Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
261 words
An integrated-circuit package comprising: (a) a semiconductor integrated-circuit die having two major faces, a top face and a bottom face, said die having at least one electrical circuit ground terminal on the top face and at least one electrical signal terminal on the top face, (b) a lead frame comprising: (i) a die-attach pad, having a top face, a bottom face, a front side, a back side, a right side, and a left side, the bottom die face of the die being bonded to the top face of said die-attach pad to provide a physical and thermal connection between said die and said pad, (ii) at least one ground lead extending away from the front side of said die-attach pad, said lead having a proximal end attached to said pad and a distal end, and (iii) at least one ground wing, separate from the ground lead, and extending from said pad, said wing having a proximal end attached to said pad, a distal end, and a contact surface spaced from the proximal end of the wing, (c) at least one wire forming a direct electrical connection between the contact surface of said ground wing and said electrical ground terminal on said top die face, and (d) a solid electrically insulating body encapsulating said die, the proximal end of said ground lead, the distal end of said ground wing, and said at least one wire, so that said ground lead is enabled to function as heat-sink ground tab conducting heat and electrical current from said die to the outside of said body.
Claim 2
Dependent Claim
261 words
An integrated-circuit package comprising: (a) a semiconductor integrated-circuit die having two major faces, a top face and a bottom face, said die having at least one electrical circuit ground terminal on the top face and at least one electrical signal terminal on the top face, (b) a lead frame comprising: (i) a die-attach pad, having a top face, a bottom face, a front side, a back side, a right side, and a left side, the bottom die face of the die being bonded to the top face of said die-attach pad to provide a physical and thermal connection between said die and said pad, (ii) at least one ground lead extending away from the front side of said die-attach pad, said lead having a proximal end attached to said pad and a distal end, and (iii) at least one ground wing, separate from the ground lead, and extending from said pad, said wing having a proximal end attached to said pad, a distal end, and a contact surface spaced from the proximal end of the wing, (c) at least one wire forming a direct electrical connection between the contact surface of said ground wing and said electrical ground terminal on said top die face, and (d) a solid electrically insulating body encapsulating said die, the proximal end of said ground lead, the distal end of said ground wing, and said at least one wire, so that said ground lead is enabled to function as heat-sink ground tab conducting heat and electrical current from said die to the outside of said body.
Claim 3
Dependent Claim
33 words
The integrated-circuit package of claim 1, wherein the point of attachment of said wire to said ground wing lies on a top-surface of said wing near the distal end of said ground wing.
Claim 4
Dependent Claim
27 words
The integrated-circuit package of claim 1, wherein the point of attachment of said wing to said pad lies on one of the side edges of the pad.
Claim 5
Dependent Claim
40 words
The integrated-circuit package of claim 1, wherein the wing has a distal portion adjacent the distal end of the wing, said distal portion having a top surface, and said at least one wire is electrically connected to the top surface.
Claim 6
Dependent Claim
33 words
The integrated-circuit package of claim 1, wherein a top face of said die and said top face of said contact surface of said distal end of said wing lie approximately in one plane.
Claim 7
Dependent Claim
39 words
The integrated-circuit package of claim 1, wherein the wing includes a standup portion which routes the wing from the point where its proximal end contacts the pad approximately up to the plane of the top face of the die.
Claim 8
Dependent Claim
11 words
The integrated-circuit package of claim 1, wherein two wings are provided.
Claim 9
Dependent Claim
19 words
The integrated-circuit package of claim 1, wherein two wings are provided and attached to opposite edges of the pad.
Claim 10
Dependent Claim
35 words
The integrated-circuit package of claim 1, additionally comprising a plurality of conductive wire forming electrical connections between said proximal ends of some of said leads and several circuit terminals, respectively, on said top die face.