PTC device

Claim 2

A PTC device comprising: a PTC element formed of a PTC composition, including a polymer having conductive particles dispersed therein; said polymer further includes at least one of a high density polyethylene and ethylene-acrylic acid copolymer; two electrodes formed of an electrode composition; said electrode composition including a metal foil having a conductive layer formed of a conductive paste; said conductive paste further comprising a mixture of conductive particles and a binder coated thereon; said conductive particles further comprising at least one conductive material selected from the group consisting of pure metal particles, metal alloy particles, metallic plated metal particles, carbonaceous particles, metallic coated carbonaceous particles, and metallic alloy coated carbonaceous particles; wherein said pure metal particles include at least one selected from the group consisting of Pt, Au, Ag and NI and wherein said metal alloy particles include at least on of PD and Ag-Pd; said binder being mixture of at least one of thermosetting resins and a thermoplastic resin having heat resistant properties capable of withstanding operational temperatures of said PTC device; said two electrodes being affixed to opposed surfaces of said PTC element with said conductive paste contacting said opposed surfaces; and said conductive paste having a thermal coefficient of expansion intermediate between thermal coefficients of expansion of said PTC element and said metal foil.

Claim 3

The PTC device according to claim 1, wherein said PTC element is a parallelepiped.

Claim 4

The PTC device according to claim 1, wherein said conductive layer has a rough surface contacting said PTC element.

Claim 5

The PTC device according to claim 3, wherein a metal powder is embedded in said conductive layer so as to create said rough surface.

Claim 6

The PTC device according to claim 4 wherein the metal powder is at least one of nickel, carbonyl nickel, and silver.

Claim 7

A process for producing a PTC device which comprises: forming a PTC element, formed of a PTC composition, including a polymer having conductive particles dispersed therein, having opposing sides; said polymer further including at least one of a high density polyethylene, ethylene-acrylic acid copolymer, and conductive particles, wherein said conductive particles include at least one conductive material selected from the group consisting of pure metal particles, metal alloy particles, metallic plated metal particles, carbonaceous particles, metallic coated carbonaceous particles, and metallic alloy coated carbonaceous particles; wherein said pure metal particles is at least one material selected from the group consisting of Pt, Au, Ag and Ni, and wherein said metal alloy particles are at least one selected from the group consisting of Au-Pd and Ag-Pd; mixing a conductive paste further comprising a mixture of conductive particles and a binder; said binder being mixture of at least one of thermosetting resins and a thermoplastic resin having heat resistant properties capable of withstanding operational temperatures of said PTC device; coating first and second metal foils with said conductive paste; curing said conductive paste to create a conductive layer on each of said first and second metal foils; affixing said conductive layer on said first metal foil to a first surface of said PTC element; and affixing said conductive layer on said second metal foil to an opposed surface of said PTC element, whereby said PTC element is disposed between said first and second metal foils, with said conductive layers interposed between said PTC element and the respective metal foils.

Claim 8

A process for producing a PTC device which comprises: forming a PTC element, formed of a PTC composition, including a polymer having conductive particles dispersed therein, having opposing sides; said polymer further including at least one of a high density polyethylene, ethylene-acrylic acid copolymer, and conductive particles, wherein said conductive particles include at least one conductive material selected from the group consisting of pure metal particles, metal alloy particles, metallic plated metal particles, carbonaceous particles, metallic coated carbonaceous particles, and metallic alloy coated carbonaceous particles; wherein said pure metal particles is at least one material selected from the group consisting of Pt, Au, Ag and Ni, and wherein said metal alloy particles are at least one selected from the group consisting of Au-Pd and Ag-Pd; mixing a conductive paste further comprising a mixture of conductive particles and a binder; said binder being mixture of at least one of thermosetting resins and a thermoplastic resin having heat resistant properties capable of withstanding operational temperatures of said PTC device; coating first and second metal foils with said conductive paste; curing said conductive paste to create a conductive layer on each of said first and second metal foils; affixing said conductive layer on said first metal foil to a first surface of said PTC element; and affixing said conductive layer on said second metal foil to an opposed surface of said PTC element, whereby said PTC element is disposed between said first and second metal foils, with said conductive layers interposed between said PTC element and the respective metal foils.

Claim 9

A process according to claim 6 further comprising roughening surfaces of said conductive paste after curing thereof, and before the step of affixing.

Claim 10

A process according to claim 7 wherein the step of roughening includes exposing the conductive layer to a plasma.

Claim 11

A process according to claim 7 wherein the step of roughening includes exposing the conductive layer to an ultraviolet radiation.

Claim 12

A process according to claim 7 wherein the step of roughening includes embedding a metal powder into a surface of the conductive coating.

Claim 13

A process according to claim 10 wherein the metal powder is at least one of nickel, carbonyl nickel, and silver.

Claim 14

A process according to claim 6 wherein the step of forming the PTC element including a polymer having conductive particles dispersed therein further includes: blending and grinding a mixture of a PTC composition and conductive particles at an elevated temperature; cooling the mixture; grinding the mixture into pieces; forming the pieces into said PTC element; and exposing the PTC element to gamma radiation in order to cross link the resultant PTC element.

Claim 15

The process of claim 7, wherein the step of roughening including sandblasting the conductive layer.