US5345366A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate to substrate standoff assembly
Assignee: Motorola Solutions Inc
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Filing: 1993-05-21
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Granted: 1994-09-06
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Expires: 2013-05-21
Abstract
Abstract A substrate to substrate interconnect and standoff assembly (10) comprises an electronic coupling (39) between the bottom of a first substrate (14) and the bottom of a second substrate (12), an electronic coupling (24) of the top of the first substrate to the bottom of the second substrate, a stand-off (20) between the first substrate and the second substrate, and a mechanical coupling (16) between the first substrate to the second substrate.
Inventors
- 👤 Chee F. Cheng
- 👤 Chiou C. You
- 👤 Kai L. Tong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:00
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K2201/00; H05K2201/04; H05K2201/042; H05K2201/20; H05K2201/2036
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
64 words
A substrate to substrate interconnect and standoff assembly, comprising: means for electronically coupling a bottom of a first substrate to the bottom of a second substrate; means for electronically coupling a top of the first substrate to the bottom of the second substrate; means for standing-off the first substrate from the second substrate; and means for retaining the first substrate to the second substrate.
Claim 2
Dependent Claim
64 words
A substrate to substrate interconnect and standoff assembly, comprising: means for electronically coupling a bottom of a first substrate to the bottom of a second substrate; means for electronically coupling a top of the first substrate to the bottom of the second substrate; means for standing-off the first substrate from the second substrate; and means for retaining the first substrate to the second substrate.
Claim 3
Dependent Claim
25 words
The substrate to substrate interconnect and standoff assembly of claim 1, wherein the means for standing-off comprises a substantially cylindrical shaped sleeve having vertical conductors.
Claim 4
Dependent Claim
27 words
The substrate to substrate interconnect and standoff assembly of claim 2, wherein the cylindrical shaped sleeve is made of compressible rubber and the vertical conductors are wires.
Claim 5
Dependent Claim
27 words
The substrate to substrate interconnect and standoff assembly of claim 2, wherein the cylindrical shaped sleeve is made of plastic and the vertical conductors are metal strips.
Claim 6
Dependent Claim
42 words
The substrate to substrate interconnect and standoff assembly of claim 1, wherein the means for electronically coupling the top of a first substrate to the bottom of a second substrate comprises a substantially cylindrical shaped sleeve having vertical conductors within the sleeve.
Claim 7
Dependent Claim
59 words
The substrate to substrate interconnect and standoff assembly of claim 1, wherein the means for electronically coupling the bottom of the first substrate to the bottom of the second substrate comprises a core for insertion through a hole in the first substrate and through a substantially cylindrical shaped sleeve, the core having substantially "L" shaped conductors within the core.
Claim 8
Dependent Claim
24 words
The substrate to substrate interconnect and standoff assembly of claim 6, wherein the core is an integral portion of a boss in a housing.
Claim 9
Dependent Claim
56 words
The substrate to substrate interconnect and standoff assembly of claim 1, wherein the means for retaining the first substrate to the second substrate comprises a screw inserted within a opening in the top substrate and a hole in the means for electronically coupling the top of the first substrate to the bottom of the second substrate.
Claim 10
Dependent Claim
25 words
The substrate to substrate interconnect and standoff assembly of claim 1, wherein the means for retaining the first substrate to the second substrate comprises adhesive.
Claim 11
Dependent Claim
94 words
A substrate to substrate interconnect and standoff assembly, comprising: a sleeve having a plurality of conductors within a periphery of a wall of the sleeve, the conductors arranged and constructed to vertically run from a top portion to a bottom portion of the sleeve, the sleeve allowing the electronic coupling of the top portion of a first substrate to the bottom portion of a second substrate; a core for insertion in an opening in the first substrate and for insertion in the sleeve; and means for retaining the first substrate to the second substrate.
Claim 12
Dependent Claim
94 words
A substrate to substrate interconnect and standoff assembly, comprising: a sleeve having a plurality of conductors within a periphery of a wall of the sleeve, the conductors arranged and constructed to vertically run from a top portion to a bottom portion of the sleeve, the sleeve allowing the electronic coupling of the top portion of a first substrate to the bottom portion of a second substrate; a core for insertion in an opening in the first substrate and for insertion in the sleeve; and means for retaining the first substrate to the second substrate.
Claim 13
Dependent Claim
24 words
The substrate to substrate interconnect and standoff assembly of claim 10, wherein the core is an integral portion of a boss in a housing.
Claim 14
Dependent Claim
43 words
The substrate to substrate interconnect and standoff assembly of claim 10, wherein the core is arranged and constructed to have conductors within the core allowing for the electrical interconnection of the bottom of the first substrate to the bottom of the second substrate.
Claim 15
Dependent Claim
40 words
The substrate to substrate interconnect and standoff assembly of claim 10, wherein the means for retaining the first substrate to the second substrate comprises a screw inserted within a opening in the top substrate and a hole in the core.
Claim 16
Dependent Claim
25 words
The substrate to substrate interconnect and standoff assembly of claim 10, wherein the means for retaining the first substrate to the second substrate comprises adhesive.
Claim 17
Dependent Claim
86 words
A substrate to substrate standoff assembly, comprising: a first substrate having conductors on a top portion and a bottom portion; a second substrate having conductors on at least a bottom portion; means for electronically coupling the bottom of the first substrate to the bottom of the second substrate; means for electronically coupling the top of the first substrate to the bottom of the second substrate; means for standing-off the first substrate from the second substrate; and means for retaining the first substrate to the second substrate.
Claim 18
Dependent Claim
86 words
A substrate to substrate standoff assembly, comprising: a first substrate having conductors on a top portion and a bottom portion; a second substrate having conductors on at least a bottom portion; means for electronically coupling the bottom of the first substrate to the bottom of the second substrate; means for electronically coupling the top of the first substrate to the bottom of the second substrate; means for standing-off the first substrate from the second substrate; and means for retaining the first substrate to the second substrate.
Claim 19
Dependent Claim
25 words
The substrate to substrate interconnect and standoff assembly of claim 15, wherein the means for standing-off comprises a substantially cylindrical shaped sleeve having vertical conductors.
Claim 20
Dependent Claim
59 words
The substrate to substrate interconnect and standoff assembly of claim 15, wherein the means for electronically coupling the bottom of the first substrate to the bottom of the second substrate comprises a core for insertion through a hole in the first substrate and through a substantially cylindrical shaped sleeve, the core having substantially "L" shaped conductors within the core.
Claim 21
Dependent Claim
24 words
The substrate to substrate interconnect and standoff assembly of claim 17, wherein the core is an integral portion of a boss in a housing.
Claim 22
Dependent Claim
56 words
The substrate to substrate interconnect and standoff assembly of claim 15, wherein the means for retaining the first substrate to the second substrate comprises a screw inserted within a opening in the top substrate and a hole in the means for electronically coupling the top of the first substrate to the bottom of the second substrate.
Claim 23
Dependent Claim
25 words
The substrate to substrate interconnect and standoff assembly of claim 15, wherein the means for retaining the first substrate to the second substrate comprises adhesive.
References Cited (Backward Citations)
US3596138A
Cited
US5172303A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-05 | 1998-03-07 | 1998-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-05 | 2002-03-07 | 2002-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-05 | 2006-03-07 | 2006-09-06 | $7700.00 | Window Closed / Lapsed |