US5314105A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire bonding ultrasonic control system responsive to wire deformation
Assignee: F&K Delvotec Bondtechnik GmbH
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Filing: 1992-10-27
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Granted: 1994-05-24
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Expires: 2012-10-27
Abstract
Abstract A wire-bonding process for bonding a wire 8 to a contact surface of an electrical or electronic component 10, comprises supplying ultrasonic energy to a bonding tool 2 mounted on an ultrasonic transducer 6, the bonding tool 2 being arranged to press the wire 8 against the contact surface of the electrical or electronic component 10, and monitoring the deformation of the wire 8. The level and duration of the supply of ultrasonic energy and optionally the magnitude of the bonding force are continuously controlled during the bonding process in response to the deformation of the wire, in a closed loop system.
Inventors
- 👤 Farhad Farassat
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 02:52
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; B; B23; B23K; B23K20/00; B23K20/10; B23K31/00; B23K31/12; B23K31/125; H10W72/01; H10W72/015; H10W72/07141; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
146 words
A wire bonding apparatus for bonding a wire to a workpiece surface wherein the wire and/or the surface may have surface contamination which would interfere with the establishment of a good bond comprising an ultrasonic transducer including a horn, a bonding wedge secured to said horn for supporting a wire against the surface, whereby operation of said transducer will result in rapid displacement between the wire and the surface, means for sensing the deformation of the wire, means for determining when there is a sharp increase in the deformation of the wire, means for operating said transducer at a high energy level until said determining means determines that there is a sharp increase in the deformation of the wire and for operating said transducer at a low energy level when said determining means determines that there is a sharp increase in the deformation of the wire.
Claim 2
Dependent Claim
146 words
A wire bonding apparatus for bonding a wire to a workpiece surface wherein the wire and/or the surface may have surface contamination which would interfere with the establishment of a good bond comprising an ultrasonic transducer including a horn, a bonding wedge secured to said horn for supporting a wire against the surface, whereby operation of said transducer will result in rapid displacement between the wire and the surface, means for sensing the deformation of the wire, means for determining when there is a sharp increase in the deformation of the wire, means for operating said transducer at a high energy level until said determining means determines that there is a sharp increase in the deformation of the wire and for operating said transducer at a low energy level when said determining means determines that there is a sharp increase in the deformation of the wire.
Claim 3
Dependent Claim
47 words
A wire bonding apparatus according to claim 1, wherein said determining means further comprises means for determining when wire deformation has reached a predetermined value, and further comprising means for turning said transducer off when said determining means determines that wire deformation has reached said predetermined value.
Claim 4
Dependent Claim
62 words
A wire bonding apparatus according to claim 1, wherein said determining means further comprises means for determining when wire deformation has reached a predetermined value, and said operating means further comprises means for operating said transducer at a level for tempering the bond between the wire and the surface when said determining means determines that wire deformation has reached said predetermined value.
Claim 5
Independent Claim
136 words
A method for bonding a wire to a workpiece surface wherein the wire and/or the surface may have surface contamination which would interfere with the establishement of a good bond in a wire bonding apparatus having an ultrasonic transducer including a horn, a bonding wedge secured to the horn for supporting a wire against the surface, whereby operation of the transducer will result in rapid displacement between the wire and the surface, and means for sensing the deformation of the wire, comprising determining when there is a sharp increase in the deformation of the wire, operating the transducer at a high energy level until the sharp increase in the deformation of the wire is determined, and operating the transducer at a low energy level when a sharp increase in the deformation of the wire is determined.
Claim 6
Independent Claim
136 words
A method for bonding a wire to a workpiece surface wherein the wire and/or the surface may have surface contamination which would interfere with the establishement of a good bond in a wire bonding apparatus having an ultrasonic transducer including a horn, a bonding wedge secured to the horn for supporting a wire against the surface, whereby operation of the transducer will result in rapid displacement between the wire and the surface, and means for sensing the deformation of the wire, comprising determining when there is a sharp increase in the deformation of the wire, operating the transducer at a high energy level until the sharp increase in the deformation of the wire is determined, and operating the transducer at a low energy level when a sharp increase in the deformation of the wire is determined.
Claim 7
Dependent Claim
32 words
A wire bonding method according to claim 4, further comprising determining when wire deformation has reached a predetermined valve, and turning the transducer off when wire deformation has reached said predetermined value.
Claim 8
Dependent Claim
42 words
A wire bonding method according to claim 4, further comprising determining when wire deformation has reached a predetermined value, and operating the transducer at a level for tempering the bond between the wire and the surface when said predetermined value is reached.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-23 | 1997-11-22 | 1998-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-23 | 2001-11-22 | 2002-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-23 | 2005-11-22 | 2006-05-24 | $7700.00 | Window Closed / Lapsed |