Structures and processes for fabricating field emission cathode tips using secondary cusp

Claim 2

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons formed by the process comprising the steps of: (a) providing at least one hole in a substrate, (b) depositing at least a first material and filling at least a portion of said hole sufficiently to form a cusp, (c) depositing said at least one layer of a material which is capable of emitting electrons under the influence of an electrical field, and filling at least a portion of said cusp to form said at least one electron emitting layer, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and (d) removing at least a portion of said substrate and at least a portion of said first material to expose at least a portion of said tip of said electron-emitting material and thereby forming said at least one field emission cathode structure.

Claim 3

The field emission cathode structure of claim 1, wherein said electron-emitting layer is a multilayered structure.

Claim 4

The field emission cathode structure of claim 1, wherein at least one tip of said electron-emitting layer is a multilayered structure.

Claim 5

The field emission cathode structure of claim 1, wherein said electron-emitting layer further comprises a support layer.

Claim 6

The field emission cathode structure of claim 1, further comprising on the tip side of the electron-emitting layer at least one electrically conductive material which is separated from said electron-emitting layer by at least one insulative material such that at least one of said emitter tip is exposed.

Claim 7

The field emission cathode structure of claim 5, wherein said electron-emitting layer is a multilayered structure.

Claim 8

The field emission cathode structure of claim 5, wherein at least one tip of said electron-emitting layer is a multilayered structure.

Claim 9

The field emission cathode structure of claim 5, wherein said electron-emitting layer further comprises a support layer.

Claim 10

The field emission cathode structure of claim 1, further comprising on the tip side of the electron-emitting layer a plurality of layers of electrically conductive material, each of which is separated from each other and said electron-emitting layer by at least one insulative material such that at least one of said emitter tip is exposed.

Claim 11

The field emission cathode structure of claim 9, wherein said electron-emitting layer is a multilayered structure.

Claim 12

The field emission cathode structure of claim 9, wherein at least one tip of said electron-emitting layer is a multilayered structure.

Claim 13

The field emission cathode structure of claim 9, wherein said electron-emitting layer further comprises a support layer.

Claim 14

The field emission cathode structure of claim 1, further comprising on the tip side of the electron-emitting layer at least one barrier layer, which is selectively removed to expose said tip.

Claim 15

The field emission cathode structure of claim 13, wherein said electron-emitting layer is a multilayered structure.

Claim 16

The field emission cathode structure of claim 13, wherein at least one tip of said electron-emitting layer is a multilayered structure.

Claim 17

The field emission cathode structure of claim 13, wherein said electron-emitting layer further comprises a support layer.

Claim 18

The field emission cathode structure of claim 1, wherein said tip has a coating of an electron-emitting material.

Claim 19

The field emission cathode structure of claim 1, wherein said tip is sharpened.

Claim 20

The field emission cathode structure of claim 1, wherein said tip is used as an electron source.

Claim 21

The field emission cathode structure of claim 1, wherein at least one tip is electrically isolated from another tip.

Claim 22

The field emission cathode structure of claim 1, wherein at least one tip is electrically connected to another electronic component.

Claim 23

The field emission cathode structure of claim 1, wherein said tip is used in an electronic display device.

Claim 24

The field emission cathode structure of claim 1, wherein said tip has a point or a blade profile.

Claim 25

The field emission cathode structure of claim 1, wherein said electron-emitting material is selected from a group comprising mo, W, Ta, Re, Pt, Au, Ag, Al, Cu, Nb, Ni, Cr, Ti, Zr, Hf and alloys thereof or solid solutions containing two or more of these elements.

Claim 26

The field emission cathode structure of claim 1, wherein said electron-emitting material is selected from a group comprising doped and undoped semiconductors.

Claim 27

The field emission cathode structure of claim 1, wherein said at least first material is a multilayered material.

Claim 28

The field emission cathode structure of claim 26, wherein at least one layer of said multilayered material is of a barrier material.

Claim 29

The field emission cathode structure of claim 1, wherein said structure has at least two cathodes and wherein at least a portion of one cathode is electrically isolated from a portion of the second cathode.

Claim 30

The field emission cathode structure of claim 1, wherein said structure has at least two cathodes and wherein at least a portion of one cathode is electrically connected to a portion of the second cathode.

Claim 31

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons formed by the process comprising the steps of: (a) forming at least one layer of an electrically conductive material over a base layer, (b) forming at least one hole at least through said at least one electrically conductive layer, (c) depositing at least one insulative material over said at least one electrically conductive layer and filling at least a portion of said hole sufficiently to form a cusp, (d) depositing at least one layer of a material which is capable of emitting electrons under the influence of an electrical field, over said at least one insulative material of step (c), and filling at least a portion of said cusp to form said at least one electron emitting layer, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and (e) removing at least a portion of said material underneath said tip to expose at least a portion of said tip of said electron-emitting material and thereby forming said at least one field emission cathode structure.

Claim 32

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons formed by the process comprising the steps of: (a) forming at least one layer of an electrically conductive material over a base layer, (b) forming at least one hole at least through said at least one electrically conductive layer, (c) depositing at least one insulative material over said at least one electrically conductive layer and filling at least a portion of said hole sufficiently to form a cusp, (d) depositing at least one layer of a material which is capable of emitting electrons under the influence of an electrical field, over said at least one insulative material of step (c), and filling at least a portion of said cusp to form said at least one electron emitting layer, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and (e) removing at least a portion of said material underneath said tip to expose at least a portion of said tip of said electron-emitting material and thereby forming said at least one field emission cathode structure.

Claim 33

The field emission cathode structure of claim 30, wherein said electron-emitting material is selected from a group comprising Mo, W, Ta, Re, Pt, Au, Ag, Al, Cu, Nb, Ni, Cr, Ti, Zr, Hf and alloys thereof or solid solutions containing two or more of these elements.

Claim 34

The field emission cathode structure of claim 30, wherein said insulating material is selected from a group comprising sapphire, glass or oxides of Si, Al, Mg and Ce.

Claim 35

The field emission cathode structure of claim 30, wherein said electron-emitting material is selected from a group comprising doped and undoped semiconductors.

Claim 36

The field emission cathode structure of claim 30, wherein said at least one insulative material is a multilayered material.

Claim 37

The field emission cathode structure of claim 34, wherein at least one layer of said multilayerd material is of a barrier material.

Claim 38

The field emission cathode structure of claim 30, wherein said structure has at least two cathodes and wherein at least a portion of one cathode is electrically isolated from a portion of the second cathode.

Claim 39

The field emission cathode structure of claim 30, wherein said structure has at least two cathodes and wherein at least a portion of one cathode is electrically connected to a portion of the second cathode.

Claim 40

The field emission cathode structure of claim 30, wherein at least a portion of said at least one insulative material covering the wall surface of at least one of said electrically conductive material adjacent said exposed electron-emitting material is removed.

Claim 41

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons formed by the process comprising the steps of: (a) forming a plurality of layers of electrically conductive material over a base layer, such that each said layer of electrically conductive material is separated by an insulative material, (b) forming at least one hole at least through said electrically conductive layers, (c) depositing at least one insulative material over said layers of electrically conductive material and filling at least a portion of said hole sufficiently to form a cusp, (d) depositing at least one layer of a material which is capable of emitting electrons under the influence of an electrical field, over said insulative material of step (c), and filling at least a portion of said cusp to form said at least one electron emitting layer, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and (e) removing at least a portion of material underneath said tip to expose at least a portion of said tip of said electron-emitting material and thereby forming said at least one field emission cathode structure.

Claim 42

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons formed by the process comprising the steps of: (a) forming a plurality of layers of electrically conductive material over a base layer, such that each said layer of electrically conductive material is separated by an insulative material, (b) forming at least one hole at least through said electrically conductive layers, (c) depositing at least one insulative material over said layers of electrically conductive material and filling at least a portion of said hole sufficiently to form a cusp, (d) depositing at least one layer of a material which is capable of emitting electrons under the influence of an electrical field, over said insulative material of step (c), and filling at least a portion of said cusp to form said at least one electron emitting layer, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and (e) removing at least a portion of material underneath said tip to expose at least a portion of said tip of said electron-emitting material and thereby forming said at least one field emission cathode structure.

Claim 43

The field emission cathode structure of claim 39, wherein said electron-emitting material is selected from a group comprising mo, W, Ta, Re, Pt, Au, Ag, Al, Cu, Nb, Ni, Cr, Ti, Zr, Hf and alloys thereof or solid solutions containing two or more of these elements.

Claim 44

The field emission cathode structure of claim 39, wherein said insulating material is selected from a group comprising sapphire, glass or oxides of Si, Al, Mg and Ce.

Claim 45

The field emission cathode structure of claim 39, wherein said electron-emitting material is selected from a group comprising doped and undoped semiconductors.

Claim 46

The field emission cathode structure of claim 39, wherein said at least one insulative material is a multilayered material.

Claim 47

The field emission cathode structure of claim 43, wherein at least one layer of said multilayered material is of a barrier material.

Claim 48

The field emission cathode structure of claim 39, wherein said structure has at least two cathodes and wherein at least a portion of one cathode is electrically isolated from a portion of the second cathode.

Claim 49

The field emission cathode structure of claim 39, wherein said structure has at least two cathodes and wherein at least a portion of one cathode is electrically connected to a portion of the second cathode.

Claim 50

The field emission cathode structure of claim 39, wherein at least a portion of said at least one insulative material covering the wall surface of at least one of said electrically conductive material adjacent said exposed electron-emitting material is removed.

Claim 51

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and thereby forming said at least one field emission cathode structure.

Claim 52

A field emission cathode structure comprising at least one layer of material which is capable of emitting electrons under the influence of an electric field, and having at least one tip for the emission of electrons, wherein said electron emitting layer has an upper surface and a lower surface, said upper surface having at least one secondary cusp, said lower surface having at least one tip, such that at least one tip is opposite said at least one secondary cusp, and wherein at least a portion of the surface of said tip is concave and wherein said at least one tip is used for the emission of said electrons, and thereby forming said at least one field emission cathode structure.

Claim 53

The field emission cathode structure of claim 48, wherein said electron-emitting material is selected from a group comprising Mo, W, Ta, Re, Pt, Au, Ag, Al, Cu, Nb, Ni, Cr, Ti, Zr, Hf and alloys thereof or solid solutions containing two or more of these elements.

Claim 54

The field emission cathode structure of claim 48, wherein said electron-emitting material is selected from a group comprising doped and undoped semiconductors.

Claim 55

The field cathode structure of claim 48, wherein said tip has a point or a blade profile.