US5324410A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for one-sided etching of a semiconductor wafer
Assignee: Robert Bosch GmbH
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Filing: 1991-07-02
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Granted: 1994-06-28
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Expires: 2011-07-02
Abstract
Abstract A device for one-sided etching of a semiconductor wafer (silicon wafer) is proposed, which consists in the manner of an etching box of a trough-shaped basic body (3, 23) and a lid (2, 22) which matches the latter hermetically. The lid (2, 22) has on the topside an opening (5, 25) for the passage of the etching liquid. The etching box bears at least two O-rings (7, 8, 27, 28), of which one is arranged centrally in the basic body (3, 23) and the other centrally in the lid (2, 22). The wafer (1) is clamped between the O-rings (7, 8, 27, 28). A wire (10) connected to the wafer by means of a plate of a spring contact (11, 41) is guided out of the etching box through a bore (4) extending through the basic body (3, 23).
Inventors
- 👤 Nils Kummer
- 👤 Jiri Marek
- 👤 Martin Willmann
- 👤 Guenther Findler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 17:56
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0441; H10P72/0402; H10P72/0418; H10P72/0422; H10P72/0426; H10P72/70; H10P72/76; H10P72/7604; H10P72/7606; H10P72/7611
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
129 words
An etching box type device for one-sided etching of a semiconductor wafer, said device comprising a trough-shaped basic body; a lid hermetically sealing said basic body, said lid having an opening to allow etching fluid to pass therethrough; at least two superposed O-rings between which the wafer to be etched may be clamped, one of said O-rings being concentric with said basic body and the other of said O-rings being concentric with said lid, said basic body having a bore which connects the surface of said basic body that lies within said one O-ring with the exterior of said basic body; and a wire, connected to an electrical spring contact for contacting a wafer clamped between said O-rings, passing through said bore to the exterior of the etching box.
Claim 2
Dependent Claim
129 words
An etching box type device for one-sided etching of a semiconductor wafer, said device comprising a trough-shaped basic body; a lid hermetically sealing said basic body, said lid having an opening to allow etching fluid to pass therethrough; at least two superposed O-rings between which the wafer to be etched may be clamped, one of said O-rings being concentric with said basic body and the other of said O-rings being concentric with said lid, said basic body having a bore which connects the surface of said basic body that lies within said one O-ring with the exterior of said basic body; and a wire, connected to an electrical spring contact for contacting a wafer clamped between said O-rings, passing through said bore to the exterior of the etching box.
Claim 3
Dependent Claim
20 words
Device according to claim 1, characterised in that at least two O-rings (7, 8, 27, 28) have the same diameter.
Claim 4
Dependent Claim
36 words
Device according to claim 1, characterised in that adjoining the outlet of the bore (4) is a small tube (6), a hose or the like which continues the bore and leads out of the etching solution.
Claim 5
Dependent Claim
25 words
Device according to claim 3, characterised in that the small tube (6) or the hose are produced from polypropylene (PP) or polyvinylidene fluoride (PVDF) plastic.
Claim 6
Dependent Claim
20 words
Device according to claim 1, characterised in that the lid (2) and basic body (3) are produced from PVDF plastic.
Claim 7
Dependent Claim
55 words
Device according to claim 1, characterised in that the inner region (12) of the underside of the lid is constructed elevated in the shape of a step and the inner region (13) of the topside of the basic body is constructed depressed in the shape of a step, and the steps have the same diameter.
Claim 8
Dependent Claim
32 words
Device according to claim 1, characterised in that the lid (2) and basic body (3) have grooves (17) and (18), respectively, in which the O-rings (7) and (8), respectively, are arranged protruding.
Claim 9
Dependent Claim
36 words
Device according to claim 1, characterised in that the basic body (3) has on the edge elevated with respect to the inner region (13) a further groove (19) in which a further O-ring (9) is arranged.
Claim 10
Dependent Claim
34 words
Device according to claim 1, characterised in that the lid (2) has in the edge depressed with respect to the inner region (12) a further groove in which a further O-ring (7) is arranged.
Claim 11
Dependent Claim
55 words
Device according to claim 1, characterised in that when the etching box is closed the edge regions of the lid (2) and of the basic body (3) lie flush against one another, with the exertion of a defined contact pressure on the 0-rings (7, 8, 9) situated between the lid (2) and basic body (3).
Claim 12
Dependent Claim
23 words
Device according to claim 1, characterised in that the spring contact (11) is constructed as a spring-loaded pin projecting from the bore (4).
Claim 13
Dependent Claim
50 words
Device according to claim 1, characterised in that the grooves (17) to (19) are configured such that they can absorb the volume of the O-rings (7) to (9) which is changed due to swelling and/or pressing, and the compressive forces transmitted via the O-rings (7) to (9) remain approximately constant.
Claim 14
Dependent Claim
23 words
Device according to claim 1, characterised in that the lid (22) and basic body (33) of the etching box are produced from PP.
Claim 15
Dependent Claim
18 words
Device according to claim 1, characterised in that the O-ring (8) lies loosely in the basic body (3).
Claim 16
Dependent Claim
24 words
Device according to claim 1, characterised in that the O-ring (27) on the lid side lies loosely between the lid (2) and wafer topside.
Claim 17
Dependent Claim
24 words
Device according to claim 1, characterised in that a spring cross (41) which supports the wafer (1) is arranged in the basic body (23).
Claim 18
Dependent Claim
33 words
Device according to claim 15, characterised in that at least one of the tongues (42) of the spring cross (41) consists of electrically conductive material or is sheathed in an electrically conductive material.
Claim 19
Dependent Claim
30 words
Device according to claim 16, characterised in that the wire (10) for the electrical contacting of the wafer (1) is connected to the tongue (42) of the spring cross (41).
Claim 20
Dependent Claim
29 words
Device according to claim 16, characterised in that the wire (10) and/or the conductive sheath (43) of the tongue (42) of the spring cross (41) are made from platinum.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |