US5339216A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device and method for reducing thermal cycling in a semiconductor package
Assignee: National Semiconductor Corp
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Filing: 1993-03-02
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Granted: 1994-08-16
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Expires: 2013-03-02
Abstract
Abstract In semiconductor packing, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die, A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.
Inventors
- 👤 Peng-Cheng Lin
- 👤 Hem P. Takiar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:19
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/253; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W70/00; H10W70/40; H10W70/411; H10W76/00; H10W76/40; H10W72/00; H10W72/30; H10W72/381; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
111 words
In a semiconductor package containing at least one electrically-functional die having an active side to which a plurality of wires is attached, an arrangement comprising a die attachment pad on a top of which is said electrically-functional die, and a non-electrically functional, thermally conductive and substantially rigid die having a common boundary with the active side of the electrically-functional die in a thermally transferable and physically reinforcing position such that, said non-electrically functional die reduces thermal stresses on said electrically-functional die and re-enforces the strength of said electrically-functional die, wherein said wires of the electrically-functional die are disposed beyond the common boundary of said non-electrically functional die and said electrically-functional die.
Claim 2
Dependent Claim
111 words
In a semiconductor package containing at least one electrically-functional die having an active side to which a plurality of wires is attached, an arrangement comprising a die attachment pad on a top of which is said electrically-functional die, and a non-electrically functional, thermally conductive and substantially rigid die having a common boundary with the active side of the electrically-functional die in a thermally transferable and physically reinforcing position such that, said non-electrically functional die reduces thermal stresses on said electrically-functional die and re-enforces the strength of said electrically-functional die, wherein said wires of the electrically-functional die are disposed beyond the common boundary of said non-electrically functional die and said electrically-functional die.
Claim 3
Dependent Claim
17 words
An arrangement as recited in Claim 1 wherein said non- electrically functional die is a defective die.
Claim 4
Dependent Claim
29 words
An arrangement as recited in Claim 1 wherein said non-electrically functional die and said electrically-functional die are arranged in a manner which reduces moisture precipitation at the electrically-functional die.
Claim 5
Dependent Claim
23 words
An arrangement as recited in claim 1 wherein said arrangement comprises a plurality of non-electrically functional dies on top of said electrically-functional die,
Claim 6
Dependent Claim
26 words
An arrangement as recited in claim 1 further comprising a thermally conductive, non-electrically conductive bonding material disposed between said non-electrically function die and said electrically-functional die.
Claim 7
Dependent Claim
15 words
The arrangement recited in claim 5 wherein said bonding material is a non-electrically conductive epoxy.
Claim 8
Dependent Claim
120 words
In a semiconductor package containing at least one electrically-functional die having an electrically active side on which a plurality of wires is disposed, said electrically-functional die being disposed on top of a die attachment pad, a method of reducing thermal stress on said electrically-functional die and for reinforcing the strength of said electrically-functional die, said method comprising the step of locating a non-electrically functional thermally conductive and substantially rigid die so as to have a common boundary with the active side of said electrically-functional die in a thermally transferable and physically reinforcing position such that the wires on said active side of the electrically-functional die are disposed beyond the common boundary of said electrically-functional die and said non-electrically functional die.
Claim 9
Dependent Claim
120 words
In a semiconductor package containing at least one electrically-functional die having an electrically active side on which a plurality of wires is disposed, said electrically-functional die being disposed on top of a die attachment pad, a method of reducing thermal stress on said electrically-functional die and for reinforcing the strength of said electrically-functional die, said method comprising the step of locating a non-electrically functional thermally conductive and substantially rigid die so as to have a common boundary with the active side of said electrically-functional die in a thermally transferable and physically reinforcing position such that the wires on said active side of the electrically-functional die are disposed beyond the common boundary of said electrically-functional die and said non-electrically functional die.
Claim 10
Dependent Claim
29 words
A method as recited in claim 7 further comprising the step of: attaching said electrically-functional die to said non-electrically functional die with a thermally conductive, non-electrically conductive bonding material.
Claim 11
Dependent Claim
16 words
A method as recited in claim 1 wherein said non-electrically functional die is a defective die.
References Cited (Backward Citations)
US4081825A
Cited
JPH021942A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-15 | 1998-02-14 | 1998-08-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-15 | 2002-02-14 | 2002-08-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-15 | 2006-02-14 | 2006-08-16 | $7700.00 | Window Closed / Lapsed |