said flexible circuit around said substrate such that said hole is adjacent to said bottom surface of said substrate; e) bonding said flexible circuit to said substrate; f) placing a solder preform into said hole of said flexible circuit; g) heating said solder preform until said solder attains a liquid form; and, h) cooling said solder until said solder attains a solid form.
Claim 8
Dependent Claim
25 words
The method as recited in claim 5, wherein said flexible circuit is wrapped around said substrate before said leads are attached to said electrical device.
Claim 9
Dependent Claim
20 words
The method as recited in claim 5, further comprising the step of encapsulating said electrical device with a dielectric material.
Claim 10
Dependent Claim
35 words
The method as recited in claim 5, further comprising the step of bonding a portion of said flexible circuit to said top surface of said substrate before said flexible circuit is wrapped around said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-07 | 1998-05-09 | 1998-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-07 | 2002-05-09 | 2002-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-07 | 2006-05-09 | 2006-11-08 | $7700.00 | Window Closed / Lapsed |