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US5319243A Expired / Lapsed US ⏱️ 0.0 years remaining

Electronic assembly with first and second substrates

Assignee: Aumovio Microelectronic GmbH
•
Filing: 1992-02-26
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Granted: 1994-06-07
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Expires: 2012-02-26
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Abstract

Abstract In an electronic assembly whose components or circuit components are combined into at least two sub-assemblies or function units, one or more of the sub-assemblies or function units are disposed on a first substrate comprising a first substrate material. The first substrate is in its turn disposed with one or more further sub-assemblies or function units on a second substrate comprising a second substrate material.

Inventors

  • 👤 Gunter Leicht
  • 👤 Bernhard Schuch

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 23:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/65; H10W90/00; H10W90/401; H10W90/701; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 93 words
An electronic circuit assembly comprising a plurality of subassemblies each including a plurality of interconnected circuit components; at least one of said subassemblies comprising a silicon substrate provided with a single layer connecting circuit path structure, and a plurality of unhoused silicon integrated circuits mounted on said silicon substrate and interconnected via said single layer connecting circuit path structure; a second substrate of a material different than silicon; said silicon substrate and at least one further of said subassemblies are mounted on said second substrate and electrically interconnected to form said circuit assembly.
Claim 2
Dependent Claim 93 words
An electronic circuit assembly comprising a plurality of subassemblies each including a plurality of interconnected circuit components; at least one of said subassemblies comprising a silicon substrate provided with a single layer connecting circuit path structure, and a plurality of unhoused silicon integrated circuits mounted on said silicon substrate and interconnected via said single layer connecting circuit path structure; a second substrate of a material different than silicon; said silicon substrate and at least one further of said subassemblies are mounted on said second substrate and electrically interconnected to form said circuit assembly.
Claim 3
Dependent Claim 18 words
An electronic circuit assembly according to claim 1, wherein said second substrate is a ceramic hybrid circuit substrate.
Claim 4
Dependent Claim 17 words
An electronic circuit assembly according to claim 1, wherein said second substrate is a printed circuit board.
Claim 5
Dependent Claim 15 words
An electronic circuit assembly according to claim 3, wherein said printed circuit board is rigid.
Claim 6
Dependent Claim 15 words
An electronic circuit assembly according to claim 1, wherein said second substrate is a leadframe.
Claim 7
Dependent Claim 34 words
An electronic circuit assembly according to claim 1, wherein at least one of passive and active circuit components additionally are provided on said silicon substrate and connected to said single-layer connecting circuit path structure.
Claim 8
Dependent Claim 18 words
An electronic circuit assembly according to claim 1, wherein said silicon substrate is glued onto said second substrate.
Claim 9
Dependent Claim 20 words
An electronic circuit assembly according to claim 1, wherein said silicon substrate is connected to said second substrate by soldering.
Claim 10
Dependent Claim 20 words
An electronic circuit assembly according to claim 1, wherein said silicon substrate is connected to said second substrate by bonding.
Claim 11
Dependent Claim 15 words
An electronic circuit assembly according to claim 3, wherein said printed circuit board is flexible.

References Cited (Backward Citations)

DE2460635A1 Cited
DE2554965A1 Cited
DE3320275A1 Cited
US4783695A Cited
US4907068A Cited
DE3735455A1 Cited
US5052005A Cited
DE3942392A1 Cited
DE3905657A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-06-06 1997-12-06 1998-06-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-06-06 2001-12-06 2002-06-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-06-06 2005-12-06 2006-06-07 $7700.00 Window Closed / Lapsed

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