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US5298058A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroless copper plating bath

Assignee: C Uyemura & Co Ltd
•
Filing: 1992-11-30
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Granted: 1994-03-29
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Expires: 2012-11-30
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Abstract

Abstract An electroless copper plating bath comprises a water soluble copper salt, a complexing agent, and a reducing agent consisting of phosphorous acid or a phosphite. As compared with conventional acidic bath using hypophosphorous acid, the bath is less expensive while depositing a uniform copper film at equivalent efficiency.

Inventors

  • 👤 Fujio Matsui
  • 👤 Yasuyuki Yamamoto

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 00:46
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 35 words
An electroless copper plating bath comprising in water a water soluble salt of copper a complexing agent, and a reducing agent consisting of a phosphorous acid or a phosphite, said bath having an acidic pH.
Claim 2
Dependent Claim 35 words
An electroless copper plating bath comprising in water a water soluble salt of copper a complexing agent, and a reducing agent consisting of a phosphorous acid or a phosphite, said bath having an acidic pH.
Claim 3
Dependent Claim 43 words
The bath of claim 1 which contains about 0.02 to abut 0.1 mol/liter of the copper salt, at least about 1 mol of the complexing agent per mol of the copper salt, and about 0.02 to about 0.2 mol/liter of the reducing agent.
Claim 4
Dependent Claim 13 words
The bath of claim 1, wherein the pH thereof is 4 to 6.4.
Claim 5
Dependent Claim 43 words
The bath of claim 3 which contains about 0.02 to about 0.1 mol/liter of the copper salt, at least about 1 mol of the complexing agent per mol of the copper salt, and about 0.02 to about 0.2 mol/liter of the reducing agent.

References Cited (Backward Citations)

US2965551A Cited
US3615736A Cited
US4482596A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-03-28 1997-09-27 1998-03-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-03-28 2001-09-27 2002-03-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-03-28 2005-09-27 2006-03-29 $7700.00 Window Closed / Lapsed

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