← Back to Patent Explorer
US5297364A Expired / Lapsed US ⏱️ 0.0 years remaining

Polishing pad with controlled abrasion rate

Assignee: Micron Technology Inc
•
Filing: 1991-10-09
•
Granted: 1994-03-29
•
Expires: 2011-10-09
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A polishing pad is provided, having its face shaped to produce controlled nonuniform removal of material from a workpiece. Non-uniformity is produced as a function of distance from the pad's rotational axis (the working radius). The pad face is configured with both raised, contact regions and voided, non-contact regions such that arcuate abrasive contact varies nonuniformly as a function of distance from the pad's rotational axis. Void density at any distance may be produced by several techniques such as varying void size as a function of working radius or varying the number of voids per unit area as a function of working radius. Either technique produces variation in voided area per total unit area for rings of pad surface concentric with the rotational axis having infintesimally small width.

Inventors

  • 👤 Mark E. Tuttle

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 15:59
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/11; B24B37/20; B24B37/26; B24B13/00; B24B13/01; B24B7/00; B24B7/20; B24B7/22; B24B7/228; B24D; B24D11/00; Y; Y10; Y10S; Y10S451/00; Y10S451/921

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 83 words
A polishing pad rotatable about a central axis, said pad having a circular, planar face perpendicular to said axis, said face to be brought in spinning contact with a workpiece during a polishing operation, said face comprising both raised and voided regions, said raised and voided regions being configured so as to produce a controlled nonuniform rate of material removal from said workpiece, said rate of material removal being a non-linear function of distance from the pad's rotational axis to a working radius.
Claim 2
Dependent Claim 83 words
A polishing pad rotatable about a central axis, said pad having a circular, planar face perpendicular to said axis, said face to be brought in spinning contact with a workpiece during a polishing operation, said face comprising both raised and voided regions, said raised and voided regions being configured so as to produce a controlled nonuniform rate of material removal from said workpiece, said rate of material removal being a non-linear function of distance from the pad's rotational axis to a working radius.
Claim 3
Dependent Claim 29 words
The polishing pad of claim 1, wherein high material removal rates correspond to bands of low void density and low removal rates correspond to bands of high void density.
Claim 4
Dependent Claim 15 words
The polishing pad of claim 2, wherein said voids are recessed regions within said face.
Claim 5
Dependent Claim 17 words
The polishing pad of claim 2, wherein said voids are holes which extend entirely through the pad.
Claim 6
Dependent Claim 10 words
The apparatus of claim 2, wherein said voids are circular.

References Cited (Backward Citations)

CA679731A Cited
US816461A Cited
GB190726287A Cited
US959054A Cited
US3468079A Cited
US4821461A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-03-28 1997-09-27 1998-03-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-03-28 2001-09-27 2002-03-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-03-28 2005-09-27 2006-03-29 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag