Method of forming contact windows in semiconductor devices

Claim 2

A manufacturing method of semiconductor devices, comprising the steps of: forming a plurality of pattern portions containing internal wiring layers over a semiconductor substrate; forming interlayer insulating films for insulating said internal wiring layers from each other over said semiconductor substrate; forming an opening portion, in said interlayer insulating films, which allows said substrate and at least one of said pattern portions to appear; and forming a sidewall insulating film on the sidewall of at least one of said pattern portions appearing in said opening portion.

Claim 3

A manufacturing method according to claim 1, wherein said patterns are provided with protective layers for protecting said internal wiring layers from an etchant used to form said opening portion.

Claim 4

A manufacturing method according to claim 1, wherein said sidewall insulating film is formed by forming an insulating film from the inside of said opening portion to said interlayer insulating films and then anisotropically etching the resulting insulating film.

Claim 5

A manufacturing method according to claim 2, wherein said protective layers are made of a material that is to be etched at a speed lower than the etching speed of said interlayer insulating films during etching for the formation of said opening portion.

Claim 6

A manufacturing method according to claim 4, wherein said protective layers are made of a material mainly containing silicon, when said interlayer insulating films are made of a material mainly containing silicate glass.

Claim 7

A manufacturing method according to claim 5, wherein said material mainly containing silicon is oxidized after the formation of said opening portion.

Claim 8

A manufacturing method of semiconductor devices, comprising the steps of: forming a plurality of first pattern portions containing first-level internal wiring layers over a semiconductor substrate; forming first interlayer insulating films for insulating said first-level internal wiring layers from each other over said semiconductor substrate; forming a plurality of second pattern portions containing second-level internal wiring layers over said first inter layer insulating films; forming second interlayer insulating films for insulating said second-level internal wiring layers from each other over said semiconductor substrate; forming an opening portion, penetrating through said second interlayer insulating films and said first interlayer insulating films, which allows said substrate and at least one portion of said first and second pattern portions to appear; and forming a sidewall insulating film on the sidewall of at least one of said first pattern portions appearing in said opening portion.

Claim 9

A manufacturing method of semiconductor devices, comprising the steps of: forming a plurality of first pattern portions containing first-level internal wiring layers over a semiconductor substrate; forming first interlayer insulating films for insulating said first-level internal wiring layers from each other over said semiconductor substrate; forming a plurality of second pattern portions containing second-level internal wiring layers over said first inter layer insulating films; forming second interlayer insulating films for insulating said second-level internal wiring layers from each other over said semiconductor substrate; forming an opening portion, penetrating through said second interlayer insulating films and said first interlayer insulating films, which allows said substrate and at least one portion of said first and second pattern portions to appear; and forming a sidewall insulating film on the sidewall of at least one of said first pattern portions appearing in said opening portion.

Claim 10

A manufacturing method according to claim 7, wherein said first patterns are provided with protective layers for protecting said first-level internal wiring layers from an etchant used to form said opening portion.

Claim 11

A manufacturing method according to claim 7, wherein said sidewall insulating film is formed by forming an insulating film from the inside of said opening portion to said second interlayer insulating films and then anisotropically etching the resulting insulating film.

Claim 12

A manufacturing method according to claim 8, wherein said protective layers are made of a material that is to be etched at a speed lower than the etching speed of said first and second interlayer insulating films during etching for the formation of said opening portion.

Claim 13

A manufacturing method according to claim 10, wherein said protective layers are made of a material mainly containing silicon, when said first and second interlayer insulating films are made of a material mainly containing silicate glass.

Claim 14

A manufacturing method according to claim 11, wherein said material mainly containing silicon is oxidized after the formation of said opening portion.

Claim 15

A manufacturing method of semiconductor devices, comprising the steps of: forming a plurality of first pattern portions containing first-level internal wiring layers over a semiconductor substrate; forming first interlayer insulating films for insulating said internal wiring layers from each other over said semiconductor substrate; forming a plurality of second pattern portions containing second-level internal wiring layers over said first interlayer insulating films; forming second interlayer insulating films for insulating said second-level internal wiring layers from each other over said semiconductor substrate; forming an opening portion, penetrating through said second interlayer insulating films and said first interlayer insulating films, which allows said substrate, at least one of said first pattern portions and at least one of said second pattern portions to appear; and forming a sidewall insulating film on each of the sidewalls of at least one of said first pattern portions and at least one of said second pattern portions appearing in said opening portion.

Claim 16

A manufacturing method of semiconductor devices, comprising the steps of: forming a plurality of first pattern portions containing first-level internal wiring layers over a semiconductor substrate; forming first interlayer insulating films for insulating said internal wiring layers from each other over said semiconductor substrate; forming a plurality of second pattern portions containing second-level internal wiring layers over said first interlayer insulating films; forming second interlayer insulating films for insulating said second-level internal wiring layers from each other over said semiconductor substrate; forming an opening portion, penetrating through said second interlayer insulating films and said first interlayer insulating films, which allows said substrate, at least one of said first pattern portions and at least one of said second pattern portions to appear; and forming a sidewall insulating film on each of the sidewalls of at least one of said first pattern portions and at least one of said second pattern portions appearing in said opening portion.

Claim 17

A manufacturing method according to claim 13, wherein said first patterns are provided with first protective layers for protecting said first-level internal wiring layers from an etchant used to form said opening portion; and said second patterns are provided with second protective layers for protecting said second-level internal wiring layers from an etchant used to form said opening portion.

Claim 18

A manufacturing method according to claim 13, wherein said sidewall insulating film is formed by forming an insulating film from the inside of said opening portion to said second interlayer insulating films and then anisotropically etching the resulting insulating film.

Claim 19

A manufacturing method according to claim 14, wherein said first and second protective layers are made of a material that is to be etched at a speed lower than the etching speed of said first and second interlayer insulating films during etching for the formation of said opening portion.

Claim 20

A manufacturing method according to claim 16, wherein said first and second protective layers are made of a material mainly containing silicon, when said first and second interlayer insulating films are made of a material mainly containing silicate glass.

Claim 21

A manufacturing method according to claim 17, wherein said material mainly containing silicon is oxidized after the formation of said opening portion.