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US5334430A Expired / Lapsed US ⏱️ 0.0 years remaining

Pressure-sensitive adhesive for temporarily securing electronic devices

Assignee: Nihon Junyaku Co Ltd
•
Filing: 1991-11-08
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Granted: 1994-08-02
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Expires: 2011-11-08
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Abstract

Abstract A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 104 to 109 dyne/cm2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 104 to 107 dyne/cm2 and a value for tan delta of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.

Inventors

  • 👤 Mitsuo Ishikawa
  • 👤 Shigeaki Watarai

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 11:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; C; C09; C09J; C09J133/00; C09J133/04; C09J133/06; C09J143/00; C09J143/04; C09J183/00; C09J183/04; C09J183/10; C08; C08L; C08L2666/00; C08L2666/02; C08L2666/04; C08L33/00; C08L33/04; C08L33/06; C08L43/00; C08L43/04; C09J2301/00; C09J2301/30; C09J2301/302; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/0137; H05K2201/0162; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/04; H05K2203/048; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T428/00; Y10T428/14; Y10T428/1462; Y10T428/28; Y10T428/2852; Y10T428/2878; Y10T428/2891; Y10T428/2896

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 117 words
A pressure-sensitive adhesive tape or sheet for temporarily securing electronic devices on a printed-circuit board before and during soldering, comprising a support having a releasing surface and a pressure-sensitive adhesive disposed on the releasing surface of the support, said pressure sensitive adhesive consisting essentially of a resinous material having a dynamic modulous of elasticity in the range of from 10 4 to 10 9 dyne/cm 2 as measured at a soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz, and said adhesive being a blend of 30-60 weight % of an acrylate copolymer resin 0-10 weight % of an urethane-acrylate copolymer resin, and 40-60 weight % of a silicone-acrylate copolymer resin.
Claim 2
Dependent Claim 117 words
A pressure-sensitive adhesive tape or sheet for temporarily securing electronic devices on a printed-circuit board before and during soldering, comprising a support having a releasing surface and a pressure-sensitive adhesive disposed on the releasing surface of the support, said pressure sensitive adhesive consisting essentially of a resinous material having a dynamic modulous of elasticity in the range of from 10 4 to 10 9 dyne/cm 2 as measured at a soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz, and said adhesive being a blend of 30-60 weight % of an acrylate copolymer resin 0-10 weight % of an urethane-acrylate copolymer resin, and 40-60 weight % of a silicone-acrylate copolymer resin.
Claim 3
Dependent Claim 21 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1, wherein the support is in the form of a tape.
Claim 4
Dependent Claim 21 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1, wherein the support is in the form of a sheet.
Claim 5
Dependent Claim 21 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1 wherein the pressure-sensitive adhesive is disposed continuously on the support.
Claim 6
Dependent Claim 21 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1, wherein the pressure-sensitive adhesive is disposed discretely on the support.
Claim 7
Dependent Claim 28 words
A pressure-sensitive adhesive tape or sheet as defined in claim 5, wherein the pressure-sensitive adhesive is disposed in the form of patches at regular intervals between adjacent patches.
Claim 8
Dependent Claim 42 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1, wherein the pressure-sensitive adhesive is disposed on the support in a pattern of patches which corresponds to a pattern of the electronic devices which are mounted on a printed circuit board.
Claim 9
Dependent Claim 34 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1, wherein the resinous material comprises at least one resin component which imparts adhesion and at least one resin component which imparts heat resistance.
Claim 10
Dependent Claim 20 words
A pressure-sensitive adhesive tape or sheet as defined in claim 8, wherein the resinous material further comprises a crosslinking agent.
Claim 11
Dependent Claim 73 words
A pressure-sensitive adhesive tape or sheet as defined in claim 1, wherein the pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10 4 to 10 7 dyne/cm 2 and a value for tan δ of greater than 0.2 as measured at a soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz and exhibits a self-aligning effect.

References Cited (Backward Citations)

US2857356A Cited
US3032438A Cited
US3202535A Cited
US3617362A Cited
US3527842A Cited
US4004061A Cited
US4039707A Cited
US4016328A Cited
US4642321A Cited
US4695508A Cited
US4693920A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-08-01 1998-01-31 1998-08-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-08-01 2002-01-31 2002-08-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-08-01 2006-01-31 2006-08-02 $7700.00 Window Closed / Lapsed

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