US5320708A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dry etching method
Assignee: Sony Corp
•
Filing: 1992-01-24
•
Granted: 1994-06-14
•
Expires: 2012-01-24
Abstract
Abstract A dry etching method by which the surface of a variety of materials constituting a semiconductor device may be planarized or smoothed under clean state. Small-sized recesses existing on the surface of a layer of the material to be etched are filled with deposited free sulfur yielded from sulfur halides, such as S 2 F 2 or S 2 Cl 2 , into the plasma under conditions of dissociation produced by electrical discharge. After the surface of the material to be etched is planarized in this manner, etching is carried out under conditions of simultaneously removing the small-sized projections and deposited sulfur to successfully eliminate step differences or roughness on the material surface. Etching may alternatively be carried out under the condition of competition of filling of recesses with sulfur and removal of the projections. Sulfur may easily be removed on sublimation by heating the wafer after completion of etching without producing pollution by particles. The present invention may be applied to trimming of cross-sectional shape of the trenches or connection holes, surface smoothing of the WSi x layer formed by high temperature CVD or planarization of an interlayer insulating film used for covering the step differences.
Inventors
- 👤 Shingo Kadomura
- 👤 Masakazu Muroyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 22:03
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/20; H10P70/23; H10P70/234; H10P50/00; H10P50/20; H10P50/24; H10P50/242; H10P50/28; H10P50/282; H10P50/283; H10P95/00; H10P95/06; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/081; H10W20/092
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
99 words
A dry etching method comprising the steps of providing a substrate having a layer of silicon-based material having a surface with surface projections and surface recesses; plasma etching said layer with an etching gas containing at least one compound selected from a group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 and SCl 2 ; and controlling the etching conditions to simultaneously deposit sulfur in surface recesses by regulating the etch temperatures while etching away surface projections of said layer.
Claim 2
Dependent Claim
99 words
A dry etching method comprising the steps of providing a substrate having a layer of silicon-based material having a surface with surface projections and surface recesses; plasma etching said layer with an etching gas containing at least one compound selected from a group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 and SCl 2 ; and controlling the etching conditions to simultaneously deposit sulfur in surface recesses by regulating the etch temperatures while etching away surface projections of said layer.
Claim 3
Dependent Claim
32 words
A dry etching method according to claim 1, wherein the step of controlling etching conditions controls the temperature of the substrate to be etched to have a temperature lower than ambient temperature.
Claim 4
Dependent Claim
36 words
A dry etching method according to claim 2, wherein the layer of silicon-based material is one selected from the group consisting of a single crystal silicon layer, a polysilicon layer and a refractive metal silicide layer.
Claim 5
Dependent Claim
21 words
A dry etching method according to claim 2, wherein the step of controlling the temperature uses a temperature of -70° C.
Claim 6
Dependent Claim
42 words
A dry etching method according to claim 1, wherein the layer of silicon-based material on the substrate is selected from the group consisting of a layer consisting of a single crystal silicon layer, a polysilicon layer, and a refractive metal silicide layer.
Claim 7
Dependent Claim
50 words
A dry etching method according to claim 1, wherein said step of controlling includes maintaining the temperature of the substrate below ambient temperature to cause a deposition of sulfur, and at the completion of the etching process, raising the temperature of the substrate to cause a removal of the sulfur.
Claim 8
Dependent Claim
29 words
A dry etching method according to claim 1, wherein the step of providing a substrate provides a substrate having a trench with sub-trenches at the base of the trench.
Claim 9
Dependent Claim
145 words
A dry etching method for forming a trench in a layer of silicon-based material, said method comprising the steps of providing a substrate having a layer of silicon-based material; plasma etching the layer to form a trench with an etching gas which produces sub-trenches adjacent the base of the trench; then plasma etching the layer with an etching gas containing at least one compound selected from a group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 and SCl 2 ; controlling the temperature of the substrate during the second plasma etching process to be below ambient temperature so that sulfur is deposited in the sub-trenches as the projections between the sub-trenches are being etched away and, subsequently, after completing the etching, removing any sulfur deposits therefrom.
Claim 10
Dependent Claim
145 words
A dry etching method for forming a trench in a layer of silicon-based material, said method comprising the steps of providing a substrate having a layer of silicon-based material; plasma etching the layer to form a trench with an etching gas which produces sub-trenches adjacent the base of the trench; then plasma etching the layer with an etching gas containing at least one compound selected from a group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 and SCl 2 ; controlling the temperature of the substrate during the second plasma etching process to be below ambient temperature so that sulfur is deposited in the sub-trenches as the projections between the sub-trenches are being etched away and, subsequently, after completing the etching, removing any sulfur deposits therefrom.
References Cited (Backward Citations)
JPS62293619A
Cited
JPS6350021A
Cited
JPS6432627A
Cited
JPH01292841A
Cited
US4985114A
Cited
US4992137A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-13 | 1997-12-13 | 1998-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-13 | 2001-12-13 | 2002-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-13 | 2005-12-13 | 2006-06-14 | $7700.00 | Window Closed / Lapsed |