US5302801A Expired / Lapsed US ⏱️ 0.0 years remaining

Laser bonding apparatus

Assignee: Mitsubishi Electric Corp

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Filing: 1993-05-25

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Granted: 1994-04-12

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Expires: 2013-05-25

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Abstract

Abstract A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7). The laser heating means (9) irradiates laser light (9a) through the atmosphere cover (1) to bonding agent (8) applied between a junction (6a) of the lead terminal (6) of the semiconductor device (5 ) and the junction (7a) of the printed circuit board (7), and heats and fuses the bonding agent (8) to bond both the junctions without touching the junctions thereof. Also, inside the atmosphere cover (1), atmosphere gas supplying means (1d), (1e), (1f) and (1g) are provided for supplying atmosphere gas, (4) which is employed for preventing oxidation in the bonding.

Inventors

👤 Makoto Kanda
👤 Masaharu Yoshida

Bibliographic Details

Application Number —

Jurisdiction US

Data Source google_patents

Last Synchronized 2026-11-03 01:14

CPC Classifications

B; B23; B23K; B23K26/00; B23K26/12; B23K26/123; B23K1/00; B23K1/005; B23K1/0056; B23K26/127; H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; B29; B29C; B29C66/00; B29C66/90; B29C66/91; B29C66/914; B29C66/9161; B29C66/94; B29C66/944; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/08; H05K2203/086; H05K2203/10; H05K2203/107; H05K3/3494; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144

Claims Analysis

Total Claims: 8

Claim 1

Independent Claim 114 words

A bonding apparatus comprising: a base for supporting a printed circuit board; an atmosphere cover which has a concavity covering a semiconductor device mounted on the printed circuit board and which is formed of laser light transmitting material; driving means for moving the atmosphere cover upwards and downwards related to the base; pressing means provided in the atmosphere cover for pressing the semiconductor device toward the printed circuit board; atmosphere gas supplying means for supplying atmosphere gas into the concavity; and laser heating means for irradiating laser light through the atmosphere cover to bonding agent applied on junctions of the semiconductor device and the printed circuit board and heating and fusing the bonding agent.

Claim 2

Dependent Claim 114 words

Claim 3

Dependent Claim 16 words

A bonding apparatus in accordance with claim 1, wherein said laser light transmitting material is quartz.

Claim 4

Dependent Claim 60 words

A bonding apparatus in accordance with claim 1, wherein said atmosphere cover has a vertical bore in its center, and said pressing means comprise a pressing weight moving up and down through the bore; a supporting shaft for supporting the pressing weight; and a linear motor provided in the atmosphere cover for applying pressing force downwards to the supporting shaft.

Claim 5

Dependent Claim 34 words

A bonding apparatus in accordance with claim 1, wherein said bore is tapered in its lower portion while said pressing weight has such contours that it fits in the tapered portion of the bore.

Claim 6

Dependent Claim 25 words

A bonding apparatus in accordance with claim 1, wherein said atmosphere gas is nitride gas or a mixed gas of nitride gas with hydrogen gas.

Claim 7

Dependent Claim 52 words

A bonding apparatus in accordance with claim 1, wherein said atmosphere cover has a gas conduit connecting the outside to said concavity, and said atmosphere gas supplying means comprises: a tube connected to said gas conduit; an electromagnetic valve connected to the tube; and a gas bomb connected to the electromagnetic valve.

Claim 8

Dependent Claim 35 words

A bonding apparatus in accordance with claim 1, further comprising control means for controlling the operation of each of said driving means, said pressing means, said atmosphere gas supplying means and said laser heating means.

References Cited (Backward Citations)

US3304403A Cited

US3383491A Cited

US3463898A Cited

DE3238350A1 Cited

DE3701013A1 Cited

JPS63284892A Cited

JPH0268496A Cited

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USPTO Annuity & Maintenance Windows

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1997-04-11	1997-10-11	1998-04-12	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2001-04-11	2001-10-11	2002-04-12	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2005-04-11	2005-10-11	2006-04-12	$7700.00	Window Closed / Lapsed

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