Modular floor sub-structure for the operational support of computer systems

Claim 2

A floor supported substructure system for a computer system component having a given base peripheral configuration with a base region through which heat removing air may enter, said system component having given operational heat dissipation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported from said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a chamber intermediate said lower portion and said elevated floor surface; the said elevated floor surface of a first said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region; second and third said floor modules positioned in adjacency with said first module and oriented to effect a substantial alignment of said elevated floor surfaces thereof: a said floor module chamber retaining an air circulation blower having an input and an air flow output to provide a discrete said floor module providing said air flow output at a capacity corresponding with said heat dissipation characteristic; and an air flow path defined by at least one said chamber extending from said blower airflow output to said air outlet.

Claim 3

The system of claim 1 wherein a said floor module chamber retains an uninterruptible power supply having an output capacity corresponding with said power consumption characteristic and having a power output connectable in power supply relationship with said computer system component to provide a discrete said floor module dedicated to supplying said power output.

Claim 4

The system of claim 1 wherein a said floor module chamber retains a cooling coil having a cooling capacity corresponding with said operational heat dissipation characteristic, within an air path extending to said air circulation blower input.

Claim 5

The system of claim 3 wherein a said floor module chamber retains an uninterruptible power supply having an output capacity corresponding with said power consumption characteristic, said uninterruptible power supply being located within said air flow path in downstream relationship with respect to said air outlet and defining a discrete said floor module dedicated to providing said output capacity.

Claim 6

The system of claim 1 in which: said floor module lower portion comprises a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface; said side portions are provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein; and at least one rigid, rectangular floor tile removably supportable at said top edge for support by said four panel portions, the upwardly disposed surface thereof providing said elevated floor surface.

Claim 7

The system of claim 5 in which: said floor module lower portion rectangular bottom surface has a predetermined widthwise extent and a lengthwise extent substantially twice said widthwise extent; including a crossover support extending widthwise between said panel portions which extend along said lengthwise extent; and said elevated floor surface is provided as two substantially square said rigid floor tiles.

Claim 8

The system of claim 5 in which: said computer system component is movably supported upon spaced apart wheels mounted at said base region; and including a ramp assemblage comprising two ramps each formed having two ramp members foldably coupled together at a hinge connection, one end of a said ramp member being hingedly coupled with a bridging member extensible to and supportable upon a said floor tile, each said ramp including a downwardly depending flange engaging coupler located adjacent said bridging member and configured for abuttable positioning over a said side portion top edge, said ramps being positionable in spaced apart relationship corresponding with said spaced apart wheels for receiving said wheels and supporting said computer system component for movement onto and off of said assemblage elevated floor.

Claim 9

A floor supported substructure system for a computer component having a given base peripheral configuration with a base region through which heat removing air may enter, said system component having given operational heat dissipation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported from saint floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion said elevated floor surface; said floor module lower portion comprising a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface; said side portions being provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein and having a connector flange structure fixed to and outwardly offset from said top edge; at least one rigid, rectangular floor tile removably positionable in nesting relationship within said connector flange structure for support by said four panel portions, the upwardly disposed surface thereof providing said elevated floor surface; the said elevated floor surface of a first said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region; a said floor module discrete chamber retaining an air circulation blower having an input and an air flow output; an air flow path defined by at least one said discrete chamber extending from said blower airflow output to said air outlet; second and third said floor modules positioned in adjacency with said first floor module and oriented to effect a substantial alignment of said elevated floor surfaces thereof.

Claim 10

A floor supported substructure system for a computer component having a given base peripheral configuration with a base region through which heat removing air may enter, said system component having given operational heat dissipation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported from saint floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion said elevated floor surface; said floor module lower portion comprising a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface; said side portions being provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein and having a connector flange structure fixed to and outwardly offset from said top edge; at least one rigid, rectangular floor tile removably positionable in nesting relationship within said connector flange structure for support by said four panel portions, the upwardly disposed surface thereof providing said elevated floor surface; the said elevated floor surface of a first said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region; a said floor module discrete chamber retaining an air circulation blower having an input and an air flow output; an air flow path defined by at least one said discrete chamber extending from said blower airflow output to said air outlet; second and third said floor modules positioned in adjacency with said first floor module and oriented to effect a substantial alignment of said elevated floor surfaces thereof.

Claim 11

The system of claim 8 in which: said second and third floor modules are removably connected with said first floor module at the abutting said connector flange structures thereof to define a gap intermediate said panel portions; said air flow path is defined by blocking means for closing select said panel openings.

Claim 12

The system of claim 1 wherein a said floor module chamber retains a power distribution network having circuit breaker protection, and having an output connected in power supply relationship with said air circulation blower to define a discrete said floor module dedicated to providing said power distribution network output.

Claim 13

The system of claim 1 in which said elevated floor surface given height is about ten inches.

Claim 14

The system of claim 1 in which each said floor module is configured to provide a said elevated floor surface having a rectangular periphery with dimensions of about two feet by four feet.

Claim 15

The system of claim 1 including an environmental confinement enclosure positioned over said elevated floor surface having side walls extending from said elevated floor surface to a top cover located above said computer system component, and having a normally closed access opening for accessing said computer system component.

Claim 16

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form an elevated floor of predetermined peripheral geometric shape including a linear side portion; a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto; the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region; a said floor module chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output; an air flow path defined by at least one said chamber extending from said blower air flow output to said air outlet; and said cooling coil and said air circulation blower having capacities corresponding with said computer system component operational heat generation characteristic.

Claim 17

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form an elevated floor of predetermined peripheral geometric shape including a linear side portion; a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto; the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region; a said floor module chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output; an air flow path defined by at least one said chamber extending from said blower air flow output to said air outlet; and said cooling coil and said air circulation blower having capacities corresponding with said computer system component operational heat generation characteristic.

Claim 18

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form elevated floor of predetermined peripheral geometric shape including a linear side portion; a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto; a step structure having oppositely disposed floor supported side members extending upwardly a step height less than said floor module given height to a step surface, and defining a step cavity therewithin, one said side member being positioned in abutting adjacency with said assemblage linear side portion; said cooling fluid conduits being located within said step cavity and coupled with said cooling coil; the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region; a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output; and an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.

Claim 19

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form elevated floor of predetermined peripheral geometric shape including a linear side portion; a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto; a step structure having oppositely disposed floor supported side members extending upwardly a step height less than said floor module given height to a step surface, and defining a step cavity therewithin, one said side member being positioned in abutting adjacency with said assemblage linear side portion; said cooling fluid conduits being located within said step cavity and coupled with said cooling coil; the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region; a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output; and an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.

Claim 20

The substructure assemblage of claim 15 wherein a first said floor module retains said air circulation blower and said cooling coil within the said chamber thereof.

Claim 21

The substructure assemblage of claim 14 in which said air outlet is within the said elevated floor surface of a second said floor module; and wherein an uninterruptible power supply having an output capacity corresponding with said power consumption characteristic is retained within the said chamber of said second module and includes an output connectable in power supply relationship with said computer system component.

Claim 22

The substructure assemblage of claim 14 in which an uninterruptible power supply having an output capacity corresponding with said power consumption characteristic is mounted within the said cavity of a second said floor module, and includes a power output connectable in power supply relationship with said computer system component to define a discrete said floor module dedicated to providing said power output.

Claim 23

The substructure assemblage of claim 14 in which a power distribution network having circuit breaker protection is mounted within the chamber of a third said floor module and having an output connectable in power supply relationship with said air circulation blower to define a discrete said third floor module dedicated to providing said power distribution network output.

Claim 24

The substructure assemblage of claim 14 in which: each said floor module lower portion comprises a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface; said side portions are provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein; and at least one rigid, rectangular floor tile removably supportable at said top edge for support by said four panel portions, the upwardly disposed surface thereof providing said elevated floor surface.

Claim 25

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form an elevated floor of predetermined peripheral geometric shape including a linear side portion; each said floor module lower portion comprising a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface; said side portions being provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein and having a connector flange structure fixed to and outwardly offset from said top edge; at least one rigid, rectangular floor tile removably positionable in nesting relationship within said connector flange structure for support by said four panel portions, the upwardly disposed surface thereof providing an elevated floor surface; a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake formed within said module adjacent thereto; the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region; a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output; and an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.

Claim 26

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form an elevated floor of predetermined peripheral geometric shape including a linear side portion; each said floor module lower portion comprising a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface; said side portions being provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein and having a connector flange structure fixed to and outwardly offset from said top edge; at least one rigid, rectangular floor tile removably positionable in nesting relationship within said connector flange structure for support by said four panel portions, the upwardly disposed surface thereof providing an elevated floor surface; a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake formed within said module adjacent thereto; the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region; a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output; and an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.

Claim 27

The substructure assemblage of claim 21 in which adjacent ones of said floor modules of said assemblage are interconnected at the mutually abutting said connector flange structures thereof to define a gap intermediate said panel portions; and said air path is defined by blocking means for closing select said panel openings.

Claim 28

The substructure assemblage of claim 21 in which: said computer system component is movably supported upon spaced apart wheels mounted at said base region; including a ramp assemblage comprising two ramps each formed of two ramp members foldably coupled together at a hinge connection, one end of a said ramp member being hingedly coupled with a bridging member extensible to and supportable upon a said floor tile at a location over said crossover support, each said ramp including a downwardly depending flange engaging coupler configured for abuttable positioning over a said side portion top edge, said ramps being positionable in spaced apart relationship corresponding with said spaced apart wheels for receiving said wheels and supporting said computer system component for movement onto and off of said assemblage elevated from

Claim 29

The substructure of claim 14 including an environmental confinement enclosure positioned over said assemblage elevated floor surface, having side walls extending from said elevated floor surface to a top cover located above said computer system component, and having a normally closed access opening for accessing said computer system component.

Claim 30

A floor module for use in assembling a floor supported sub-structure configured to support a computer system component having given operational heat generation and power consumption characteristics, comprising: a frame having a rectangular bottom surface and four side panels extending upwardly therefrom to an edge portion defining four corners and having air transfer openings formed therein, and a flange connector structure including a seat flange extending horizontally outwardly from said edge portion to an upstanding connector flange; a vertically adjustable floor engaging foot component mounted to said frame in the vicinity of each said corner; at least one floor tile positionable upon said frame over said seat flange anti defining a discrete cavity therewith; and blocking means positionable in abutment with select said side panels for blocking the flow of air through an adjacent said air transfer opening.

Claim 31

A floor module for use in assembling a floor supported sub-structure configured to support a computer system component having given operational heat generation and power consumption characteristics, comprising: a frame having a rectangular bottom surface and four side panels extending upwardly therefrom to an edge portion defining four corners and having air transfer openings formed therein, and a flange connector structure including a seat flange extending horizontally outwardly from said edge portion to an upstanding connector flange; a vertically adjustable floor engaging foot component mounted to said frame in the vicinity of each said corner; at least one floor tile positionable upon said frame over said seat flange anti defining a discrete cavity therewith; and blocking means positionable in abutment with select said side panels for blocking the flow of air through an adjacent said air transfer opening.

Claim 32

The floor module of claim 25 including an air circulation blower mounted within said frame and having an upstream air inlet and an air output positioned adjacent a selective said air transfer opening.

Claim 33

The floor module of claim 26 including a cooling coil having a cooling capacity corresponding with said operational heat generation characteristics mounted with said frame.

Claim 34

The floor module of claim 25 including an uninterruptible power supply having an output capacity corresponding with said power consumption characteristic mounted within said frame and having an output connectable in power supply relationship with said computer system component.

Claim 35

The floor module of claim 28 including an air outlet formed within said floor tile and communicating in air transfer relationship with said discrete cavity.

Claim 36

The floor module of claim 25 including a power distribution network having circuit breaker protection mounted within said frame.

Claim 37

The floor module of claim 25 in which: said frame flange connector structure is configured for supporting two adjacently positioned said floor tiles having square peripheries; and including a crossover support extending between oppositely disposed said side panels at the level of said seat flange and located to support the mutually adjacently disposed edges of said two floor tiles.

Claim 38

The floor module of claim 25 in which: said frame bottom surface is foraged having openings adjacent each of said four corners, and each said foot component is retractable within said discrete chamber through an adjacent said opening within said bottom surface.

Claim 39

The system of claim 9 in which said blocking means includes a compressible foam gasket dimensioned to be substantially co-extensive with a said panel portion and having a widthwise extent corresponding with the width of said gap.

Claim 40

The system of claim 8 in which: said floor module lower portion rectangular bottom surface has a predetermined widthwise extent and a lengthwise extent substantially twice said widthwise extent; including a crossover support extending between said panel portions which extends along said lengthwise extent; and said elevated floor surface is provided as two substantially square said rigid floor tiles.

Claim 41

The system of claim 8 in which: said computer system component is movably supported upon spaced apart wheels mounted at said base region; and including a ramp assemblage comprising two ramps each formed having two ramp members foldably coupled together at a hinge connection, one end of a said ramp member being hingedly coupled with a bridging member extensible to and supportable upon a said floor tile, each said ramp including a downwardly depending flange engaging coupler located adjacent said bridging member and configured for abuttable positioning over a said connector flange structure, said ramps being positionable in spaced apart relationship corresponding with said spaced apart wheels for receiving said wheels and supporting said computer system component for movement onto and off of said assemblage elevated floor.

Claim 42

The substructure assemblage of claim 15 including: a condensate collection pan mounted within said discrete chamber below said cooling coil and having a drain conduit extending therefrom into said step cavity; and a condensate pump located within said step cavity and having an input coupled with said drain conduit.

Claim 43

The substructure of claim 15 wherein a said floor module having a said side portion forming an assemblage linear side portion retains an uninterruptible power supply having an output capacity corresponding with said power consumption characteristics and having an output connectable in power supply relationship with said computer system component.

Claim 44

The substructure of claim 15 wherein a said floor module having a said side portion forming an assemblage linear side portion retains a power distribution network having circuit breaker protection and having an output connected in power supply relationship with said air circulation blower.

Claim 45

The substructure assemblage of claim 21 in which: said floor module lower portion rectangular bottom surface has a predetermined widthwise extent and a lengthwise extent substantially twice said widthwise extent; including a crossover support extending between said panel portions extending along said lengthwise extent; and said elevated floor surface is provided as two substantially square said rigid floor tiles.

Claim 46

The substructure assemblage of claim 20 in which: said floor module lower portion rectangular bottom surface has a predetermined widthwise extent and a lengthwise extent substantially twice said widthwise extent; including a crossover support which extend between said panel portions extending along said lengthwise extent; and said elevated floor surface is provided as two substantially square said rigid floor tiles.

Claim 47

The substructure assemblage of claim 39 in which: said computer system component is movably supported upon spaced apart wheels mounted at said base region; and including a ramp assemblage comprising two ramps each formed of two ramp members foldably coupled together at a hinge connection, one end of a said ramp member being hingedly coupled with a bridging member extensible to and supportable upon a said floor tile at a location over said crossover support, each said ramp including a downwardly depending flange engaging coupled configured for abuttable positioning over a said connector flange structure, said ramps being positionable in spaced apart relationship corresponding with said spaced apart wheels for receiving said wheels and supporting said computer system component for movement onto and off of said assemblage elevated floor.