US5336391A
Expired / Lapsed
US
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Method for producing a circuit board material employing an improved electroplating bath
Assignee: Ohmega Electronics Inc
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Filing: 1992-09-21
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Granted: 1994-08-09
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Expires: 2012-09-21
Abstract
Abstract An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
Inventors
- 👤 James M. Rice
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:15
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/562; C23; C23F; C23F1/00; C23F1/02; H; H01; H01C; H01C17/00; H01C17/06; H01C17/075; H01C17/14; H01C17/16; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K3/00; H05K3/02; H05K3/06; H05K3/067; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/0392; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/12; H05K2203/122; H05K2203/124; Y; Y10; Y10S; Y10S205/00; Y10S205/92; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12778; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
89 words
In a method for preparing a circuit board material comprising a conductive layer having an electrical resistance material layer electroplated thereon, the improvement comprising electro-plating a nickel-phosphorus electrical resistance layer on said conductive layer using an electroplating bath consisting essentially of at least about 0.25 moles per liter nickel ions and at least about 0.05 moles per liter hypophosphite ions at a temperature within the range of from about 20° to 50° C., wherein said electrical resistance layer comprises about 10 to about 50 percent by weight of phosphorus.
Claim 2
Dependent Claim
89 words
In a method for preparing a circuit board material comprising a conductive layer having an electrical resistance material layer electroplated thereon, the improvement comprising electro-plating a nickel-phosphorus electrical resistance layer on said conductive layer using an electroplating bath consisting essentially of at least about 0.25 moles per liter nickel ions and at least about 0.05 moles per liter hypophosphite ions at a temperature within the range of from about 20° to 50° C., wherein said electrical resistance layer comprises about 10 to about 50 percent by weight of phosphorus.
Claim 3
Dependent Claim
20 words
The method of claim 1 wherein said nickel and hypophosphite ions are formed by reacting nickel carbonate and hypophosphorous acid.
Claim 4
Dependent Claim
20 words
The method of claim 1 wherein said nickel and hypophosphite ions are formed by reacting nickel chloride and sodium hypophosphite.
Claim 5
Dependent Claim
21 words
The method of claim 1 wherein said electrical resistance layer has an electrical resistance of at least 500 ohms per square.
Claim 6
Dependent Claim
12 words
The method of claim 1 wherein said conductive layer comprises copper metal.
Claim 7
Dependent Claim
21 words
The method of claim 1 wherein said electrical resistance layer comprises about 30 to about 50 percent by weight of phosphorus.
Claim 8
Dependent Claim
22 words
The method of claim 1 wherein said conductive layer is treated with an activating agent prior to electro-plating said electrical resistance layer.
Claim 9
Dependent Claim
23 words
The method of claim 7 wherein said activating agent is selected from the group consisting of benzotriazole, tolyltriazole, mercaptobenzothiazole, chromates and mixtures thereof.
Claim 10
Dependent Claim
11 words
The method of claim 8 wherein said activating agent is benzotriazole.
Claim 11
Independent Claim
126 words
A method of preparing a circuit board material comprising a conductive layer having a nickel-phosphorus electrical resistance layer electroplated thereon, the method comprising the following steps: forming an electro-plating bath consisting essentially of at least about 0.25 moles per liter nickel ions and at least about 0.50 moles per liter hypophosphite ions; immersing said conductive layer in said bath; electro-depositing said electrical resistance layer on said conductive layer by applying a voltage to said a bath at a temperature within the range of from about 20° to 50° C., wherein said electrical resistance layer comprises about 10 to about 50 percent by weight of phosphorus; and adhering said electrical resistance layer electro-deposited on said conductive layer to a support layer to form said circuit board material.
Claim 12
Independent Claim
126 words
A method of preparing a circuit board material comprising a conductive layer having a nickel-phosphorus electrical resistance layer electroplated thereon, the method comprising the following steps: forming an electro-plating bath consisting essentially of at least about 0.25 moles per liter nickel ions and at least about 0.50 moles per liter hypophosphite ions; immersing said conductive layer in said bath; electro-depositing said electrical resistance layer on said conductive layer by applying a voltage to said a bath at a temperature within the range of from about 20° to 50° C., wherein said electrical resistance layer comprises about 10 to about 50 percent by weight of phosphorus; and adhering said electrical resistance layer electro-deposited on said conductive layer to a support layer to form said circuit board material.
Claim 13
Dependent Claim
12 words
The method of claim 10 wherein said conductive layer comprises copper metal.
Claim 14
Dependent Claim
21 words
The method of claim 10 wherein said electrical resistance layer comprises about 30 to about 50 percent by weight of phosphorus.
Claim 15
Dependent Claim
20 words
The method of claim 10 wherein said conductive layer is treated with an activating agent prior to said immersion step.
Claim 16
Dependent Claim
23 words
The method of claim 13 wherein said activating agent is selected from the group consisting of benzotriazole, tolyltriazole, mercaptobenzothiazole, chromates and mixtures thereof.
Claim 17
Dependent Claim
11 words
The method of claim 14 wherein said activating agent is benzotriazole.
Claim 18
Dependent Claim
21 words
The method of claim 10 wherein said electrical resistance layer has an electrical resistance of at least 500 ohms per square.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-08-08 | 1998-02-07 | 1998-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-08 | 2002-02-07 | 2002-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-08 | 2006-02-07 | 2006-08-09 | $7700.00 | Window Closed / Lapsed |