US5296734A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor integrated circuit having silicon nitride provided as insulator of capacitor
Assignee: NEC Corp
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Filing: 1992-06-22
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Granted: 1994-03-22
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Expires: 2012-06-22
Abstract
Abstract An integrated circuit comprises a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another by a PN junction, an interlayer insulating film formed to substantially cover the principal surface of the substrate, and a capacitor formed in a selected one of the islands and having a dielectric layer which is formed within an opening formed in the interlayer insulating film above the selected island. The dielectric layer is constituted of a multilayer film including a silicon oxide film and a silicon nitride film extending to cover the interlayer insulating film. A power supply line conductor is formed on the interlayer insulating film, and the silicon nitride film is completely removed from a portion of the interlayer insulating film directly under the power supply line conductor.
Inventors
- 👤 Megumi Satoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:08
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/60; H10D84/611; H10D84/613; H10D84/615
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
120 words
An integrated circuit comprising a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another, an interlayer insulating film formed to substantially cover said principal surface of said substrate, a capacitor formed in a selected one of said islands and having a dielectric layer which is formed within an opening formed in said interlayer insulating film above said selected island, said dielectric layer including a silicon nitride film, and a power supply line conductor formed on said interlayer insulating film without intermediary of said silicon nitride film, said silicon nitride film extending to cover all the surface of said interlayer insulating film excluding an area under said power supply line conductor.
Claim 2
Dependent Claim
120 words
An integrated circuit comprising a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another, an interlayer insulating film formed to substantially cover said principal surface of said substrate, a capacitor formed in a selected one of said islands and having a dielectric layer which is formed within an opening formed in said interlayer insulating film above said selected island, said dielectric layer including a silicon nitride film, and a power supply line conductor formed on said interlayer insulating film without intermediary of said silicon nitride film, said silicon nitride film extending to cover all the surface of said interlayer insulating film excluding an area under said power supply line conductor.
Claim 3
Dependent Claim
155 words
An integrated circuit comprising a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another, an interlayer insulating film formed to substantially cover said principal surface of said substrate, a capacitor formed in a selected one of said islands and having a dielectric layer which is formed within an opening formed in said interlayer insulating film above said selected island, said dielectric layer including a silicon nitride film extending to cover said interlayer insulating film, and a power supply line conductor formed on said interlayer insulating film without intermediary of said silicon nitride film, wherein said dielectric layer is formed of a multilayer film including a silicon oxide film and said silicon nitride film, both of which substantially extend to cover said interlayer insulating film, and said power supply line conductor is formed on said interlayer insulating film with intermediary of only said silicon oxide film.
Claim 4
Dependent Claim
155 words
An integrated circuit comprising a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another, an interlayer insulating film formed to substantially cover said principal surface of said substrate, a capacitor formed in a selected one of said islands and having a dielectric layer which is formed within an opening formed in said interlayer insulating film above said selected island, said dielectric layer including a silicon nitride film extending to cover said interlayer insulating film, and a power supply line conductor formed on said interlayer insulating film without intermediary of said silicon nitride film, wherein said dielectric layer is formed of a multilayer film including a silicon oxide film and said silicon nitride film, both of which substantially extend to cover said interlayer insulating film, and said power supply line conductor is formed on said interlayer insulating film with intermediary of only said silicon oxide film.
Claim 5
Dependent Claim
58 words
An integrated circuit claimed in claim 1, wherein said dielectric layer is formed of a multilayer film including a silicon oxide film and said silicon nitride film, both of which extend to cover said interlayer insulating film, and said power supply line conductor is formed on said interlayer insulating film also without intermediary of said silicon oxide film.
References Cited (Backward Citations)
US4612563A
Cited
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| 3.5 Years (Year 4) | 1997-03-21 | 1997-09-20 | 1998-03-22 | $2000.00 | Window Closed / Lapsed |
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