US5328806A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Positive image formation utilizing radiation sensitive mixture containing dimeric or trimeric sesamol/aldehyde condensation products as sensitivity enhancers
Assignee: Olin Microelectronic Chemicals Inc
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Filing: 1993-10-12
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Granted: 1994-07-12
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Expires: 2013-10-12
Abstract
Abstract A radiation-sensitive composition comprising an admixture in a solvent of: at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one dimeric or trimeric unit formed by the condensation reaction of an aldehyde with sesamol; the amount of said binder resin being about 60 to 95% by weight, the amount 40% of said photoactive component being about 5% to about by weight, based on the total solids content of said radiation-sensitive composition.
Inventors
- 👤 Medhat A. Toukhy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 18:40
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/022; G03F7/0226
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
145 words
The process of developing an image-wise exposed photoresist-coated substrate comprising: (a) coating said substrate with a radiation-sensitive composition useful as a photoresist, said composition comprising an admixture in a solvent of: at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one dimeric or trimeric unit formed by the condensation reaction of an aldehyde with sesamol; the amount of said binder resin being about 60 to 95% by weight, the amount of said photoactive component being about 5% to about 40% by weight, based on the total solids content of said radiation-sensitive composition; (b) subjecting said coating on said substrate to an image-wise exposure of radiant light energy; and (c) subjecting said image-wise exposed coated substrate to a developing solution to remove the image-wise exposed areas and form a positive image-wise pattern in the coating.
Claim 2
Dependent Claim
145 words
The process of developing an image-wise exposed photoresist-coated substrate comprising: (a) coating said substrate with a radiation-sensitive composition useful as a photoresist, said composition comprising an admixture in a solvent of: at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one dimeric or trimeric unit formed by the condensation reaction of an aldehyde with sesamol; the amount of said binder resin being about 60 to 95% by weight, the amount of said photoactive component being about 5% to about 40% by weight, based on the total solids content of said radiation-sensitive composition; (b) subjecting said coating on said substrate to an image-wise exposure of radiant light energy; and (c) subjecting said image-wise exposed coated substrate to a developing solution to remove the image-wise exposed areas and form a positive image-wise pattern in the coating.
Claim 3
Dependent Claim
15 words
The process of claim 1 wherein said binder resin is an alkali-soluble phenolic novolak resin.
Claim 4
Dependent Claim
16 words
The process of claim 1 wherein said at least one photoactive compound is an o-quinonediazide compound.
Claim 5
Dependent Claim
34 words
The process of claim 1 wherein said dimeric or trimeric units are present in the amount from about 2% to about 15% by weight, based on the total solids content of said radiation-sensitive composition.
Claim 6
Dependent Claim
24 words
The process of claim 1 wherein said radiant light energy is selected from the group consisting of ultraviolet light radiation and electron beam radiation.
Claim 7
Dependent Claim
37 words
The process of claim 1 wherein said developing solution is an aqueous solution of an alkali selected from the group consisting of tetramethylammonium hydroxide, sodium hydroxide, potassium hydroxide, ethanolamine, chlorine, sodium phosphates, sodium carbonate, and sodium metasilicates.
References Cited (Backward Citations)
US4738915A
Cited
US4650745A
Cited
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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