Semiconductor chip mounting method and apparatus

Claim 2

A semiconductor chip mounting method of mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: the first step of measuring a three-dimensional shape of a surface of the board; the second step of adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of the first step; and the third step of moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 3

A method according to claim 1, further 15 comprising, between the second and third steps, the step of measuring a relative angle between the semiconductor chip and an area on the board on which the semiconductor chip is to be mounted at a predetermined measurement point within the area, and the step of adjusting the parallel degree between the board and the semiconductor chip on the basis of the measured relative angle.

Claim 4

A method according to claim 1, further comprising, between the second and third steps, the step of measuring an angle between a normal to a predetermined measurement point within an area on the board on which the semiconductor chip is to be mounted and a mounting surface of the semiconductor-chip intersecting the normal, and the step of adjusting a perpendicular degree between the semiconductor chip and the normal on the basis of the measured angle.

Claim 5

A method according to claim 1, further comprising, between the second and third steps, the step of measuring an angle between a normal to a predetermined measurement point on a mounting surface of the semiconductor chip and the surface of the board intersecting the normal, and the step of adjusting a perpendicular degree between the board and the normal on the basis of the measured angle.

Claim 6

A method according to claim 1, further comprising, between the second and third steps, the step of measuring distances between the semiconductor chip and the board at least at three measurement points within an area of the board on which the semiconductor chip is to be mounted, and the step of adjusting the parallel degree between the board and the semiconductor chip on the basis of the measured distance.

Claim 7

A method according to claim 1, further comprising, between the second and third steps, the step of measuring distances between the semiconductor chip and the board at predetermined three measurement points close to predetermined three of four corners of a rectangular area on the board on which the semiconductor chip is to be mounted, the three measurement points being within the rectangular area, and the step of adjusting the parallel degree between the board and the semiconductor chip on the basis of the measured distance.

Claim 10

A semiconductor chip mounting method of mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: the first step of measuring relative angles between the board and the semiconductor chip at a plurality of measurement points; the second step of adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of the first step; and the third step of moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 11

A semiconductor chip mounting method of mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: the first step of measuring relative angles between the board and the semiconductor chip at a plurality of measurement points; the second step of adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of the first step; and the third step of moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 12

A method according to claim 9, wherein the second step comprises adjusting the parallel degree between the board and the semiconductor chip on the basis of an average of the relative angles measured in the first step.

Claim 13

A method according to claim 9, wherein the second step comprises adjusting the parallel degree between the board and the semiconductor chip when a value larger than a predetermined allowance is present among measurement values of the relative angles measured in the first step.

Claim 14

A method according to claim 9, further comprising, between the second and third step, the step of repeating measurement of the first step and adjustment of the second step until all measurement values of the relative angles become not more than a predetermined allowance, and stopping mounting when all the measurement values of the relative angles do not become not more than the predetermined allowance after adjustment is performed a predetermined number of times, and wherein the second step comprises adjusting a parallel degree between the board and the semiconductor chip when a value larger than the predetermined allowance is present among the measurement values of the relative angles measured in the first step, and the third step comprises moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board when all the measurement values of the relative angles become not more than the predetermined allowance.

Claim 15

A method according to claim 9, wherein the second step comprises adjusting a parallel degree between the board and the semiconductor chip when a predetermined proportion of measurement values, among all measurement values of the relative angles, is larger than the predetermined allowance.

Claim 16

A method according to claim 9, further comprising, between the second and third step, the step of repeating measurement of the first step and adjustment of the second step until all measurement values of the relative angles become not more than a predetermined allowance, and stopping mounting when all the measurement values of the relative angles do not become not more than the predetermined allowance after adjustment is performed a predetermined number of times, and wherein the second step comprises adjusting a parallel degree between the board and the semiconductor chip when a predetermined proportion of measurement values, among all measurement values of the relative angles, is larger than the predetermined allowance, and the third step comprises moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board when all the measurement values of the relative angles become not more than the predetermined allowance.

Claim 17

A semiconductor chip mounting apparatus for mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: measuring means for measuring a three-dimensional shape of a surface of the board; adjusting means for adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of said measuring means; and mounting means for moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 18

A semiconductor chip mounting apparatus for mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: measuring means for measuring a three-dimensional shape of a surface of the board; adjusting means for adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of said measuring means; and mounting means for moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 19

An apparatus according to claim 15, wherein said measuring means measures the three-dimensional shape of the surface of the board, and a relative angle between the semiconductor chip and an area on the board on which the semiconductor chip is to be mounted at a predetermined measurement point within the area.

Claim 20

An apparatus according to claim 15, wherein said measuring means measures the three-dimensional shape of the surface of the board, and an angle between a normal to a predetermined measurement point within an area on the board on which the semiconductor chip is to be mounted and a mounting surface of the semiconductor chip intersecting the normal, and said adjusting means adjusts a parallel degree between the board and the semiconductor chip on the basis of three-dimensional shape data measured by said measuring means, and adjusts a perpendicular degree between the board and the normal on the basis of angle data measured by said measuring means.

Claim 21

An apparatus according to claim 15, wherein said measuring means measures the three-dimensional shape of the surface of the board, and an angle between a normal to a predetermined measurement point on a mounting surface of the semiconductor chip and the surface of the board intersecting the normal, and said adjusting means adjusts a parallel degree between the board and the semiconductor chip on the basis of three-dimensional shape data measured by said measuring means, and adjusts a perpendicular degree between the board and the normal from angle data measured by said measuring means.

Claim 22

An apparatus according to claim 15, wherein said measuring means measures the three-dimensional shape of the surface of the board, and distances between the semiconductor chip and the board at least at three measurement points within an area of the board on which the semiconductor chip is to be mounted.

Claim 23

An apparatus according to claim 15, wherein said measuring means measures the three-dimensional shape of the surface of the board, and distances between the semiconductor chip and the board at predetermined three measurement points close to predetermined three of four corners of a rectangular area on the board on which the semiconductor chip is to be mounted, the three measurement points being within the rectangular area.

Claim 26

A semiconductor chip mounting apparatus for mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: measuring means for measuring relative angles between the board and the semiconductor chip at a plurality of measurement points; adjusting means for adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of said measuring means; and mounting means for moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 27

A semiconductor chip mounting apparatus for mounting, on a board fixed to board mounting means, a semiconductor chip held above the board by semiconductor chip holding means, comprising: measuring means for measuring relative angles between the board and the semiconductor chip at a plurality of measurement points; adjusting means for adjusting a parallel degree between the board and the semiconductor chip on the basis of a measurement result of said measuring means; and mounting means for moving said board mounting means and said semiconductor chip holding means close to each other and mounting the semiconductor chip on the board.

Claim 28

An apparatus according to claim 23, wherein said adjusting means adjusts the parallel degree between the board and the semiconductor chip on the basis of an average of the relative angles measured by said measuring means.

Claim 29

An apparatus according to claim 23, wherein said adjusting means adjusts the parallel degree between the board and the semiconductor chip when a value larger than a predetermined allowance is present among measurement values of the relative angles measured by said measuring means.

Claim 30

An apparatus according to claim 23, further comprising control means for repeating operations of said measuring and adjusting means until all measurement values of the relative angles become not more than a predetermined allowance, and stopping mounting when all the measurement values of the relative angles do not become not more than the predetermined allowance after adjustment is performed a predetermined number of times, and wherein said adjusting means adjusts a parallel degree between the board and the semiconductor chip when a value larger than the predetermined allowance is present among the measurement values of the relative angles measured said measuring means, and said mounting means moves said board mounting means and said semiconductor chip holding means close to each other and mounts the semiconductor chip on the board when all the measurement values of the relative angles become not more than the predetermined allowance.

Claim 31

An apparatus according to claim 23, wherein said adjusting means adjusts a parallel degree between the board and the semiconductor chip when a predetermined proportion of measurement values, among all measurement values of the relative angles, is larger than the predetermined allowance.

Claim 32

An apparatus according to claim 23, further comprising control means for repeating operations of said measuring and adjusting means until all measurement values of the relative angles become not more than a predetermined allowance, and stopping mounting when all the measurement values of the relative angles do not become not more than the predetermined allowance after adjustment is performed a predetermined number of times, and wherein said adjusting means adjusts a parallel degree between the board and the semiconductor chip when a predetermined proportion of measurement values, among all measurement values of the relative angles, is larger than the predetermined allowance, and said mounting means moves said board mounting means and said semiconductor chip holding means close to each other and mounts the semiconductor chip on the board when all the measurement values of the relative angles become not more than the predetermined allowance.